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Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal 被引量:5
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作者 赵佳蕾 接金川 +3 位作者 陈飞 陈航 李廷举 曹志强 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2014年第6期1659-1665,共7页
A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fractu... A nickel-based coating was deposited on the pure Al substrate by immersion plating,and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450-550 ℃.The interce microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy(SEM) and X-ray diffraction(XRD).The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests.The results show that the Ni interiayer can effectively eliminate the formation of Al-Cu intermetallic compounds.The Al/Ni interface consists of the Al3Ni and Al3Ni2 phases,while it is Ni-Cu solid solution at the Ni/Cu interce.The tensile shear strength of the joints is improved by the addition of Ni interiayer.The joint with Ni interiayer annealed at 500 ℃ exhibits a maximum value of tensile shear strength of 34.7 MPa. 展开更多
关键词 Al/Cu bimetal immersion Ni plating INTERFACE diffusion bonding INTERMETALLICS
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