基于滤波器设计方法的GaN-on-Si毫米波单刀双掷开关

基于滤波器的设计方法,实现了一款适用于毫米波通信的宽频带单刀双掷(SPDT)开关。为了实现宽频带和低插入损耗,采用100 nm GaN-on-Si HEMT器件及行波式开关设计方法,同时采用四枝节的结构,实现对射频信号的全反射,以此获得更高的隔离度。在0 V和-15 V的栅偏置电压下,在室温环境中测试的结果表明:在30~44 GHz频带内,SPDT开关具有良好的回波损耗,其插入损耗低于1.5 dB,隔离度高于34 dB,并且在36 GHz下的输入1 dB功率压缩点优于39.2 dBm。芯片面积为1.7 mm×1.2 mm。

GaN-on-Si blue/white LEDs:epitaxy,chip,and package

The dream of epitaxially integrating III-nitride semiconductors on large diameter silicon is being fulfilled through the joint R＆D efforts of academia and industry, which is driven by the great potential of Ga N-onsilicon technology in improving the efficiency yet at a much reduced manufacturing cost for solid state lighting and power electronics. It is very challenging to grow high quality Ga N on Si substrates because of the huge mismatch in the coefficient of thermal expansion（CTE） and the large mismatch in lattice constant between Ga N and silicon, often causing a micro-crack network and a high density of threading dislocations（TDs） in the Ga N film.Al-composition graded Al Ga N/Al N buffer layers have been utilized to not only build up a compressive strain during the high temperature growth for compensating the tensile stress generated during the cool down, but also filter out the TDs to achieve crack-free high-quality n-Ga N film on Si substrates, with an X-ray rocking curve linewidth below 300 arcsec for both（0002） and（10N12） diffractions. Upon the Ga N-on-Si templates, prior to the deposition of p-Al Ga N and p-Ga N layers, high quality In Ga N/Ga N multiple quantum wells（MQWs） are overgrown with well-engineered V-defects intentionally incorporated to shield the TDs as non-radiative recombination centers and to enhance the hole injection into the MQWs through the via-like structures. The as-grown Ga N-on-Si LED wafers are processed into vertical structure thin film LED chips with a reflective p-electrode and the N-face surface roughened after the removal of the epitaxial Si（111） substrates, to enhance the light extraction efficiency. We have commercialized Ga N-on-Si LEDs with an average efficacy of 150–160 lm/W for 1mm^2 LED chips at an injection current of 350 m A, which have passed the 10000-h LM80 reliability test. The as-produced Ga N-on-Si LEDs featured with a single-side uniform emission and a nearly Lambertian distribution can adopt the wafer-level phosphor coating procedure, and are suitable for directional lighting, camera flash, streetlighting, automotive headlamps, and otherlighting applications.

A review on the GaN-on-Si power electronic devices

The past decades have witnessed a tremendous development of GaN-based power electronic devices grown on Si substrate.This article provides a concise introduction,review,and outlook of the research developments of GaN-on-Si power device technology.The comprehensive review has discussed the crucial issues in the state-of-the-art device technology based on both GaN materials epitaxy including stress control and point defects study,and device fabrication including normally offsolutions like Cascode,trench MIS-gate,and p-GaN gate.Device reliability and other common fabrication issues in GaN high electron mobility transistors(HEMTs)are also discussed.Lastly,we give an outlook on the GaN-on-Si power devices from two aspects,namely high frequency,and high power GaN ICs,and GaN vertical power devices.

IMEC和Veeco合作力图降低GaN-on-Si生产成本

比利时纳米电子研究中心IMEC与Veeco正在进行项目合作,旨在降低生产硅基氮化镓(GaN-on-Si)功率器件和LED的成本。IMEC的首席科学家BarunDutta评论说,"VeecoMOCVD设备的生产力,可重复性,均匀性和晶体质量为我们在硅基氮化镓和LED应用的发展里程碑上起到了重要作用。启用该设备性能外延已经帮助我们实现最先进的D-模式(耗尽模式)和E-模式(增强模式)功率器件。我们的目标是建立一个完整的生产基础设施,使硅基氮化镓成为具备竞争力的技术。"

MACOM推出具有安装灵活性,10W宽带,多级GaN-on-Si功率放大器模块

高性能模拟射频、微波、毫米波和光波半导体产品的领先供应商MACOMTechnology Solutions Inc.('MACOM')推出了MAMG-100227-010宽带功率放大器模块,扩展了硅基氮化镓(GaN-on-Si)功率放大器产品组合。该模块可以优化用于陆地移动无线电(LMR)系统,无线公共安全通信和军事战术通信和电子对抗(ECM)。MAMG-100227-010具有顶侧和底侧安装可配置性的两级PA架构。

Electrical properties of MOCVD-grown GaN on Si (111) substrates with low-temperature AlN interlayers

The electrical properties of the structure of GaN grown on an Si （111） substrate with low-temperature （LT） A1N interlayers by metal-organic chemical-vapour deposition are investigated. An abnormal P-type conduction is observed in our GaN-on-Si structure by Hall effect measurement, which is mainly due to the A1 atom diffusing into the Si substrate and acting as an acceptor dopant. Meanwhile, a constant n-type conduction channel is observed in LT-A1N, which causes a conduction-type conversion at low temperature （50 K） and may further influence the electrical behavior of this structure.

Light output improvement of GaN-based light-emitting diodes grown on Si (111) by a via-thin-film structure

This work reports the fabrication of via-thin-film light-emitting diode （via-TF-LED） to improve the light output power （LOP） of blue/white GaN-based LEDs grown on Si （111） substrates. The as-fabricated via-TF-LEDs were featured with a roughened n-GaN surface and the p-GaN surface bonded to a wafer carrier with a silver-based reflective electrode, together with an array of embedded n-type via pillar metal contact from the p-GaN surface etched through the multiple-quantum-wells （MQWs） into the n-GaN layer. When operated at 350 mA, the via-TF- LED gave an enhanced blue LOP by 7.8% and over 3.5 times as compared to the vertical thin-film LED （TF-LED） and the conventional lateral structure LED （LS-LED）. After covering with yellow phosphor that converts some blue photons into yellow light, the via-TF-LED emitted an enhanced white luminous flux by 13.5% and over 5 times, as compared with the white TF-LED and the white LS-LED, respectively. The significant LOP improve- ment of the via-TF-LED was attributed to the elimination of light absorption by the Si （111） epitaxial substrate and the finger-like n-electrodes on the roughened emitting surface.