As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans ...As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as vari- ous fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.展开更多
The thermal conduction behavior of the three-dimensional axisymmetric functionally graded circular plate was studied under thermal loads on its top and bottom surfaces. Material properties were taken to be arbitrary d...The thermal conduction behavior of the three-dimensional axisymmetric functionally graded circular plate was studied under thermal loads on its top and bottom surfaces. Material properties were taken to be arbitrary distribution functions of the thickness. A temperature function that satisfies thermal boundary conditions at the edges and the variable separation method were used to reduce equation governing the steady state heat conduction to an ordinary differential equation (ODE) in the thickness coordinate which was solved analytically. Next, resulting variable coefficients ODE due to arbitrary distribution of material properties along thickness coordinate was also solved by the Peano-Baker series. Some numerical examples were given to demonstrate the accuracy, efficiency of the present model, mad to investigate the influence of different distributions of material properties on the temperature field. The numerical results confirm that the influence of different material distributions, gradient indices and thickness of plate to temperature field in plate can not be ignored.展开更多
In this paper,using the fractional Fourier law,we obtain the fractional heat conduction equation with a time-fractional derivative in the spherical coordinate system.The method of variable separation is used to solve ...In this paper,using the fractional Fourier law,we obtain the fractional heat conduction equation with a time-fractional derivative in the spherical coordinate system.The method of variable separation is used to solve the timefractional heat conduction equation.The Caputo fractional derivative of the order 0 〈 α≤ 1 is used.The solution is presented in terms of the Mittag-Leffler functions.Numerical results are illustrated graphically for various values of fractional derivative.展开更多
In engineering and technology, the following problem is often touched upon A certain portion of a plate with finite thickness is heated on its surface, so that the heat flux along the surface is distributed nonuniform...In engineering and technology, the following problem is often touched upon A certain portion of a plate with finite thickness is heated on its surface, so that the heat flux along the surface is distributed nonuniformly and varying with time. For this kind of heal conduction, there is no available analytical solution given in existing treatises concerning heat conduction. This paper presents an analytical solution of this problem, its calculation results are in good agreement with the experimental data.展开更多
The correlations between thermal and physical properties were studied through thermal conductivity measurements, hardness tests, salt spray tests (AASS) among the surface treatment samples named K20, K40 with thicknes...The correlations between thermal and physical properties were studied through thermal conductivity measurements, hardness tests, salt spray tests (AASS) among the surface treatment samples named K20, K40 with thickness of 20, 40 μm respectively and raw sample named K00. In thermal conductivity measurements, there are little differences among the samples as K00, K20 and K40, they exhibit 153.39, 150.69 and 149.76 W/(m·K), respectively. According to hardness tests, K00, K20 and K40 exhibit 87.9, 259.7 and 344.8 in Vickers values. In the result of salt spray tests to examine the effects on corrosion resistance, K00, K20 and K40 exhibit the grade of 3?5, 2.0?9.8 and 10, respectively. The mutual relation of the above results was analyzed. It is found that the surface treatments do not affect the thermal conductivity of aluminum and result in the improvement of physical properties. As a result of the technology, the surface improvement of aluminum alloy specimen is achieved without thermal degradation. It validates the ability of the aluminum plate heat exchangers with surface treatment to enhance the corrosion resistance. Present work is performed as the first fundamental threshold in the process of aluminum plate heat exchangers development to check out its possibility, therefore the next step-experimental and numerical study of practical aluminum plate heat exchangers will be made.展开更多
The smoothing thin plate spline (STPS) interpolation using the penalty function method according to the optimization theory is presented to deal with transient heat conduction problems. The smooth conditions of the ...The smoothing thin plate spline (STPS) interpolation using the penalty function method according to the optimization theory is presented to deal with transient heat conduction problems. The smooth conditions of the shape functions and derivatives can be satisfied so that the distortions hardly occur. Local weak forms are developed using the weighted residual method locally from the partial differential equations of the transient heat conduction. Here the Heaviside step function is used as the test function in each sub-domain to avoid the need for a domain integral. Essential boundary conditions can be implemented like the finite element method (FEM) as the shape functions possess the Kronecker delta property. The traditional two-point difference method is selected for the time discretization scheme. Three selected numerical examples are presented in this paper to demonstrate the availability and accuracy of the present approach comparing with the traditional thin plate spline (TPS) radial basis functions.展开更多
This paper deals with the determination of temperature distribution and thermal deflection function of a thin circular plate with the stated conditions. The transient heat conduction equation is solved by using Marchi...This paper deals with the determination of temperature distribution and thermal deflection function of a thin circular plate with the stated conditions. The transient heat conduction equation is solved by using Marchi-Zgrablich transform and Laplace transform simultaneously and the results of temperature distribution and thermal deflection function are obtained in terms of infinite series of Bessel function and it is solved for special case by using Mathcad 2007 software and represented graphically by using Microsoft excel 2007.展开更多
