Variants at the GTF2I repeat domain containing 1(GTF2IRD1)–GTF2I locus are associated with primary Sj?gren's syndrome, systemic lupus erythematosus, and rheumatoid arthritis. Numerous studies have indicated that ...Variants at the GTF2I repeat domain containing 1(GTF2IRD1)–GTF2I locus are associated with primary Sj?gren's syndrome, systemic lupus erythematosus, and rheumatoid arthritis. Numerous studies have indicated that this susceptibility locus is shared by multiple autoimmune diseases. However, until now there were no studies of the correlation between GTF2IRD1–GTF2I polymorphisms and neuromyelitis optica spectrum disorders(NMOSD). This case control study assessed this association by recruiting 305 participants with neuromyelitis optica spectrum disorders and 487 healthy controls at the Department of Neurology, from September 2014 to April 2017. Peripheral blood was collected, DNA extracteds and the genetic association between GTF2IRD1–GTF2I polymorphisms and neuromyelitis optica spectrum disorders in the Chinese Han population was analyzed by genotyping. We found that the T allele of rs117026326 was associated with an increased risk of neuromyelitis optica spectrum disorders(odds ratio(OR) = 1.364, 95% confidence interval(CI) 1.019–1.828; P = 0.037). This association persisted after stratification analysis for aquaporin-4 immunoglobulin G antibodies(AQP4-IgG) positivity(OR = 1.397, 95% CI 1.021–1.912; P = 0.036) and stratification according to coexisting autoimmune diseases(OR = 1.446, 95% CI 1.072–1.952; P = 0.015). Furthermore, the CC genotype of rs73366469 was frequent in AQP4-IgG-seropositive patients(OR = 3.15, 95% CI 1.183–8.393, P = 0.022). In conclusion, the T allele of rs117026326 was associated with susceptibility to neuromyelitis optica spectrum disorders, and the CC genotype of rs73366469 conferred susceptibility to AQP4-IgG-seropositivity in Han Chinese patients. The protocol was approved by the Ethics Committee of West China Hospital of Sichuan University, China(approval number: 2016-31) on March 2, 2016.展开更多
Technology roadmaps have been a part of the semiconductor industry for many years.The first roadmap was Moore’s law,which started as an empirical observation that competitive forces then turned into a prediction that...Technology roadmaps have been a part of the semiconductor industry for many years.The first roadmap was Moore’s law,which started as an empirical observation that competitive forces then turned into a prediction that became an industry roadmap.Then the ITRS roadmap was developed and for many years was used by leading edge semiconductor producers to drive new technology they needed.Now there is the IRDS roadmap,which projects semiconductor end user requirements and develops a technology roadmap based on those requirements.The 2017 IRDS roadmap was just released.To prepare the roadmap,we received input from experts around the world.The roadmap predicts that the requirements of high performance logic will drive the development of different device structures in logic chips.Memory technology will also advance but is more focused on cost than high performance logic is.Because of this,there may be a split in the patterning roadmaps for different types of devices.Logic will adopt EUV and its extensions,while flash memory will consider nanoimprint.Directed self-assembly and direct write e-beam are also being developed.DSA has the potential to improve CD uniformity and lower costs.Direct write e-beam promises to make personalization of chips more feasible.DRAM memory will trail logic in critical dimensions and will adopt EUV when it becomes cost effective.The lithography community will both have to make EUV work and overcome the challenges of randomness in CDs and resist performance,while memory will try to make nanoimprint a reliable and low defect method of patterning.Long term,logic is expected to start focusing on 3D architectures in the late 2020’s.This will put a tremendous stress on the yield of patterning processes and on reducing the number of process steps that are required.It will also put more focus on hole type patterns,which will become one of the key patterning challenges in the future.展开更多
基金supported by the National Natural Science Foundation of China,No.81271321(to HYZ)a grant from the Department of Science and Technology Research Projects in Sichuan Province of China,No.2013FZ0015(to HYZ)the Fundamental Research Funds for the Central Universities,China,No.2017SCU11049(to QZ)
文摘Variants at the GTF2I repeat domain containing 1(GTF2IRD1)–GTF2I locus are associated with primary Sj?gren's syndrome, systemic lupus erythematosus, and rheumatoid arthritis. Numerous studies have indicated that this susceptibility locus is shared by multiple autoimmune diseases. However, until now there were no studies of the correlation between GTF2IRD1–GTF2I polymorphisms and neuromyelitis optica spectrum disorders(NMOSD). This case control study assessed this association by recruiting 305 participants with neuromyelitis optica spectrum disorders and 487 healthy controls at the Department of Neurology, from September 2014 to April 2017. Peripheral blood was collected, DNA extracteds and the genetic association between GTF2IRD1–GTF2I polymorphisms and neuromyelitis optica spectrum disorders in the Chinese Han population was analyzed by genotyping. We found that the T allele of rs117026326 was associated with an increased risk of neuromyelitis optica spectrum disorders(odds ratio(OR) = 1.364, 95% confidence interval(CI) 1.019–1.828; P = 0.037). This association persisted after stratification analysis for aquaporin-4 immunoglobulin G antibodies(AQP4-IgG) positivity(OR = 1.397, 95% CI 1.021–1.912; P = 0.036) and stratification according to coexisting autoimmune diseases(OR = 1.446, 95% CI 1.072–1.952; P = 0.015). Furthermore, the CC genotype of rs73366469 was frequent in AQP4-IgG-seropositive patients(OR = 3.15, 95% CI 1.183–8.393, P = 0.022). In conclusion, the T allele of rs117026326 was associated with susceptibility to neuromyelitis optica spectrum disorders, and the CC genotype of rs73366469 conferred susceptibility to AQP4-IgG-seropositivity in Han Chinese patients. The protocol was approved by the Ethics Committee of West China Hospital of Sichuan University, China(approval number: 2016-31) on March 2, 2016.
文摘Technology roadmaps have been a part of the semiconductor industry for many years.The first roadmap was Moore’s law,which started as an empirical observation that competitive forces then turned into a prediction that became an industry roadmap.Then the ITRS roadmap was developed and for many years was used by leading edge semiconductor producers to drive new technology they needed.Now there is the IRDS roadmap,which projects semiconductor end user requirements and develops a technology roadmap based on those requirements.The 2017 IRDS roadmap was just released.To prepare the roadmap,we received input from experts around the world.The roadmap predicts that the requirements of high performance logic will drive the development of different device structures in logic chips.Memory technology will also advance but is more focused on cost than high performance logic is.Because of this,there may be a split in the patterning roadmaps for different types of devices.Logic will adopt EUV and its extensions,while flash memory will consider nanoimprint.Directed self-assembly and direct write e-beam are also being developed.DSA has the potential to improve CD uniformity and lower costs.Direct write e-beam promises to make personalization of chips more feasible.DRAM memory will trail logic in critical dimensions and will adopt EUV when it becomes cost effective.The lithography community will both have to make EUV work and overcome the challenges of randomness in CDs and resist performance,while memory will try to make nanoimprint a reliable and low defect method of patterning.Long term,logic is expected to start focusing on 3D architectures in the late 2020’s.This will put a tremendous stress on the yield of patterning processes and on reducing the number of process steps that are required.It will also put more focus on hole type patterns,which will become one of the key patterning challenges in the future.
