Acoustic emission assessment of interface cracking in thermal barrier coatings

In this paper,acoustic emission（AE） and digital image correlation methods were applied to monitor interface cracking in thermal barrier coatings under compression.The interface failure process can be identifie via its AE features,including buckling,delamination incubation and spallation.According to the Fourier transformation of AE signals,there arefourdifferentfailuremodes：surfaceverticalcracks,opening and sliding interface cracks,and substrate deformation.The characteristic frequency of AE signals from surface vertical cracks is 0.21 MHz,whilst that of the two types of interface cracks are 0.43 and 0.29 MHz,respectively.The energy released of the two types of interface cracks are 0.43 and 0.29 MHz,respectively.Based on the energy released from cracking and the AE signals,a relationship is established between the interface crack length and AE parameters,which is in good agreement with experimental results.

SCATTERING OF SH-WAVES BY AN INTERACTING INTERFACE LINEAR CRACK AND A CIRCULAR CAVITY NEAR BIMATERIAL INTERFACE

An analytical method is developed for scattering of SH-waves and dynamic stressconcentration by an interacting interface crack and a circular cavity near bimaterial interface.Asuitable Green’s function is contructed,which is the fundamental solution of the displacement fieldfor an elastic half space with a circular cavity impacted by an out-plane harmonic line source loadingat the horizontal surface.First,the bimaterial media is divided into two parts along the horizontalinterface,one is an elastic half space with a circular cavity and the other is a complete half space.Then the problem is solved according to the procedure of combination and by the Green’s functionmethod.The horizontal surfaces of the two half spaces are loaded with undetermined anti-plane forcesin order to satisfy continuity conditions at the linking section,or with some forces to recover cracks bymeans of crack-division technique.A series of Fredholm integral equations of first kind for determiningthe unknown forces can be set up through continuity conditions as expressed in terms of the Green’sfunction.Moreover,some expressions are given in this paper,such as dynamic stress intensity factor(DSIF)at the tip of the interface crack and dynamic stress concentration factor(DSCF)around thecircular cavity edge.Numerical examples are provided to show the influences of the wave numbers,the geometrical location of the interface crack and the circular cavity,and parameter combinations ofdifferent media upon DSIF and DSCF.

Exact solution of plane isolated crack normal to a bimaterial interface of infinite extent

This paper presents an exact solution for the transverse interface crack in the plane strain case. The crack is perpendicular to the interface and in one material. The exact complex stress functions are first obtained with some unknown constants. The satisfactions of all boundary conditions are then checked, the condition at infinity is considered and the unknown constants are determined. Further study may focus on the case with different shear moduli and the influence of the large deformation.

STRESS SINGULARITY ANALYSIS AT CRACK TIP ON BI-MATERIAL INTERFACES BASED ON HAMILTONIAN PRINCIPLE

In this paper, the stress singularity analysis at the crack tip on elastic bi-material interfaces is considered. The governing equations of plane elasticity In sectorial domain are derived to be in Hamiltonian form via variable substitution and variational principle. The methods of separation of variables and conjugate symplectic eigen-function expansion are developed to solve the equations in sectorial domain. The general formulae for the solution of stress singularities at the crack tip on bi-material interfaces are put forward, and a new solution technique for fracture problems is presented.

Evaluation of stress intensity factors for bi-material interface cracks using displacement jump methods

The aim of the present work is to investigate the numerical modeling of interfacial cracks that may appear at the interface between two isotropic elastic materials. The extended finite element method is employed to analyze brittle and bi-material interfacial fatigue crack growth by computing the mixed mode stress intensity factors(SIF). Three different approaches are introduced to compute the SIFs. In the first one, mixed mode SIF is deduced from the computation of the contour integral as per the classical J-integral method,whereas a displacement method is used to evaluate the SIF by using either one or two displacement jumps located along the crack path in the second and third approaches. The displacement jump method is rather classical for mono-materials,but has to our knowledge not been used up to now for a bimaterial. Hence, use of displacement jump for characterizing bi-material cracks constitutes the main contribution of the present study. Several benchmark tests including parametric studies are performed to show the effectiveness of these computational methodologies for SIF considering static and fatigue problems of bi-material structures. It is found that results based on the displacement jump methods are in a very good agreement with those of exact solutions, such as for the J-integral method, but with a larger domain of applicability and a better numerical efficiency(less time consuming and less spurious boundary effect).

