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InAlN/AlN/GaN HEMT电学特性仿真与分析 被引量:1
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作者 杨娟 张小玲 吕长志 《微电子学》 CAS CSCD 北大核心 2012年第3期411-414,共4页
研究了一种新型GaN基HEMT结构,即InAlN/AlN/GaN异质结层结构,并对其直流特性以及频率特性进行了仿真。通过理论分析,结合TCAD软件,与常规AlGaN/AlN/GaNHEMT进行对比。对栅长为1μm的器件进行仿真,结果表明,器件的最大跨导为450mS/mm,最... 研究了一种新型GaN基HEMT结构,即InAlN/AlN/GaN异质结层结构,并对其直流特性以及频率特性进行了仿真。通过理论分析,结合TCAD软件,与常规AlGaN/AlN/GaNHEMT进行对比。对栅长为1μm的器件进行仿真,结果表明,器件的最大跨导为450mS/mm,最大电流密度为2A/mm,电流增益截止频率fT=15GHz,最高振荡频率fmax=35GHz。 展开更多
关键词 inaln/Aln/gan hemt TCAD
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基于再生长欧姆接触工艺的220 GHz InAlN/GaN场效应晶体管(英文) 被引量:1
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作者 尹甲运 吕元杰 +5 位作者 宋旭波 谭鑫 张志荣 房玉龙 冯志红 蔡树军 《红外与毫米波学报》 SCIE EI CAS CSCD 北大核心 2017年第1期6-9,34,共5页
在蓝宝石衬底上研制了具有高电流增益截止频率(f_T)的InAlN/GaN异质结场效应晶体管(HFETs).基于MOCVD外延n+-GaN欧姆接触工艺实现了器件尺寸的缩小,有效源漏间距(Lsd)缩小至600 nm.此外,采用自对准工艺制备了50 nm直栅.由于器件尺寸的缩... 在蓝宝石衬底上研制了具有高电流增益截止频率(f_T)的InAlN/GaN异质结场效应晶体管(HFETs).基于MOCVD外延n+-GaN欧姆接触工艺实现了器件尺寸的缩小,有效源漏间距(Lsd)缩小至600 nm.此外,采用自对准工艺制备了50 nm直栅.由于器件尺寸的缩小,Vgs=1 V下器件最大饱和电流(I_(ds))达到2.11 A/mm,峰值跨导达到609 mS/mm.根据小信号测试结果,外推得到器件的fT和最大振荡频率(fmax)分别为220 GHz和48 GHz.据我们所知,该f_T值是目前国内InAlN/GaN HFETs器件报道的最高结果. 展开更多
关键词 ina1n/gan HFET FT 再生长n+-gan欧姆接触
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AlGaN/AlN/GaN大功率微波HEMT
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作者 一凡 《微电子技术》 2003年第5期8-8,共1页
关键词 大功率微波hemt 异质结 A1gan/A1n/gan RF性能
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70-nm-gated InAlN/GaN HEMTs grown on SiC substrate with f_T/f_(max)>160GHz 被引量:1
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作者 韩婷婷 敦少博 +5 位作者 吕元杰 顾国栋 宋旭波 王元刚 徐鹏 冯志红 《Journal of Semiconductors》 EI CAS CSCD 2016年第2期86-89,共4页
lnA1N/GaN high-electron-mobility transistors (HEMTs) on SiC substrate were fabricated and character- ized. Several techniques, consisting of high electron density, 70 nm T-shaped gate, low ohmic contacts and a short... lnA1N/GaN high-electron-mobility transistors (HEMTs) on SiC substrate were fabricated and character- ized. Several techniques, consisting of high electron density, 70 nm T-shaped gate, low ohmic contacts and a short drain-source distance, are integrated to gain high device performance. The fabricated InA1N/GaN HEMTs exhibit a maximum drain saturation current density of 1.65 A/ram at Vgs = 1 V and a maximum peak transconductance of 382 mS/rnm. In addition, a unity current gain cut-off frequency (fT) of 162 GHz and a maximum oscillation frequency (fmax) of 176 GHz are achieved on the devices with the 70 nm gate length. 展开更多
关键词 ina1n/gan high-electron-mobility transistors hemts) T-shaped gate current gain cut-off fre-quency (fT) maximum oscillation frequency (fmax)
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DC and RF characteristics of enhancement-mode InAlN/GaN HEMT with fluorine treatment
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作者 宋旭波 顾国栋 +5 位作者 敦少博 吕元杰 韩婷婷 王元刚 徐鹏 冯志红 《Journal of Semiconductors》 EI CAS CSCD 2014年第4期52-55,共4页
We report an enhancement-mode InA1N/GaN HEMT using a fluorine plasma treatment. The threshold voltage was measured to be +0.86 V by linear extrapolation from the transfer characteristics. The transconductance is 0 mS... We report an enhancement-mode InA1N/GaN HEMT using a fluorine plasma treatment. The threshold voltage was measured to be +0.86 V by linear extrapolation from the transfer characteristics. The transconductance is 0 mS/mm at Vc, s = 0 V and VDS = 5 V, which shows a truly normal-offstate. The gate leakage current density of the enhancement-mode device shows two orders of magnitude lower than that of the depletion-mode device. The transfer characteristics of the E-mode InA1N/GaN HEMT at room temperature and high temperature are reported. The current gain cut-off frequency (fT) and the maximum oscillation frequency (fmax) of the enhancement-mode device with a gate length of 0.3 #m were 29.4 GHz and 37.6 GHz respectively, which is comparable with the depletion-mode device. A classical 16 elements small-signal model was deduced to describe the parasitic and the intrinsic parameters of the device. 展开更多
关键词 EnHAnCEMEnT-MODE ina1n/gan hemt threshold voltage fluorine treatment small-signal model
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A 4.69-W/mm output power density InAlN/GaN HEMT grown on sapphire substrate
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作者 刘波 冯志红 +7 位作者 张森 敦少博 尹甲运 李佳 王晶晶 张效帏 房玉龙 蔡树军 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2011年第12期68-71,共4页
