In the era of Internet of Things(Io Ts),an energy-efficient ultraviolet(UV)photodetector(PD)is highly desirable considering the massive usage scenarios such as environmental sterilization,fire alarm and corona dischar...In the era of Internet of Things(Io Ts),an energy-efficient ultraviolet(UV)photodetector(PD)is highly desirable considering the massive usage scenarios such as environmental sterilization,fire alarm and corona discharge monitoring.So far,common self-powered UV PDs are mainly based on metal-semiconductor heterostructures or p–n heterojunctions,where the limited intrinsic built-in electric field restricts further enhancement of the photoresponsivity.In this work,an extremely low-voltage field-effect UV PD is proposed using a gatedrain shorted amorphous IGZO(a-IGZO)thin film transistor(TFT)architecture.A combined investigation of the experimental measurements and technology computer-aided design(TCAD)simulations suggests that the reverse current(ⅠR)of field-effect diode(FED)is highly related with the threshold voltage(Vth)of the parental TFT,implying an enhancement-mode TFT is preferable to fabricate the field-effect UV PD with low dark current.Driven by a low bias of-0.1 V,decent UV response has been realized including large UV/visible(R_(300)/R_(550))rejection ratio(1.9×10^(3)),low dark current(1.15×10^(-12)A)as well as high photo-to-dark current ratio(PDCR,~10^(3))and responsivity(1.89 A/W).This field-effect photodiode provides a new platform to construct UV PDs with well-balanced photoresponse performance at a low bias,which is attractive for designs of large-scale smart sensor networks with high energy efficiency.展开更多
In-Ga-Zn-O(IGZO) channel based thin-film transistors(TFT), which exhibit high on-off current ratio and relatively high mobility, has been widely researched due to its back end of line(BEOL)-compatible potential for th...In-Ga-Zn-O(IGZO) channel based thin-film transistors(TFT), which exhibit high on-off current ratio and relatively high mobility, has been widely researched due to its back end of line(BEOL)-compatible potential for the next generation dynamic random access memory(DRAM) application. In this work, thermal atomic layer deposition(TALD) indium gallium zinc oxide(IGZO) technology was explored. It was found that the atomic composition and the physical properties of the IGZO films can be modulated by changing the sub-cycles number during atomic layer deposition(ALD) process. In addition, thin-film transistors(TFTs) with vertical channel-all-around(CAA) structure were realized to explore the influence of different IGZO films as channel layers on the performance of transistors. Our research demonstrates that TALD is crucial for high density integration technology, and the proposed vertical IGZO CAA-TFT provides a feasible path to break through the technical problems for the continuous scale of electronic equipment.展开更多
随着人们进入信息时代,半导体技术快速发展,对薄膜晶体管(Thin film transistor,简称TFT)的性能要求逐渐提高.IGZO由于具有较高的载流子迁移率、相对良好的均匀性等优势而受到广泛关注;而传统的真空技术制备薄膜晶体管,因制备工艺复杂...随着人们进入信息时代,半导体技术快速发展,对薄膜晶体管(Thin film transistor,简称TFT)的性能要求逐渐提高.IGZO由于具有较高的载流子迁移率、相对良好的均匀性等优势而受到广泛关注;而传统的真空技术制备薄膜晶体管,因制备工艺复杂、制备成本高等问题,在快速发展的信息时代逐渐显露出局限性,本文采用制备工艺更为简单的溶液法在Si/SiO_(2)基底上制备IGZO有源层薄膜,并测试不同退火温度(450℃,550℃,650℃)条件下对薄膜性能的影响.结果表明,适当提高退火温度可以有效改善IGZO-TFT器件的电学性能,本实验测试得出:当溶液法制备薄膜在550℃退火温度下退火器件性能最优,溶液法制备的器件电流开关闭达到105,器件性能相对比较稳定.展开更多
采用射频磁控溅射方法在n型硅片上制备了底栅顶结构的铟镓锌氧-薄膜晶体管(IGZO-TFT)。分别采用Au、Cu、Al 3种金属材料作为电极,研究不同电极材料对IGZO薄膜晶体管性能的影响。器件的输出特性和转移特性测试结果表明:以Au为电极的IGZO-...采用射频磁控溅射方法在n型硅片上制备了底栅顶结构的铟镓锌氧-薄膜晶体管(IGZO-TFT)。分别采用Au、Cu、Al 3种金属材料作为电极,研究不同电极材料对IGZO薄膜晶体管性能的影响。器件的输出特性和转移特性测试结果表明:以Au为电极的IGZO-TFT具有最佳的性能,其饱和输出电流达到17.9μA,开关比达到1.4×106。基于功函数比较分析了3种电极的接触特性,根据TLM(Transmission line model)理论推算得出Au电极具有三者中最小的接触电阻。展开更多