Effects of electric/magnetic impact on the transient fracture of interface crack in piezoelectric-piezomagnetic sandwich structure: anti-plane case

Due to the incompatibility of the interlaminar deformations,the interface debonding or cracking usually happens in a layered magnetoelectric(ME)structure under an applied load.In this paper,the transient responses of the anti-plane interface cracks in piezoelectric(PE)-piezomagnetic(PM)sandwich structures are studied by the standard methods of the integral transform and singular integral equation.Discussion on the numerical examples indicates that the PE-PM-PE structure under electric impact is more likely to fracture than the PM-PE-PM structure under a magnetic impact.The dynamic stress intensity factors(DSIFs)are more sensitive to the variation of the active layer thickness.The effects of the material constants on the DSIFs are dependent on the roles played by PE and PM media during the deformation process.

Analysis of a permeable interface crack in elastic dielectric/piezoelectric bimaterials

A permeable interface crack between elastic dielectric material and piezoelectric material is studied based on the extended Stroh＇s formalism. Motivated by strong engineering demands to design new composite materials, the authors perform numerical analysis of interface crack tip singularities and the crack tip energy release rates for 35 types of dissimilar bimaterials, respectively, which are constructed by five kinds of elastic dielectric materials： Epoxy, Polymer, Al2O3, SiC, and Si3N4 and seven kinds of practical piezoelectric ceramics： PZT-4, BaTiO3, PZT-5H, PZT-6B, PZT-TA, P-7, and PZT-PIC 151, respectively. The elastic dielectric material with much smaller permittivity than commercial piezoelectric ceramics is treated as a special transversely isotropic piezoelectric material with extremely small piezoelectricity. The present investigation shows that the structure of the singular field near the permeable interface crack tip consists of three singularities： r^-1/2±iε and r^-1/2, which is quite different from that in the impermeable interface crack. It can be concluded that different far field loading cases have significant influence on the near-tip fracture behaviors of the permeable interface crack. Based on the present theoretical treatment and numerical analysis, the electric field induced crack growth is well explained, which provides a better understanding of the failure mechanism induced from interface crack growth in elastic dielectric/piezoelectric bimaterials.

Stress field near interface crack tip of double dissimilar orthotropic composite materials

In this paper, double dissimilar orthotropic composite materials interfacial crack is studied by constructing new stress functions and employing the method of composite material complex. When the characteristic equations＇ discriminants △1 〉 0 and △2 〉0, the theoretical formula of the stress field and the displacement field near the mode I interface crack tip are derived, indicating that there is no oscillation and interembedding between the interfaces of the crack.

THE SCATTERING OF GENERAL SH PLANE WAVE BY INTERFACE CRACK BETWEEN TWO DISSIMILAR VISCOELASTIC BODIES

The scattering of general SH plane wave by an interface crack between two dissimilar viscoelastic bodies is studied and the dynamic stress intensity factor at the crack-tip is computed. The scattering problem can be decomposed into two problems: one is the reflection and refraction problem of general SH plane waves at perfect interface (with no crack); another is the scattering problem due to the existence of crack. For the first problem, the viscoelastic wave equation, displacement and stress continuity conditions across the interface are used to obtain the shear stress distribution at the interface. For the second problem, the integral transformation method is used to reduce the scattering problem into dual integral equations. Then, the dual integral equations are transformed into the Cauchy singular integral equation of first kind by introduction of the crack dislocation density function. Finally, the singular integral equation is solved by Kurtz's piecewise continuous function method. As a consequence, the crack opening displacement and dynamic stress intensity factor are obtained. At the end of the paper, a numerical example is given. The effects of incident angle, incident frequency and viscoelastic material parameters are analyzed. It is found that there is a frequency region for viscoelastic material within which the viscoelastic effects cannot be ignored.

