Stability analysis of the moving interface in piston- and non-piston-like displacements

From the macroscopic point of view, expressions involving reservoir and operational parameters are established for investigating the stability of moving interface in piston- and non-piston-like displacements. In the case of axisymmetrical piston-like displacement, the stability is related to the moving interface position and water to oil mobility ratio. The capillary effect on the stability of moving interface depends on whether or not the moving interface is already stable and correlates with the wettability of the reservoir rock. In the case of non-piston-like displacement, the stability of the front is governed by both the relative permeability and the mobility ratio.

The Numerical Analysis of Strain Behavior at Solder Joint and Interface of Flip Chip Package

The flip chip package is a kind of advanced electri ca l packages. Due to the requirement of miniaturization, lower weight, higher dens ity and higher performance in the advanced electric package, it is expected that flip chip package will soon be a mainstream technology. The silicon chip is dir ectly connected to printing circuit substrate by SnPb solder joints. Also, the u nderfill, a composite of polymer and silica particles, is filled in the gap betw een the chip and substrate around the solder joints to improve the reliabili ty of solder joints. When flip chip package specimen is tested with thermal cycl ing, the cyclic stress/strain response that exists at the underfill interfaces and solder joints may result in interfacial crack initiation and propagation. Therefore, the chip cracking and the interfacial delamination between underfill and chip corner have been investigated in many studies. Also, most researches h ave focused on the effect of fatigue and creep properties of solder joint induce d by the plastic strain alternation and accumulation. The nuderfill must have lo w viscosity in the liquid state and good adhesion to the interface after solidif ying. Also, the mechanical behavior of such epoxy material has much dependen ce on temperature in its glass transition temperature range that is usually cove red by the temperature range of thermal cycling test. Therefore, the materia l behavior of underfill exists a significant non-linearity and the assumption o f linear elastic can lack for accuracy in numerical analysis. Through numerical analysis, this study had some comparisons about the effect of linear and non -linear properties of underfill on strain behaviors around the interface of fli p chip assembly. Especially, the deformation tendency inside solder bumps could be predicted. Also, it is worthily mentioned that we have pointed out which comp onent of plastic strain, thus, either normal or shear, has dominant influence to the fatigue and creep of solder bump, which have not brought up before. About the numerical analysis to the thermal plastic strain occurs in flip chip i nterconnection during thermal cycling test, a commercial finite element software , namely, ANSYS, was employed to simulate the thermal cycling test obeyed by MIL-STD-883C. The temperatures of thermal cycling ranged from -55 ℃ to 125 ℃ with ramp rate of 36 ℃/min and a dwell time of 25 min at peak temperature. T he schematic drawing of diagonal cross-section of flip chip package composed of FR-4 substrate, silicon chip, underfill and solder bump was shown as Fig.1. Th e numerical model was two-dimensional (2-D) with plane strain assumption and o nly one half of the cross-section was modeled due to geometry symmetry. The dim ensions and boundary conditions of numerical model were shown in Fig.2. The symm etric boundary conditions were applied along the left edge of the model, and the left bottom corner was additional constrained in vertical direction to prevent body motion. The finite element meshes of overall and local numerical model was shown as Fig.3. In this study, two cases of material model were used to describe the material behavior of the underfill: the case1 was linear elastic model that assumed Young’s Modulus (E) and thermal expansion coefficient (CTE) were consta nt during thermal cycling; the case2 was MKIN model (in ANSYS) that had nonlinea r temperature-dependent stress-strain relationship and temperature-dependent CTE. The material model applied to the solder bump was ANAND model (in ANSYS) th at described time-dependent plasticity phenomenon of viscoplastic material. Bot h the FR-4 substrate and silicon chip were assumed as temperature-independent elastic material; moreover, FR-4 substrate is orthotropic while silicon chip is isotropic. From the comparison between numerical results of linear and nonlinear material a ssumption of underfill, (i.e. case1 and case2), the quantities of plastic strain around the interconnection from case1 are higher than that in case2. Thus, the linear

Acoustic emission assessment of interface cracking in thermal barrier coatings

In this paper,acoustic emission（AE） and digital image correlation methods were applied to monitor interface cracking in thermal barrier coatings under compression.The interface failure process can be identifie via its AE features,including buckling,delamination incubation and spallation.According to the Fourier transformation of AE signals,there arefourdifferentfailuremodes：surfaceverticalcracks,opening and sliding interface cracks,and substrate deformation.The characteristic frequency of AE signals from surface vertical cracks is 0.21 MHz,whilst that of the two types of interface cracks are 0.43 and 0.29 MHz,respectively.The energy released of the two types of interface cracks are 0.43 and 0.29 MHz,respectively.Based on the energy released from cracking and the AE signals,a relationship is established between the interface crack length and AE parameters,which is in good agreement with experimental results.

