Transparent conducting indium-tin-oxide(ITO) film as full front electrode in Ⅲ–Ⅴ compound solar cell

The application of transparent conducting indium-tin-oxide （ITO） film as full front electrode replacing the conven- tional bus-bar metal electrode in III-V compound GalnP solar cell was proposed. A high-quality, non-rectifying contact between ITO and 10 nm N＋-GaAs contact layer was formed, which is benefiting from a high carrier concentration of the terrilium-doped N＋-GaAs layer, up to 2×10^19 cm^-3. A good device performance of the GalnP solar cell with the ITO electrode was observed. This result indicates a great potential of transparent conducting films in the future fabrication of larger area flexible III-V solar cell.

Preparation and Characterization of Indium Doped Tin Oxide （ITO） via a Solvothermal Method

Tin-doped Indium Oxide （ITO） has been successfully prepared via solvothermal method with a mixture of Indium（Ill） acetylacetonate and Tin（IV） bis（acetylacetonate）dichioride in oleyamine solvent under the condition of the different reaction time from 12 h to 48 h for the first time. The morphology, phase composition and particle size of the ITO powder were characterized by TEM and XRD. Two significant properties required for ITO samples to become noncarbon support for Pt in PEMFCs including specific surface area and electrical conductivity were studied.

模压成型压力对氧化铟锡(ITO)靶材性能影响研究

以化学共沉淀-煅烧法制备的纳米ITO粉体为原料,通过模压、冷等静压成型,采用常压烧结法制备了ITO靶材,研究了模压成型压力对ITO靶材相对密度、电阻率和晶粒尺寸的影响。结果表明,模压成型压力60 MPa且烧结条件适宜时,制得的ITO靶材相对密度为99.81%、电阻率为1.707×10^(-4)Ω·cm、平均晶粒尺寸为7.62μm。研究结果可为ITO靶材的致密化与大型化生产提供借鉴。

Preparation of indium tin oxide targets with a high density and single phase structure by normal pressure sintering process

The present work mainly describes the technology for preparing indium-tin oxide （ITO） targets by cold isostatic pressing （CIP） and normal pressure sintering process. ITO powders were produced by chemical co-precipitation and shaped into an ITO green compact with a relative density of 60% by CIP under 300 MPa. Then, an ITO target with a relative density larger than 99.6% was obtained by sintering this green compact at 1550℃ for 8 h. The effects of forming pressure, sintering temperature and sintering time on the density of the target were inves- tigated. Also, a discussion was made on the sintering atmosphere.

Microstructure and properties of indium tin oxide thin films deposited by RF-magnetron sputtering

Tin-doped indium oxide （ITO） thin films were prepared using conventional radio frequency （RF） planar magnetron sputtering equipped with IR irradiation using a ceramic target of In2O3/SnO2 with a mass ratio of 1：1 at various IR irradiation temperatures T1 （from room temperature to 400℃）. The refractive index, deposited ratio, and resistivity are functions of the sputtering Ar gas pressure. The microstructure of ITO thin films is related to IR T1, the crystalline seeds appear at T1= 300℃, and the films are amorphous at the temperature ranging from 27℃ to 400℃. AFM investigation shows that the roughness value of peak-valley of ITO thin film （Rp-v） and the surface microstructure of rio thin films have a close relation with T1. The IR irradiation results in a widening value of band-gap energy due to Burstein-Moss effect and the maximum visible transmittance shifts toward a shorter wavelength along with a decrease in the film＇s refractive index. The plasma wavelength and the refractive index of ITO thin films are relative to the T1. XPS investigation shows that the photoelectrolytic properties can be deteriorated by the sub-oxides. The deterioration can be decreased by increasing the oxygen flow rote （fo2）, and the mole ratio of Sn/In in the samples reduces with an increase info2.

Effects of SiO_2 and TiO_2 on resistance stabilities of flexible indium-tin-oxide films prepared by ion assisted deposition

Inorganic buffer layers such as SiO2 or TiO2 and transparent conductive indium-tin-oxide （ITO） films were prepared on polyethylene terephthalate （PET） substrates by ion assisted deposition （IAD） at room temperature, and the effects of SiO2 and TiOzon the bending resistance performance of flexible ITO films were investigated. The results show that ITO films with SiO2 or TiO2 buffer layer have better resistance stabilities compared to ones without the buffer layer when the ITO films are inwards bent at a bending radius more than 1.2 cm and when the ITO films are outwards bent at a bending radius from 0.8 cm to 1.2 cm. 1TO films with SiO2 buffer layer have better resistance sta- bilities compared to ones with TiO2 buffer layer after the ITO fdms are bent several hundreds of cycles at the same bending radius, for the adhesion of SiO2 is stronger than that of TiO2. The compressive stress resulted from inward bending leads to the formation of more defects in the ITO films compared with the tensile stress arising from outward bending. SiO2 and TiO2 buffer layers can effectively improve the crystallinity of ITO films in （400）, （440） directions.