Analysis of stress intensity factor in orthotropic bi-material mixed interface crack

Adopting the complex function approach, the paper studies the stress intensity factor in orthotropic bi-material interface cracks under mixed loads. With con- sideration of the boundary conditions, a new stress function is introduced to transform the problem of bi-material interface crack into a boundary value problem of partial dif- ferential equations. Two sets of non-homogeneous linear equations with 16 unknowns are constructed. By solving the equations, the expressions for the real bi-material elastic constant εt and the real stress singularity exponents λt are obtained with the bi-material engineering parameters satisfying certain conditions. By the uniqueness theorem of limit, undetermined coefficients are determined, and thus the bi-material stress intensity factor in mixed cracks is obtained. The bi-material stress intensity factor characterizes features of mixed cracks. When orthotropic bi-materials are of the same material, the degenerate solution to the stress intensity factor in mixed bi-material interface cracks is in complete agreement with the present classic conclusion. The relationship between the bi-material stress intensity factor and the ratio of bi-material shear modulus and the relationship be- tween the bi-material stress intensity factor and the ratio of bi-material Young＇s modulus are given in the numerical analysis.

The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading

This paper studies the dynamic stress intensity factor （DSIF） at the interface in an adhesive joint under shear loading. Material damage is considered. By introducing the dislocation density function and using the integral transform, the problem is reduced to algebraic equations and can be solved with the collocation dots method in the Laplace domain. Time response of DSIF is calculated with the inverse Laplace integral transform. The results show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, while decreases with the swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is -0.5 and independent on the material parameters, damage conditions of materials, and time. The oscillatory index is controlled by viscoelastic material parameters.

DYNAMIC BEHAVIOR OF TWO UNEQUAL PARALLEL PERMEABLE INTERFACE CRACKS IN A PIEZOELECTRIC LAYER BONDED TO TWO HALF PIEZOELECTRIC MATERIALS PLANES

The dynamic behavior of two unequal parallel permeable interface cracks in a piezoelectric layer bonded to two half-piezoelectric material planes subjected to harmonic anti-plane shear waves is investigated. By using the Fourier transform, the problem can be solved with the help of two pairs of dual integral equations in which the unknown variables were the jumps of the displacements across the crack surfaces. Numerical results are presented graphically to show the effects of the geometric parameters, the frequency of the incident wave on the dynamic stress intensity factors and the electric displacement intensity factors. Especially, the present problem can be returned to static problem of two parallel permeable interface cracks. Compared with the solutions of impermeable crack surface condition, it is found that the electric displacement intensity factors for the permeable crack surface conditions are much smaller.

Interface crack problems for mode Ⅱ of double dissimilar orthotropic composite materials

The fracture problems near the similar orthotropic composite materials are interface crack tip for mode Ⅱ of double disstudied. The mechanical models of interface crack for mode Ⅱ are given. By translating the governing equations into the generalized hi-harmonic equations, the stress functions containing two stress singularity exponents are derived with the help of a complex function method. Based on the boundary conditions, a system of non-homogeneous linear equations is found. Two real stress singularity exponents are determined be solving this system under appropriate conditions about bimaterial engineering parameters. According to the uniqueness theorem of limit, both the formulae of stress intensity factors and theoretical solutions of stress field near the interface crack tip are derived. When the two orthotropic materials are the same, the stress singularity exponents, stress intensity factors and stresses for mode II crack of the orthotropic single material are obtained.

SCATTERING OF HARMONIC ANTI-PLANE SHEAR WAVES BY AN INTERFACE CRACK IN MAGNETO-ELECTRO-ELASTIC COMPOSITES

The dynamic behavior of an interface crack in magneto-electro-elastic composites under harmonic elastic anti-plane shear waves is investigated for the permeable electric boundary conditions. By using the Fourier transform, the problem can be solved with a pair of dual integral equations in which the unknown variable was the jump of the displacements across the crack surfaces. To solve the dual integral equations, the jump of the displacements across the crack surface was expanded in a series of Jacobi polynomials. Numerical examples were provided to show the effect of the length of the crack, the wave velocity and the circular frequency of the incident wave on the stress, the electric displacement and the magnetic flux intensity factors of the crack. From the results, it can be obtained that the singular stresses in piezoelectric/piezomagnetic materials carry the same forms as those in a general elastic material for anti-plane shear problem.

