Crystallization behaviors of ultrathin Al-doped HfO2 amorphous films grown by atomic layer deposition

In this work, ultrathin pure HfO_2 and Al-doped HfO_2films（about 4-nm thick） are prepared by atomic layer deposition and the crystallinities of these films before and after annealing at temperatures ranging from 550℃ to 750℃ are analyzed by grazing incidence x-ray diffraction. The as-deposited pure HfO_2 and Al-doped HfO_2 films are both amorphous. After550-℃ annealing, a multiphase consisting of a few orthorhombic, monoclinic and tetragonal phases can be observed in the pure HfO_2 film while the Al-doped HfO_2 film remains amorphous. After annealing at 650℃ and above, a great number of HfO_2 tetragonal phases, a high-temperature phase with higher dielectric constant, can be stabilized in the Al-doped HfO_2 film. As a result, the dielectric constant is enhanced up to about 35. The physical mechanism of the phase transition behavior is discussed from the viewpoint of thermodynamics and kinetics.

Improved performance of Au nanocrystal nonvolatile memory by N2-plasma treatment on HfO2blocking layer

The N2-plasma treatment on a HfO2 blocking layer of Au nanocrystal nonvolatile memory without any post annealing is investigated. The electrical characteristics of the MOS capacitor with structure of Al–Ta N/HfO2/Si O2/p-Si are also characterized. After N2-plasma treatment, the nitrogen atoms are incorporated into HfO2 film and may passivate the oxygen vacancy states. The surface roughness of HfO2 film can also be reduced. Those improvements of HfO2 film lead to a smaller hysteresis and lower leakage current density of the MOS capacitor. The N2-plasma is introduced into Au nanocrystal（NC） nonvolatile memory to treat the HfO2 blocking layer. For the N2-plasma treated device, it shows a better retention characteristic and is twice as large in the memory window than that for the no N2-plasma treated device. It can be concluded that the N2-plasma treatment method can be applied to future nonvolatile memory applications.

Study on Simulation and Profile Prediction of Atomic Layer Deposition

The Atomic Layer Deposition process(ALD)is widely used in FinFET,3D-NAND and other important technologies because of its self-limiting signature and low growth temperature.In recent years,the development of computer enables chances for ALD process simulation in order to improve the process R&D efficiency.In this paper,steady state theory and vacuum pump theory are implemented to develop the growth rate algorithm of atomic layer deposition.The dynamic evolution of the deposition profile is realized based on cellular automata method,and fits the relationship between temperature and growth rate in HfO2 deposition.The model accuracy and simulation results are verified with high reliability.Based on the simulation results of this model,the influence of different substrate size and environmental dose on growth rate of pore structure is studied and analyzed.In the case of deep hole,high depth-to-width ratio hole,or when the gas entry time is below saturation,the growth rate decreases at the pore bottom.Meanwhile,the simulation considering the angle-of-inclination of the hole’s tapered sidewall indicates that the greater the angle,the better the distribution of flux.

Effects of water vapor in high vacuum chamber on the properties of HfO_2 films

The influence of water vapor content in high vacuum chamber during the coating process on physical properties of HfO2 films was investigated. Coatings were deposited on BK7 substrates by electron beam evaporation and photoelectric maximum control method. An in situ residual gas analyzer （RGA） was used to monitor the residual gas composition in the vacuum chamber. The optical properties, microstructure, absorption and laser-induced damage threshold （LIDT） of the samples were characterized by Lambda 900 spectrophotometer, X-ray diffraction （XRD）, surface thermal lensing （STL） technique and 1064-nm Qswitched pulsed laser at a pulse duration of 12 ns respectively. It was found that a cold trap is an effective equipment to suppress water vapor in the vacuum chamber during the pumping process, and the coatings deposited in the vacuum atmosphere with relatively low water vapor composition show higher refractive index and smaller grain size. Meanwhile, the higher LIDT value is corresponding to lower absorbance.

Multiscale analysis of single- and multiple-pulse laser-induced damages in HfO_2/SiO_2 multilayer dielectric films at 532 nm

Nanosecond single- and multiple-pulse laser damage studies on HfOffSiO2 high-reflection （HR） coatings are performed at 532 nm. For single-pulse irradiation, the damage is attributed to the defects and the electric intensity distribution in the multilayer thin films. When the defect density in the irradiated area is high, delami- nation is observed. Other than the 1064 nm laser damage, the plasma scalding of the 532 nm laser damage is not pits-centered for normal incidence, and the size of the plasma scalding has no relation to the defect density and position, but increases with the laser fluence. For multiple-pulse irradiations, some damage sites show deeper precursors than those from the single-shot irradiation due to the accumulation effects. The cumulative laser- induced damages behave as pits without the presence of plasma scalding, which is unaffected by the laser fluence and shot numbers. The damage morphologies and depth information both confirm the fatigue effect of a HfO2/SiO2 HR coating under 532 nm laser irradiation.