Dependence of Performance of Organic Light-emitting Devices on Sheet Resistance of Indium-tin-oxide Anodes

The dependence of the performance of organic light-emitting devices（OLEDs） on the sheet resistance of indiumtin-oxide（ITO） anodes was investigated by measuring the steady state current density brightness voltage characteristics and the electroluminescent spectra. The device with a higher sheet resistance anode shows a lower current density, a lower brightness level, and a higher operation voltage. The electroluminescence（EL） efficiencies of the devices with the same structure but different ITO anodes show more complicated differences. Furthermore, the shift of the light-emitting zone toward the anode was found when an anode with a higher sheet resistance was used. These performance differences are discussed and attributed to the reduction of hole injection and the increase in voltage drop over ITO anode with the increase in sheet resistance.

Effect of Sn^(4+) content on properties of indium tin oxide nanopowders

Indium tin oxide(ITO)nanopowders were prepared by a modified chemical co-precipitation process.The influence of different SnO2 contents on the decomposition behavior of ITO precursors,and on the phase and morphology of ITO precursors and ITO nanopowders were studied by X-ray diffractometry,transmission electron microscopy and differential thermal and thermogravimetry analysis methods.The TG-DSC curves show that the decomposition process of precursor precipitation is completed when the temperature is close to 600 ℃and the end temperature of decompositionis somewhat lower when the doping amount of SnO2 is increased.The XRD patterns indicate that the solubility limit of Sn4+ relates directly to the calcining temperature. When being calcined at 700℃,a single phase ITO powder with 15%SnO2(mass fraction)can be obtained.But,when the calcining temperature is higher than 800℃,the phase of SnO2 will appear in ITO nanopowders which contain more than 10%SnO2.The particle size of the ITO nanopowders is 15-25 nm.The ITO nanoparticles without Sn have a spherical shape,but their morphology moves towards an irregular shape when being doped with Sn4+.

Improvement of the light output and contact resistance of InGaN-based light-emitting diodes based on tantalum-doped indium tin oxide as p-type electrodes

This paper reports that highly transparent and low resistance tantalum-doped indium tin oxide （Ta-doped ITO） films contacted to p-type GaN have been prepared by the electron-beam evaporation technique. The Ta-doped ITO contacts become Ohmic with a specific contact resistance of $／sim 5.65／times 10^{ - 5}$$／Omega ／cdot$cm$^{2}$ and show the transmittance of $／sim $98% at a wavelength of 440nm when annealed at 500／du. Blue light emitting diodes （LEDs） fabricated with Ta-doped ITO p-type Ohmic contact layers give a forward-bias voltage of 3.21V at an injection current of 20mA. It further shows that the output power of LEDs with Ta-doped ITO contacts is enhanced 62% at 20mA in comparison with that of LEDs with conventional Ni/Au contacts

Microstructure and properties of indium tin oxide thin films deposited by RF-magnetron sputtering

Tin-doped indium oxide （ITO） thin films were prepared using conventional radio frequency （RF） planar magnetron sputtering equipped with IR irradiation using a ceramic target of In2O3/SnO2 with a mass ratio of 1∶1 at various IR irradiation temperatures T1 （from room temperature to 400?℃）. The refractive index,deposited ratio,and resistivity are functions of the sputtering Ar gas pressure. The microstructure of ITO thin films is related to IR T1,the crystalline seeds appear at T1=300?℃,and the films are amorphous at the temperature ranging from 27?℃ to 400?℃. AFM investigation shows that the roughness value of peak-valley of ITO thin film （R p-v ） and the surface microstructure of ITO thin films have a close relation with T1. The IR irradiation results in a widening value of band-gap energy due to Burstein-Moss effect and the maximum visible transmittance shifts toward a shorter wavelength along with a decrease in the film’s refractive index. The plasma wavelength and the refractive index of ITO thin films are relative to the T1. XPS investigation shows that the photoelectrolytic properties can be deteriorated by the sub-oxides. The deterioration can be decreased by increasing the oxygen flow rate （fo2）,and the mole ratio of Sn/In in the samples reduces with an increase in fo2.