Multi-channel microfluidic chip-mass spectrometry platform for cell analysis

In this review, we highlight the latest development of multi-channel microfluidic chip-mass spectrometry（chip-MS） in cell analysis and metabolite detection. Following a brief introduction about history and development of multi-channel microchip and MS combination, we will elaborate the key issues of constructing chip-MS platform interface. Then exciting progresses made in this field should be reviewed with well exemplified works, including chip-MS technology for cell introduction, pretreatment of cell secretions and cell metabolite analysis. We will also describe the development of integrated total analysis systems proposed by our group. We hope this brief review will inspire interested readers and provide knowledge about chip-MS platform in the bioanalysis field, particularly in cell analysis and metabolite identifying applications.

Joint Characteristics and Corrosion Properties of Bypass-Current Double-Sided Arc-Welded Aluminum 6061 Alloy with Al–Si Filler Metal

Sheets of aluminum 6061 alloy were welded using bypass-current double-sided arc welding with Al-Si filler wire to investigate the effect of Al-Si intermetallic compounds on the microstructure, microhardness and corrosion behavior of weld joint. Experimental results indicated that the Al4.5FeSi phase in the topside of the weld joint was finer than that in the backside and newly formed phase of Al0.5Fe3Si0.5 was observed in the backside. The formation of reinforcing phases of Al-Fe-Si in the weld improved the microhardness of the weld by about 18%. The corrosion resistance of the weld zone was greater than that of the base metal, while the corrosion current displayed opposite, and the corrosion resistance of the weld region was better than that of the base metal.

Effect of Heat Input on Microstructure and Mechanical Properties of Joints Made by Bypass-Current MIG Welding–Brazing of Magnesium Alloy to Galvanized Steel

Experiments were carried out with bypass-current MIG welding–brazing of magnesium alloy to galvanized steel to investigate the effect of heat input on the microstructure and mechanical properties of lap joints. Experimental results indicated that the joint efficiency tended to increase at first and then to reduce with the increase of heat input. The joint efficiency reached its maximum of about 70% when the heat input was 155 J/mm. The metallurgical bonding between magnesium alloy and steel was a thin continuous reaction layer, and the intermetallic compound layer consisted of Mg–Zn and slight Fe–Al phases. It is concluded that bypass-current MIG welding–brazing is a stable welding process, which can be used to achieve defect-free joining of magnesium alloy to steel with good weld appearances.

Trimethoxyboroxine as an electrolyte additive to enhance the 4.5​V cycling performance of a Ni-rich layered oxide cathode

Ni-rich layered oxides are attractive cathode materials for advanced lithium-ion batteries(LIBs)due to their high energy density.However,their large-scale application is seriously hindered by their interfacial instability,especially at a high cut-off potential.Here,we demonstrate that trimethoxyboroxine(TMOBX)is an effective film-forming additive to address the interfacial instability of LiNi0.8Co0.1Mn0.1O_(2)(NCM811)material at a high cut-off voltage of 4.5​V.We find that TMOBX decomposes before carbonate solvent and forms a thin cathode electrolyte interphase(CEI)layer on the surface of the NCM811 material.This TMOBX-formed CEI significantly suppresses electrolyte decomposition at a high potential and inhibits the dissolution of transition metals from NCM811 during cycling.In addition,electron-deficient borate compounds coordinate with anions(PF6^(−),F^(-) etc.)and H2O in the battery,further improving the battery's stability.As a result,adding 1.0​wt%of TMOBX boosts the capacity retention of a Li||NCM811​cell from 68.72%to 86.60%after 200 cycles at 0.5C in the range of 2.8–4.5​V.

Promising commercial reinforcement to the nanodiamond/epoxy composite by grafting ammonium ions

A simple, economic, efficient and eco-friendly nanodiamond （ND） modifying method to reinforce the ND]epoxy composite for the industrialization of the high-performance ND/epoxy composite is always desired. In the present work, the ND was successfully modified only using aqueous ammonia through an easy-to-operate method by replacing the hydrogen atoms in the carboxyl group with ammonium ions. Ammonia, which is the only pollutant in the process, could be recycled. The modified ND/epoxy composite showed an overwhelming advantage over the neat epoxy or the ND/epoxy composite in storage modulus in their glassy state without any degradation of tensile strength, hardness and fracture toughness.