The morphology and microstructure of flow pattern defects （FPDs） in lightly boron-doped Czochralski-grown silicon （Cz-Si） crystals were investigated using optical microscopy and atomic force microscopy. The experi...The morphology and microstructure of flow pattern defects （FPDs） in lightly boron-doped Czochralski-grown silicon （Cz-Si） crystals were investigated using optical microscopy and atomic force microscopy. The experimental results showed that the morphology of FPDs was parabola-like with several steps. Single-type and dual-type voids were found on the tip of FPDs and two heaves exist on the left and right sides of the void. All the results have proved that FPDs were void-type defects. These results are very useful to investigate FPDs in Cz-Si wafers further and explain the annihilation of FPDs during high-temperature annealing.展开更多
The morphology and microstructure of flow pattern defects (FPDs) in lightly boron-doped Czochralski-grown silicon (Cz-Si) crystals were investigated using optical microscopy and atomic force microscopy. The experiment...The morphology and microstructure of flow pattern defects (FPDs) in lightly boron-doped Czochralski-grown silicon (Cz-Si) crystals were investigated using optical microscopy and atomic force microscopy. The experimental results showed that the morphology of FPDs was parabola-like with several steps. Single-type and dual-type voids were found on the tip of FPDs and two heaves exist on the left and right sides of the void. All the results have proved that FPDs were void-type defects. These results are very useful to investigate FPDs in Cz-Si wafers further and explain the annihilation of FPDs during high-temperature annealing.展开更多
The <100> textured growth of diamond film on HF eroded silicon wafer has been studied by HFCVD. The evolution of grain size and sudece morphology vs deposition time is presented and the <100> textured thic...The <100> textured growth of diamond film on HF eroded silicon wafer has been studied by HFCVD. The evolution of grain size and sudece morphology vs deposition time is presented and the <100> textured thick diamond film (80μm) with smooth surface, desirable for practical application in many fields is obtained展开更多
As a virtual experimental device for analysis and calculation of grown-in microdefects formation in undoped silicon dislocation-free single crystals the software is proposed. The software is built on the basis on diff...As a virtual experimental device for analysis and calculation of grown-in microdefects formation in undoped silicon dislocation-free single crystals the software is proposed. The software is built on the basis on diffusion model of formation, growth and coalescence of grown-in microdefects. Diffusion model describes kinetics of defect structure changes during cooling after growth on crystallization temperature to room temperature. The software allows the use of personal computer to investigate the defect structure of dislocation-free silicon single crystals with a diameter on 30 mm to 400 mm grown by floating-zone and Czochralski methods.展开更多
Oxygen precipitation within the magic denuded zone （MDZ） founded by rapid thermal processing in Czochralski silicon （CZ-Si） wafers is investigated. After the standard MDZ process, the CZ-Si wafers are further subj...Oxygen precipitation within the magic denuded zone （MDZ） founded by rapid thermal processing in Czochralski silicon （CZ-Si） wafers is investigated. After the standard MDZ process, the CZ-Si wafers are further subjected to two specific oxygen precipitation annealing, respectively. It is found that the MDZs in CZ-Si wafers shrunk notably because oxygen precipitation occurs within the MDZs. However, a width of substantial DZ still remains within the wafer. Therefore, it is believed that the outer region of the MDZs, which corresponds to the oxygen denuded zone formed in the course of rapid thermal process and high temperature annealing, is a substantial defect-free zone which acts as the active area for semiconductor devices.展开更多
In this paper, a complementary metal-oxide semiconductor （CMOS）-compatible silicon substrate optimization technique is proposed to achieve effective isolation. The selective growth of porous silicon is used to effec...In this paper, a complementary metal-oxide semiconductor （CMOS）-compatible silicon substrate optimization technique is proposed to achieve effective isolation. The selective growth of porous silicon is used to effectively suppress the substrate crosstalk. The isolation structures are fabricated in standard CMOS process and then this post-CMOS substrate optimization technique is carried out to greatly improve the performances of crosstalk isolation. Three-dimensional electro-magnetic simulation is implemented to verify the obvious effect of our substrate optimization technique. The morphologies and growth condition of porous silicon fabricated have been investigated in detail. Furthermore, a thick selectively grown porous silicon （SGPS） trench for crosstalk isolation has been formed and about 20dB improvement in substrate isolation is achieved. These results demonstrate that our post-CMOS SGPS technique is very promising for RF IC applications.展开更多
基金This work was financially supported by the National Natural Science Foundation of China (No. 60076001 and No.50032010), the Natural Science Foundation of Tianjin (No. 043602511) and the Natural Science Foundation of Hebei Province of China (No. E2005000057).