A STUDY OF DYNAMIC CAUSTICS AROUND RUNNING INTERFACE CRACK TIP

Based on the first invariant of stress singular field in the vicinity of running tip of an interface crack, mapping equations of the caustic curve on the reference plane and the initial curve on the specimen plane are developed. The dynamic caustics are analyzed for the crack propagating along the interface between two bonded dissimilar materials. The variation of the caustic configurations is shown with the velocity change of the running crack and the ratio change of the stress intensity factors. Two characteristic dimensions are proposed that are not only practically measurable from optical caustic contours but also suitable to represent the behavior of transient caustics.

ELASTIC-PLASTIC CRACK GROWTH ON PLANE STRAIN BIMATERIAL INTERFACE

Finite element computations are carried out to simulate plane strain crack growth on a bimaterial interface under the assumption of small scale yielding.The modified Guron constitutive equation and the element vanish technique introduced by Tvergaard et al.are used to model the final formation of an open crack.It is found from the calculation that the critical fracture toughness for crack growth is much low- er in bimaterials than that in homogeneous material.The critical fracture toughness is strongly dependent on material properties of the bimaterial pair and the mixed mode of remote loads.The interface crack grows in the more compliant(lower hardening)material or in the weaker(lower yield strength)material.In Mode-Ⅰ loading,the crack grows zigzag along the interface.

INTERACTION OF A DISLOCATION DIPOLE WITH A MODE III INTERFACE CRACK

Interaction between a screw dislocation dipole and a mode III interface crack is investigated. By using the complex variable method, the closed form solutions for complex potentials are obtained when a screw dislocation dipole lies inside a medium. The stress fields and the stress intensity factors at the tip of the interface crack produced by the screw dislocation dipole are given. The influence of the orientation, the dipole arm and the location of the screw dislocation dipole as well as the material mismatch on the stress intensity factors is discussed. The image force and the image torque acting on the screw dislocation dipole center are also calculated. The mechanical equilibrium position of the screw dislocation dipole is examined for various material property combinations and crack geometries. The results indicate that the shielding or anti-shielding effect on the stress intensity factor increases abruptly when the dislocation dipole approaches the tip of the crack. Additionally, the disturbation of the interface crack on the motion of the dislocation dipole is also significant.

SIF-based fracture criterion for interface cracks

The complex stress intensity factor K governing the stress field of an interface crack tip may be split into two parts, i.e.,■ and s^（-iε）, so that K = ■ s^（-iε）, s is a characteristic length and ε is the oscillatory index. ■ has the same dimension as the classical stress intensity factor and characterizes the interface crack tip field. That means a criterion for interface cracks may be formulated directly with■, as Irwin（ASME J. Appl. Mech. 24：361–364, 1957） did in 1957 for the classical fracture mechanics. Then, for an interface crack,it is demonstrated that the quasi Mode I and Mode II tip fields can be defined and distinguished from the coupled mode tip fields. Built upon SIF-based fracture criteria for quasi Mode I and Mode II, the stress intensity factor（SIF）-based fracture criterion for mixed mode interface cracks is proposed and validated against existing experimental results.

INVESTIGATION OF BEHAVIOR OF MODE-I INTERFACE CRACK IN PIEZOELECTRIC MATERIALS BY USING SCHMIDT METHOD

The behavior of a Mode-Ⅰ interface crack in piezoelectric materials was investigated under the assumptions that the effect of the crack surface overlapping very near the crack tips was negligible. By use of the Fourier transform, the problem can be solved with the help of two pairs of dual integral equations. To solve the dual integral equations, the jumps of the displacements across the crack surfaces were expanded in a series of Jacobi polynomials. It is found that the stress and the electric displacement singularities of the present interface crack solution are the same as ones of the ordinary crack in homogenous materials. The solution of the present paper can be returned to the exact solution when the upper half plane material is the same as the lower half plane material.

INTERFACE CRACK IN BIPIEZOTHERMOELASTIC MEDIA

By using the extended version of Eshelby-Stroh's formulation and the method of analytical continuation, the problems of interface cracks are reduced to a Hilbert problem of vector form. A general explicit closed form solution for the piezothermoelastic interface crack problem is then obtained, the whole field solutions of temperature, heat flux, displacements, electric field, stress and electric induction are given, the explicit expressions for the crack opening displacements and electric potential are also provided.