该文分析了膨胀石墨双极板(EGBPs)各向异性结构对燃料电池水热管理与输出性能的影响。建立了三维两相非等温数值模型,对比了4种典型复合材料结构下温度、电流密度、水含量等参数的分布特征,揭示了双极板传热特性与输出性能的耦合效应。...该文分析了膨胀石墨双极板(EGBPs)各向异性结构对燃料电池水热管理与输出性能的影响。建立了三维两相非等温数值模型,对比了4种典型复合材料结构下温度、电流密度、水含量等参数的分布特征,揭示了双极板传热特性与输出性能的耦合效应。结果表明:沿质子传递方向热导率(k_z)对燃料电池性能具有显著影响,在2.2 A cm^(-2)电流密度下,将k_z从常规结构的5 W·m^(-1)·K^(-1)提升至280 W·m^(-1)·K^(-1),可以使输出性能提高22 m V;沿流道气体流动方向的热导率(k_y)是影响散热能力的关键因素,将k_y与k_z提高至280 W·m^(-1)·K^(-1),或者实现各向同性结构(k_x=k_y=k_z=20 W·m^(-1)·K^(-1)),均能够使膜电极组件(MEA)核心区域的温度降低2℃左右。因此,提高k_y与k_z并实现各向同性结构是膨胀石墨双极板技术的未来发展目标之一。展开更多
Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing u...Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.展开更多
In this study, integral operational methods are used to investigate the thermally induced transverse vibration of a thin elliptic annulus plate with elastic supports at both radial boundaries.The axisymmetric temperat...In this study, integral operational methods are used to investigate the thermally induced transverse vibration of a thin elliptic annulus plate with elastic supports at both radial boundaries.The axisymmetric temperature distribution is determined by the heat conduction differential equation and its corresponding boundary conditions by employing a unified integral transform technique by use of Mathieu functions and modified Mathieu functions. The solution of thermally induced vibration of the plate with both ends encased with elastic supports is obtained by employing an integral transform for double Laplace differential equation. The thermal moment is derived on the basis of temperature distribution, and its stresses are obtained based on resultant bending moments per unit width. The numerical calculations of the distributions of the transient temperature and its associated stress distributions are shown in the figures.展开更多
This new work aims to develop a full coupled thermomechanical method including both the temperature profile and displacements as primary unknowns of the model.This generic full coupled 3D exact shell model permits the...This new work aims to develop a full coupled thermomechanical method including both the temperature profile and displacements as primary unknowns of the model.This generic full coupled 3D exact shell model permits the thermal stress investigation of laminated isotropic,composite and sandwich structures.Cylindrical and spherical panels,cylinders and plates are analyzed in orthogonal mixed curved reference coordinates.The 3D equilibrium relations and the 3D Fourier heat conduction equation for spherical shells are coupled and they trivially can be simplified in those for plates and cylindrical panels.The exponential matrix methodology is used to find the solutions of a full coupled model based on coupled differential relations with respect to the thickness coordinate.The analytical solution is based on theories of simply supported edges and harmonic relations for displacement components and sovra-temperature.The sovra-temperature magnitudes are directly applied at the outer faces through static state hypotheses.As a consequence,the sovra-temperature description is assumed to be an unknown variable of themodel and it is calculated in the sameway as the three displacements.The final systemis based on a set of coupled homogeneous differential relations of second order in the thickness coordinate.This system is reduced in a first order differential relation system by redoubling the number of unknowns.Therefore,the exponential matrix methodology is applied to calculate the solution.The temperature field effects are evaluated in the static investigation of shells and plates in terms of displacement and stress components.After an appropriate preliminary validation,new benchmarks are discussed for several thickness ratios,geometrical data,lamination sequences,materials and sovra-temperature values imposed at the outer faces.Results make evident the accordance between the uncoupled thermo-mechanical model and this new full coupled thermo-mechanical model without the need to separately solve the Fourier heat conduction relation.Both effects connected with the thickness layer and the related embedded materials are included in the conducted thermal stress analysis.展开更多
The heat-transfer behaviour of the conduction cold plate system used for avionics is investigated in this paper. The steady-state temperature profile for the cold plate is derived and the relationship between the cool...The heat-transfer behaviour of the conduction cold plate system used for avionics is investigated in this paper. The steady-state temperature profile for the cold plate is derived and the relationship between the coolant mass flowrate, the heat load and the hashest cold plate temperature is established.A model is proposed to describe the transient thermal rosponse of the cold plate under thermal shock condition. The analytic solution of the transient heat transfer within the cold plate is provided. The results of this paper agree with those of the finite element method and can be used for the structural design and performance evaluation of cold plate system.展开更多
文摘As telecommunication and RF power electronics applications continue to push the envelope of waste heat dissipation, more and more, we see a need for active thermal control employing forced air electronic cooling fans in unison with pumped fluid loops in order to meet temperature and performance requirements. This research paper presents results of applying Computational Fluid Dynamics (CFD) commercial industry STAR-CCM+ software for heat transfer and fluid flow simulation of a novel heat exchanger/cold plate fabricated from k-core high thermal conductivity material in order to realize thermal control system hardware design for very much applications to very large power density (~1 kW/m2) electronics packaging scenarios. Trade studies involving different heat exchanger/cold plate materials, as well as vari- ous fault scenarios within a mock-up of a typical electronics system, are used to illustrate the upper bounds placed on the convective heat transfer coefficient. Agreement between our present findings and previous research in the field of electronics cooling is presented herein.