Crystallization and Conductivity Mechanism of ITO Films on Different Substrates Deposited with Different Substrate Temperatures

ITO thin films were grown on PC（polycarbonate）, PMMA（polymethyl methacrylate） and glass substrates by r.f. magnetron sputtering. The electrical, structural and chemical characteristics of ITO films were analyzed by the Hall Technique, X-ray diffraction, and X-ray photoelectron spectroscopy. XPS studies suggest that all the ITO films consist of crystalline and amorphous phases. The degree of crystallinity increases from less than 45% to more than 90% when the substrate temperature increases from 80 to 300 ℃. The In and Sn exist in the chemical state of In^3＋ and Sn^4＋, respectively, independent of substrate type and temperature. The enrichment of Sn on surface and In in body of ITO films are also revealed. And, the oxygen deficient regions exist both in surface layer and film body. For ITO films deposited under 180 ℃ , the carrier concentration are mainly provided by oxygen vacancies, and the dominant electron carrier scattering mechanism is grain boundary scattering between the crystal and the amorphous grain. For ITO films deposited over 180 ℃, the carrier concentration are provided by tin doping, and the dominant scattering mechanism transforms from grain boundary scattering between the crystal grains to ionized impurity scattering with increasing deposition temperature.

基于ITO的近红外波段远场辐射的动态调控

由近零介电常数材料构成的纳米天线,其折射率具有强度依赖性,可以用来调控远场辐射模式。因此,提出了基于氧化铟锡(ITO)的混合光学天线,以光学方式调控远场辐射角的偏转。并且,基于ITO和线性介电材料(nL)的混合结构天线可实现在近红外波段(1000 nm~1600 nm)偏转角的调控。随着入射光强度的增加,远场辐射角度最大可达到21.6°。基于混合结构,通过改变光学强度和波段进而影响辐射模式,最终调控偏转角度,这为进一步研究和应用于光束转向和光学调制奠定了基础。

基于ITO柔性透明偏振不敏感超宽带超材料吸波器

设计了一种基于电阻膜氧化铟锡(ITO)的柔性透明偏振不敏感超宽带吸波器,并对其进行了分析和制备。利用ITO电阻膜图样产生欧姆损耗实现高吸收。仿真结果表明设计的超材料吸波器在2.7~12.1 GHz范围内可实现高于90%吸收率,相对带宽为127%,覆盖了S、C、X波段。由于结构的对称性,该吸波器对偏振角不敏感,且在45°宽入射角范围内具有高吸收率。通过阻抗匹配、等效电路理论、电场以及电流分布、结构参数分析了吸收机理。实验测量结果与仿真结果一致。该超材料吸波器具有超宽带吸收、极化不敏感和灵活性好等优点,可广泛应用于电磁屏蔽、雷达隐身技术等领域。

基底温度对射频磁控溅射PI基ITO薄膜的影响

采用射频(RF)磁控溅射法在柔性耐高温聚酰亚胺(PI)薄膜上沉积了氧化铟锡(ITO)薄膜,研究了基底温度对ITO薄膜性能的影响。运用四探针测试仪研究了基底温度对ITO薄膜方块电阻及电阻率的影响,并用扫描电子显微镜(SEM)、X射线衍射仪(XRD)研究了基底温度对ITO薄膜表面形貌及结晶度的影响。采用X射线光电子能谱仪(XPS)、附着力测试仪分析电学性能最优的样品化学组成与附着力。研究结果表明,ITO薄膜方块电阻及电阻率随基底温度上升先下降后上升,在基底温度为250℃时,ITO薄膜方块电阻为14.1Ω/□,电阻率为1.9×10^(-4)Ω·cm,基膜附着力好,薄膜结晶度高,(222)晶面存在择优取向。

射频磁控溅射工艺参数对掺钨氧化铟锡透明导电薄膜性能的影响

ITO薄膜是目前应用最为广泛的透明导电薄膜,通过在ITO中掺杂其他金属可以进一步改善ITO薄膜的光学和电学性能。本文采用射频(RF)磁控溅射法制备了掺钨氧化铟锡(ITO∶W)透明导电薄膜,研究了薄膜厚度、表面形貌、晶体结构以及光学和电学性能与各溅射参数之间的关系。当溅射功率大于40 W时,制备的ITO∶W薄膜为方铁锰矿结构的多晶薄膜,此时薄膜表面光滑平整而且具有良好的结晶性。在基板温度320℃、溅射功率80 W、溅射时间15 min、工作气压0.6 Pa条件下得到了光学和电学性能优良的ITO∶W薄膜,其方块电阻为10.5Ω/、电阻率为4.41×10^(-4)Ω·cm,对应的载流子浓度为2.23×10^(20)cm^(-3)、迁移率为27.3 cm^(2)·V^(-1)·s^(-1)、可见光(400~700 nm)范围内平均透射率为90.97%。此外,本研究还发现通过调节基板温度影响氧元素的状态可以改变ITO∶W薄膜的电学性能。

