Ti-6Al-4V/Al7050 joints were fabricated by a method of insert molding and corresponding interfacial microstructure and mechanical properties were investigated. The interfacial thickness was sensitive to holding temper...Ti-6Al-4V/Al7050 joints were fabricated by a method of insert molding and corresponding interfacial microstructure and mechanical properties were investigated. The interfacial thickness was sensitive to holding temperature during the first stage, and a good metallurgical bonding interface with a thickness of about 90 μm can be obtained at 750°C. X-ray diffraction, transmission electron microscopy, and thermodynamic analyses showed that the interface mainly contained intermetallic compound TiAl_3 and Al matrix. The joints featured good mechanical properties, i.e., shear strength of 154 MPa, tensile strength of 215 MPa, and compressive strength of 283 MPa, which are superior to those of joints fabricated by other methods. Coherent boundaries between Al/TiAl_3 and TiAl_3/Ti were confirmed to contribute to outstanding interfacial mechanical properties and also explained constant fracture occurrence in the Al matrix. Follow-up studies should focus on improving mechanical properties of the Al matrix by deformation and heat treatment.展开更多
Two modeling methods of the root insert for wind turbine blade are presented,i.e.,the local mesh optimization method(LMOM)and the global modeling method(GMM).Based on the optimized mesh of the local model for the meta...Two modeling methods of the root insert for wind turbine blade are presented,i.e.,the local mesh optimization method(LMOM)and the global modeling method(GMM).Based on the optimized mesh of the local model for the metal contact interface,LMOM is proposed to analyze the load path and stress distribution characteristics,while GMM is used to calculate and analyze the stress distribution characteristics of the resin layer established between the bushing and composite layers of root insert.To validate the GMM,a tension test is carried out.The result successfully shows that the shear strain expresses a similar strain distribution tendency with the GMM′s results.展开更多
This article presents a modeling and simulation method for transient thermal analyses of integrated circuits(ICs)using the original and voltage-in-current(VinC)latency insertion method(LIM).LIM-based algorithms are a ...This article presents a modeling and simulation method for transient thermal analyses of integrated circuits(ICs)using the original and voltage-in-current(VinC)latency insertion method(LIM).LIM-based algorithms are a set of fast transient simulation methods that solve electrical circuits in a leapfrog updating manner without relying on large matrix operations used in conventional Simulation Program with Integrated Circuit Emphasis(SPICE)-based methods which can significantly slow down the solution process.The conversion from the thermal to electrical model is performed first by using the analogy between heat and electrical conduction.Since electrical inductance has no thermal equivalence,a modified VinC LIM formulation is presented which removes the requirement of the insertion of fictitious inductors.Numerical examples are presented,which show that the modified VinC LIM formulation outperforms the basic LIM formulation,in terms of both stability and accuracy in the transient thermal simulation of ICs.展开更多
基金financially supported by the National Natural Science Foundation of China (Nos.51671017 and 51471024)Fundamental Research Funds for the Central Universities (No.FRFBR-15-078A)
文摘Ti-6Al-4V/Al7050 joints were fabricated by a method of insert molding and corresponding interfacial microstructure and mechanical properties were investigated. The interfacial thickness was sensitive to holding temperature during the first stage, and a good metallurgical bonding interface with a thickness of about 90 μm can be obtained at 750°C. X-ray diffraction, transmission electron microscopy, and thermodynamic analyses showed that the interface mainly contained intermetallic compound TiAl_3 and Al matrix. The joints featured good mechanical properties, i.e., shear strength of 154 MPa, tensile strength of 215 MPa, and compressive strength of 283 MPa, which are superior to those of joints fabricated by other methods. Coherent boundaries between Al/TiAl_3 and TiAl_3/Ti were confirmed to contribute to outstanding interfacial mechanical properties and also explained constant fracture occurrence in the Al matrix. Follow-up studies should focus on improving mechanical properties of the Al matrix by deformation and heat treatment.
基金supported jointly by the National Basic Research Program of China("973"Program)(No2014CB046200)the National Science Foundation of Jiangsu Province(No.BK2014059)+1 种基金the Priority Academic Program Development of Jiangsu Higher Education Institutionsthe National Natural Science Foundation of China(No.11172135)
文摘Two modeling methods of the root insert for wind turbine blade are presented,i.e.,the local mesh optimization method(LMOM)and the global modeling method(GMM).Based on the optimized mesh of the local model for the metal contact interface,LMOM is proposed to analyze the load path and stress distribution characteristics,while GMM is used to calculate and analyze the stress distribution characteristics of the resin layer established between the bushing and composite layers of root insert.To validate the GMM,a tension test is carried out.The result successfully shows that the shear strain expresses a similar strain distribution tendency with the GMM′s results.
基金This work was supported by the Fundamental Research Grant Scheme(FRGS)sponsored by the Ministry of Higher Education,Malaysia under Grant No.FRGS/1/2020/TK0/USM/02/7.
文摘This article presents a modeling and simulation method for transient thermal analyses of integrated circuits(ICs)using the original and voltage-in-current(VinC)latency insertion method(LIM).LIM-based algorithms are a set of fast transient simulation methods that solve electrical circuits in a leapfrog updating manner without relying on large matrix operations used in conventional Simulation Program with Integrated Circuit Emphasis(SPICE)-based methods which can significantly slow down the solution process.The conversion from the thermal to electrical model is performed first by using the analogy between heat and electrical conduction.Since electrical inductance has no thermal equivalence,a modified VinC LIM formulation is presented which removes the requirement of the insertion of fictitious inductors.Numerical examples are presented,which show that the modified VinC LIM formulation outperforms the basic LIM formulation,in terms of both stability and accuracy in the transient thermal simulation of ICs.