文摘The morphology and microstructure of flow pattern defects （FPDs） in lightly boron-doped Czochralski-grown silicon （Cz-Si） crystals were investigated using optical microscopy and atomic force microscopy. The experimental results showed that the morphology of FPDs was parabola-like with several steps. Single-type and dual-type voids were found on the tip of FPDs and two heaves exist on the left and right sides of the void. All the results have proved that FPDs were void-type defects. These results are very useful to investigate FPDs in Cz-Si wafers further and explain the annihilation of FPDs during high-temperature annealing.
文摘The morphology and microstructure of flow pattern defects (FPDs) in lightly boron-doped Czochralski-grown silicon (Cz-Si) crystals were investigated using optical microscopy and atomic force microscopy. The experimental results showed that the morphology of FPDs was parabola-like with several steps. Single-type and dual-type voids were found on the tip of FPDs and two heaves exist on the left and right sides of the void. All the results have proved that FPDs were void-type defects. These results are very useful to investigate FPDs in Cz-Si wafers further and explain the annihilation of FPDs during high-temperature annealing.
基金Acknowledgments This work is supported by the open research fund of Key Laboratory of MEMS of Ministry of Education, Southeast University, Natural Science Foundation of China （No.60876078）.
文摘The <100> textured growth of diamond film on HF eroded silicon wafer has been studied by HFCVD. The evolution of grain size and sudece morphology vs deposition time is presented and the <100> textured thick diamond film (80μm) with smooth surface, desirable for practical application in many fields is obtained
文摘As a virtual experimental device for analysis and calculation of grown-in microdefects formation in undoped silicon dislocation-free single crystals the software is proposed. The software is built on the basis on diffusion model of formation, growth and coalescence of grown-in microdefects. Diffusion model describes kinetics of defect structure changes during cooling after growth on crystallization temperature to room temperature. The software allows the use of personal computer to investigate the defect structure of dislocation-free silicon single crystals with a diameter on 30 mm to 400 mm grown by floating-zone and Czochralski methods.
基金Supported by the National Natural Science Foundation of China under Grant Nos 90207024 and 60225010, the National High Technology Development Program of China under Grant No 2004AA3Z1142, and the Program for New Century Excellent Talents in Universities of China.
文摘Oxygen precipitation within the magic denuded zone （MDZ） founded by rapid thermal processing in Czochralski silicon （CZ-Si） wafers is investigated. After the standard MDZ process, the CZ-Si wafers are further subjected to two specific oxygen precipitation annealing, respectively. It is found that the MDZs in CZ-Si wafers shrunk notably because oxygen precipitation occurs within the MDZs. However, a width of substantial DZ still remains within the wafer. Therefore, it is believed that the outer region of the MDZs, which corresponds to the oxygen denuded zone formed in the course of rapid thermal process and high temperature annealing, is a substantial defect-free zone which acts as the active area for semiconductor devices.
基金supported by the Major Program of the National Natural Science Foundation of China (Grant No 60625403)the Collaborative Project between Intel Corporation and Peking University
文摘In this paper, a complementary metal-oxide semiconductor （CMOS）-compatible silicon substrate optimization technique is proposed to achieve effective isolation. The selective growth of porous silicon is used to effectively suppress the substrate crosstalk. The isolation structures are fabricated in standard CMOS process and then this post-CMOS substrate optimization technique is carried out to greatly improve the performances of crosstalk isolation. Three-dimensional electro-magnetic simulation is implemented to verify the obvious effect of our substrate optimization technique. The morphologies and growth condition of porous silicon fabricated have been investigated in detail. Furthermore, a thick selectively grown porous silicon （SGPS） trench for crosstalk isolation has been formed and about 20dB improvement in substrate isolation is achieved. These results demonstrate that our post-CMOS SGPS technique is very promising for RF IC applications.
文摘采用P型单晶硅片为衬底,并经混合酸溶液腐蚀抛光、清洗后,利用射频磁控溅射镀膜系统在其表面制备非晶硅薄膜;再结合快速光热退火工艺,于N2气氛下480℃退火30 min,得到晶化硅薄膜;利用光学金相显微镜、XRD衍射仪和拉曼散射光谱(Raman)仪对单晶硅衬底和晶化硅薄膜进行结构和性能表征。研究了混合酸溶液对单晶硅表面腐蚀效果、籽晶诱导外延生长晶化硅薄膜的物相结构和薄膜带隙。结果表明:采用混合酸溶液腐蚀后得到表面平整、光滑的单晶硅衬底;非晶硅薄膜经过快速退火后受籽晶诱导生成晶化硅薄膜,其晶相沿单晶硅衬底取向择优生长;随着非晶硅薄膜厚度从80 nm增加到280 nm,晶化后硅薄膜的表面粗糙度逐渐减小,晶化率从90.0%逐渐降低到37.0%;晶粒尺寸从6.65 nm逐渐减小到1.71 nm;带隙从1.18 e V逐渐升高到1.52 e V。