ITO薄膜微结构对其光电性质的影响

采用磁控溅射法在玻璃衬底上沉积掺锡氧化铟(ITO)薄膜,用X射线衍射(XRD)、X射线光电子能谱(XPS)技术和电导率、透射光谱测试技术,研究真空低温退火后ITO薄膜微结构、薄膜电导率、光谱透射率的变化.研究表明,真空低温退火使得晶体微结构得到改善,晶体呈(222)择优取向,晶体的结晶颗粒变大.不同价态的Sn对In3+的替代引起晶格结构和ITO薄膜的载流子浓度的变化,从而影响到薄膜的导电性和透射率,证明了真空退火下氧化铟薄膜微结构变化是影响薄膜电导率与透射率的主要原因,为研制新型光电器件的透明电极提供了参考.

制备工艺对纳米级铟锡氧化物(ITO)形貌和电性能的影响

以SnCl4·5H2O、In和浓盐酸为原料,采用化学共沉淀法制备出了纳米级锡掺杂氧化铟(ITO)导电微粉,系统地研究了掺杂量,共沉淀温度,pH值,热处理时间、温度对粉体粒度、形貌和电性能的影响规律。研究表明,合成的ITO粉体分散性较好、导电性能优异,粒径在40nm左右具有立方铁锰矿结构。在ITO纳米导电粉的制备过程中,共沉淀温度和滴定终点pH值对其形貌和性能有很大影响,当共沉淀温度在60℃左右,pH=6时制得的粉体性能最佳。煅烧条件对粉体的形貌、粒度和导电性也有较大的影响,在700℃,4h条件下可以制得导电性能良好,结晶完好,粒度分布均匀的ITO粉体。掺入Sn(Ⅳ)的量对载流子的迁移率有很大的影响,在掺杂浓度为10%左右可制得导电性极佳的纳米ITO粉体。

ITO透明导电薄膜的制备及光电特性研究

论述了高温直流磁控反应溅射法制备ITO透明导电薄膜时氧分压、溅射气压和溅射电流等参数对其光电特性的影响 .当氧分压、溅射气压和溅射电流过高或过低时 ,会导致金属In ,InO ,SnO和Sn3 O4等物质以及晶体缺陷的生成 ,从而降低ITO薄膜的导电性或可见光透过率 ,甚至同时降低其光电性能 .实验结果表明 ,当Ar流量为 4 0 2cm3 ·min-1、温度为 36 0℃和旋转溅射时间为 90min等参数保持不变时 ,ITO薄膜光电特性最佳溅射参数的氧流量为 0 4 2cm3 ·min-1,溅射气压为 0 5Pa ,溅射电流 0 3A(溅射电压约为 2 4 5V ) ,所得薄膜的方块电阻为 5 7Ω、波长为 5 5 0nm的绿光透过率达到 88 6 % (洁净玻璃基底的绿光透光率为 91 6 % ) .

柔性衬底ITO薄膜的制备及其光电性能研究

在室温下,采用直流反应磁控溅射法,在聚酯薄膜(PET)衬底上镀制了高性能的ITO薄膜。为了提高薄膜与基底的结合力,溅射前采用多弧离子源对PET表面进行了等离子体清洗。研究了溅射工艺参数对ITO薄膜的光电性能和红外发射率的影响规律,探讨了ITO膜的透光和导电机理,并分析了方块电阻与红外发射率的相互关系。实验结果表明,通过等离子体清洗,ITO薄膜的结合力和光电性能都得到了改善。ITO薄膜的红外发射率和方块电阻受制备条件的影响规律具有相似之处,红外发射率随薄膜方块电阻的增大而呈增加的趋势。

溅射功率和氧分压对ITO薄膜光电性能的影响研究

采用直流反应磁控溅射法制备了氧化铟锡(ITO)透明导电薄膜,通过四探针、紫外可见分光光度计、X射线衍射(XRD)、霍尔效应仪、扫描电镜(SEM)等对薄膜样品进行了表征,研究了溅射功率和氧分压对ITO薄膜微观结构和光电性能的影响,结果表明:溅射功率对ITO的光电性能影响较小,沉积速率随着溅射功率的增大而加快;随着氧分压的升高,载流子浓度降低,霍尔迁移率先增大后减小,电阻率逐渐增大。在优化的工艺条件下,制备了在可见光区平均透过率达85%、电阻率为1×10-4Ω.cm的光电性能优良的ITO薄膜。