基金Project(11102136)supported by the National Natural Science Foundation of ChinaProject(2012ZDK04)supported by the Open Project of Guangxi Key Laboratory of Disaster Prevention and Structural Safety,China
文摘The thermal conduction behavior of the three-dimensional axisymmetric functionally graded circular plate was studied under thermal loads on its top and bottom surfaces. Material properties were taken to be arbitrary distribution functions of the thickness. A temperature function that satisfies thermal boundary conditions at the edges and the variable separation method were used to reduce equation governing the steady state heat conduction to an ordinary differential equation (ODE) in the thickness coordinate which was solved analytically. Next, resulting variable coefficients ODE due to arbitrary distribution of material properties along thickness coordinate was also solved by the Peano-Baker series. Some numerical examples were given to demonstrate the accuracy, efficiency of the present model, mad to investigate the influence of different distributions of material properties on the temperature field. The numerical results confirm that the influence of different material distributions, gradient indices and thickness of plate to temperature field in plate can not be ignored.
基金supported by the National Natural Science Foundation of China(11072134 and 11102102)
文摘In this paper,using the fractional Fourier law,we obtain the fractional heat conduction equation with a time-fractional derivative in the spherical coordinate system.The method of variable separation is used to solve the timefractional heat conduction equation.The Caputo fractional derivative of the order 0 〈 α≤ 1 is used.The solution is presented in terms of the Mittag-Leffler functions.Numerical results are illustrated graphically for various values of fractional derivative.
文摘In engineering and technology, the following problem is often touched upon A certain portion of a plate with finite thickness is heated on its surface, so that the heat flux along the surface is distributed nonuniformly and varying with time. For this kind of heal conduction, there is no available analytical solution given in existing treatises concerning heat conduction. This paper presents an analytical solution of this problem, its calculation results are in good agreement with the experimental data.
文摘The correlations between thermal and physical properties were studied through thermal conductivity measurements, hardness tests, salt spray tests (AASS) among the surface treatment samples named K20, K40 with thickness of 20, 40 μm respectively and raw sample named K00. In thermal conductivity measurements, there are little differences among the samples as K00, K20 and K40, they exhibit 153.39, 150.69 and 149.76 W/(m·K), respectively. According to hardness tests, K00, K20 and K40 exhibit 87.9, 259.7 and 344.8 in Vickers values. In the result of salt spray tests to examine the effects on corrosion resistance, K00, K20 and K40 exhibit the grade of 3?5, 2.0?9.8 and 10, respectively. The mutual relation of the above results was analyzed. It is found that the surface treatments do not affect the thermal conductivity of aluminum and result in the improvement of physical properties. As a result of the technology, the surface improvement of aluminum alloy specimen is achieved without thermal degradation. It validates the ability of the aluminum plate heat exchangers with surface treatment to enhance the corrosion resistance. Present work is performed as the first fundamental threshold in the process of aluminum plate heat exchangers development to check out its possibility, therefore the next step-experimental and numerical study of practical aluminum plate heat exchangers will be made.
基金supported by the Key Program of the National Natural Science Foundation of China (Grand No. 51138001)the China-German Cooperation Project (Grand No. GZ566)+1 种基金the Innovative Research Groups Funded by the National Natural Science Foundation of China (Grand No. 51121005)the Special Funds for the Basic Scientific Research Expenses for the Central University (Grant No. DUT13LK16)
文摘The smoothing thin plate spline (STPS) interpolation using the penalty function method according to the optimization theory is presented to deal with transient heat conduction problems. The smooth conditions of the shape functions and derivatives can be satisfied so that the distortions hardly occur. Local weak forms are developed using the weighted residual method locally from the partial differential equations of the transient heat conduction. Here the Heaviside step function is used as the test function in each sub-domain to avoid the need for a domain integral. Essential boundary conditions can be implemented like the finite element method (FEM) as the shape functions possess the Kronecker delta property. The traditional two-point difference method is selected for the time discretization scheme. Three selected numerical examples are presented in this paper to demonstrate the availability and accuracy of the present approach comparing with the traditional thin plate spline (TPS) radial basis functions.