We report high performance InA1N/GaN HEMTs grown on sapphire substrates. The lattice-matched InA1N/GaN HEMT sample showed a high 2DEG mobility of 1210 cmZ/(V.s) under a sheet density of 2.6 × 10^13 cm^-2. Large... We report high performance InA1N/GaN HEMTs grown on sapphire substrates. The lattice-matched InA1N/GaN HEMT sample showed a high 2DEG mobility of 1210 cmZ/(V.s) under a sheet density of 2.6 × 10^13 cm^-2. Large signal load-pull measurements for a (2 × 100 μm) x 0.25 μm device have been conducted with a drain voltage of 24 V at 10 GHz. The presented results confirm the high performances reachable by InAIN- based technology with an output power density of 4.69 W/ram, a linear gain of 11.8 dB and a peak power-added efficiency of 48%. This is the first report of high performance InA1N/GaN HEMTs in China's Mainland. 展开更多
关键词 ina1n/gan hemt output power density metal-organic chemical vapor deposition
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A high performance InAIN/GaN HEMT with low Ron and gate leakage
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作者 马春雷 顾国栋 吕元杰 《Journal of Semiconductors》 EI CAS CSCD 2016年第2期94-96,共3页
InA1N/GaN high-electron mobility transistors (HEMTs) with a gate length of 100 nm and oxygen plasma treatment were fabricated. A Si/Ti/A1/Ni/Au ohmic contact was also used to reduce the contact resistance. DC and RF... InA1N/GaN high-electron mobility transistors (HEMTs) with a gate length of 100 nm and oxygen plasma treatment were fabricated. A Si/Ti/A1/Ni/Au ohmic contact was also used to reduce the contact resistance. DC and RF characteristics of the devices were measured. The fabricated devices show a maximum drain current density of 2.18 A/mm at VGs = 2 V, a low on-resistance (Ron) of 1.49 x2.mm and low gate leakage current. An excellent frequency response was also obtained. The current cut-off frequency (fT) is 81 GHz and the maximum oscillation frequency is 138 GHz, respectively. 展开更多
关键词 ina1n high-electron-mobility transistor hemt drain current density on resistance gate leakagecurrent oxygen plasma treatment
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^(60)Co gamma radiation effect on AlGaN/AlN/GaN HEMT devices 被引量:2
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作者 王燕萍 罗尹虹 +4 位作者 王伟 张科营 郭红霞 郭晓强 王园明 《Chinese Physics C》 SCIE CAS CSCD 2013年第5期50-55,共6页
The testing techniques and experimental methods of the 60Co gamma irradiation effect on A1GaN/A1N/ GaN high electron mobility transistors (HEMTs) are established. The degradation of the electrical properties of the ... The testing techniques and experimental methods of the 60Co gamma irradiation effect on A1GaN/A1N/ GaN high electron mobility transistors (HEMTs) are established. The degradation of the electrical properties of the device under the actual radiation environment are analyzed theoretically, and studies of the total dose effects of gamma radiation on A1GaN/A1N/GaN HEMTs at three different radiation bias conditions are carried out. The degradation patterns of the main parameters of the A1GaN/A1N/GaN HEMTs at different doses are then investigated, and the device parameters that were sensitive to the gamma radiation induced damage and the total dose level induced device damage are obtained. 展开更多
关键词 A1gan/A1n/gan hemt 60Co gamma radiation sensitive parameter
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A surface-potential-based model for AlGaN/AlN/GaN HEMT
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作者 汪洁 孙玲玲 +1 位作者 刘军 周明珠 《Journal of Semiconductors》 EI CAS CSCD 2013年第9期41-44,共4页
A new surface-potential-based model for A1GaN/A1N/GaN high electron mobility transistor (HEMT) is proposed in this paper. Since the high polarization effects caused by AlN interlayer favorably influence the two dime... A new surface-potential-based model for A1GaN/A1N/GaN high electron mobility transistor (HEMT) is proposed in this paper. Since the high polarization effects caused by AlN interlayer favorably influence the two dimensional electron gas (2DEG) and scattering mechanisms, we first add spontaneous and piezoelectric charge terms to the source equation of surface-potential, and a mobility model for A1GaN/A1N/GaN HEMT is rewritten. Compared with TCAD simulations, the DC characteristics of A1GaN/AIN/GaN HEMT are faithfully reproduced by the new model. 展开更多
关键词 A1gan/A1n/gan hemt 2DEG surface potential polarization effects MOBILITY
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