基金supported by the National Natural Science Foundation of China(Grant Nos.62174113,12174275,and 61874139)the Guangdong Basic and Applied Basic Research Foundation(Grant Nos.2019B1515120057,2023A1515140094,and 2023A1515110730)。
文摘In the era of Internet of Things(Io Ts),an energy-efficient ultraviolet(UV)photodetector(PD)is highly desirable considering the massive usage scenarios such as environmental sterilization,fire alarm and corona discharge monitoring.So far,common self-powered UV PDs are mainly based on metal-semiconductor heterostructures or p–n heterojunctions,where the limited intrinsic built-in electric field restricts further enhancement of the photoresponsivity.In this work,an extremely low-voltage field-effect UV PD is proposed using a gatedrain shorted amorphous IGZO(a-IGZO)thin film transistor(TFT)architecture.A combined investigation of the experimental measurements and technology computer-aided design(TCAD)simulations suggests that the reverse current(ⅠR)of field-effect diode(FED)is highly related with the threshold voltage(Vth)of the parental TFT,implying an enhancement-mode TFT is preferable to fabricate the field-effect UV PD with low dark current.Driven by a low bias of-0.1 V,decent UV response has been realized including large UV/visible(R_(300)/R_(550))rejection ratio(1.9×10^(3)),low dark current(1.15×10^(-12)A)as well as high photo-to-dark current ratio(PDCR,~10^(3))and responsivity(1.89 A/W).This field-effect photodiode provides a new platform to construct UV PDs with well-balanced photoresponse performance at a low bias,which is attractive for designs of large-scale smart sensor networks with high energy efficiency.
基金funded in part by the National Key R&D Program of China(Grant No.2022YFB3606900)in part by the National Natural Science of China(Grant No.62004217)。
文摘In-Ga-Zn-O(IGZO) channel based thin-film transistors(TFT), which exhibit high on-off current ratio and relatively high mobility, has been widely researched due to its back end of line(BEOL)-compatible potential for the next generation dynamic random access memory(DRAM) application. In this work, thermal atomic layer deposition(TALD) indium gallium zinc oxide(IGZO) technology was explored. It was found that the atomic composition and the physical properties of the IGZO films can be modulated by changing the sub-cycles number during atomic layer deposition(ALD) process. In addition, thin-film transistors(TFTs) with vertical channel-all-around(CAA) structure were realized to explore the influence of different IGZO films as channel layers on the performance of transistors. Our research demonstrates that TALD is crucial for high density integration technology, and the proposed vertical IGZO CAA-TFT provides a feasible path to break through the technical problems for the continuous scale of electronic equipment.
文摘随着人们进入信息时代,半导体技术快速发展,对薄膜晶体管(Thin film transistor,简称TFT)的性能要求逐渐提高.IGZO由于具有较高的载流子迁移率、相对良好的均匀性等优势而受到广泛关注;而传统的真空技术制备薄膜晶体管,因制备工艺复杂、制备成本高等问题,在快速发展的信息时代逐渐显露出局限性,本文采用制备工艺更为简单的溶液法在Si/SiO_(2)基底上制备IGZO有源层薄膜,并测试不同退火温度(450℃,550℃,650℃)条件下对薄膜性能的影响.结果表明,适当提高退火温度可以有效改善IGZO-TFT器件的电学性能,本实验测试得出:当溶液法制备薄膜在550℃退火温度下退火器件性能最优,溶液法制备的器件电流开关闭达到105,器件性能相对比较稳定.
文摘采用射频磁控溅射方法在n型硅片上制备了底栅顶结构的铟镓锌氧-薄膜晶体管(IGZO-TFT)。分别采用Au、Cu、Al 3种金属材料作为电极,研究不同电极材料对IGZO薄膜晶体管性能的影响。器件的输出特性和转移特性测试结果表明:以Au为电极的IGZO-TFT具有最佳的性能,其饱和输出电流达到17.9μA,开关比达到1.4×106。基于功函数比较分析了3种电极的接触特性,根据TLM(Transmission line model)理论推算得出Au电极具有三者中最小的接触电阻。