文摘This paper deals with the determination of temperature distribution and thermal deflection function of a thin circular plate with the stated conditions. The transient heat conduction equation is solved by using Marchi-Zgrablich transform and Laplace transform simultaneously and the results of temperature distribution and thermal deflection function are obtained in terms of infinite series of Bessel function and it is solved for special case by using Mathcad 2007 software and represented graphically by using Microsoft excel 2007.
文摘该文分析了膨胀石墨双极板(EGBPs)各向异性结构对燃料电池水热管理与输出性能的影响。建立了三维两相非等温数值模型,对比了4种典型复合材料结构下温度、电流密度、水含量等参数的分布特征,揭示了双极板传热特性与输出性能的耦合效应。结果表明:沿质子传递方向热导率(k_z)对燃料电池性能具有显著影响,在2.2 A cm^(-2)电流密度下,将k_z从常规结构的5 W·m^(-1)·K^(-1)提升至280 W·m^(-1)·K^(-1),可以使输出性能提高22 m V;沿流道气体流动方向的热导率(k_y)是影响散热能力的关键因素,将k_y与k_z提高至280 W·m^(-1)·K^(-1),或者实现各向同性结构(k_x=k_y=k_z=20 W·m^(-1)·K^(-1)),均能够使膜电极组件(MEA)核心区域的温度降低2℃左右。因此,提高k_y与k_z并实现各向同性结构是膨胀石墨双极板技术的未来发展目标之一。
文摘Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.
文摘In this study, integral operational methods are used to investigate the thermally induced transverse vibration of a thin elliptic annulus plate with elastic supports at both radial boundaries.The axisymmetric temperature distribution is determined by the heat conduction differential equation and its corresponding boundary conditions by employing a unified integral transform technique by use of Mathieu functions and modified Mathieu functions. The solution of thermally induced vibration of the plate with both ends encased with elastic supports is obtained by employing an integral transform for double Laplace differential equation. The thermal moment is derived on the basis of temperature distribution, and its stresses are obtained based on resultant bending moments per unit width. The numerical calculations of the distributions of the transient temperature and its associated stress distributions are shown in the figures.
文摘This new work aims to develop a full coupled thermomechanical method including both the temperature profile and displacements as primary unknowns of the model.This generic full coupled 3D exact shell model permits the thermal stress investigation of laminated isotropic,composite and sandwich structures.Cylindrical and spherical panels,cylinders and plates are analyzed in orthogonal mixed curved reference coordinates.The 3D equilibrium relations and the 3D Fourier heat conduction equation for spherical shells are coupled and they trivially can be simplified in those for plates and cylindrical panels.The exponential matrix methodology is used to find the solutions of a full coupled model based on coupled differential relations with respect to the thickness coordinate.The analytical solution is based on theories of simply supported edges and harmonic relations for displacement components and sovra-temperature.The sovra-temperature magnitudes are directly applied at the outer faces through static state hypotheses.As a consequence,the sovra-temperature description is assumed to be an unknown variable of themodel and it is calculated in the sameway as the three displacements.The final systemis based on a set of coupled homogeneous differential relations of second order in the thickness coordinate.This system is reduced in a first order differential relation system by redoubling the number of unknowns.Therefore,the exponential matrix methodology is applied to calculate the solution.The temperature field effects are evaluated in the static investigation of shells and plates in terms of displacement and stress components.After an appropriate preliminary validation,new benchmarks are discussed for several thickness ratios,geometrical data,lamination sequences,materials and sovra-temperature values imposed at the outer faces.Results make evident the accordance between the uncoupled thermo-mechanical model and this new full coupled thermo-mechanical model without the need to separately solve the Fourier heat conduction relation.Both effects connected with the thickness layer and the related embedded materials are included in the conducted thermal stress analysis.
文摘The heat-transfer behaviour of the conduction cold plate system used for avionics is investigated in this paper. The steady-state temperature profile for the cold plate is derived and the relationship between the coolant mass flowrate, the heat load and the hashest cold plate temperature is established.A model is proposed to describe the transient thermal rosponse of the cold plate under thermal shock condition. The analytic solution of the transient heat transfer within the cold plate is provided. The results of this paper agree with those of the finite element method and can be used for the structural design and performance evaluation of cold plate system.