High‑Performance Silicon‑Rich Microparticle Anodes for Lithium‑Ion Batteries Enabled by Internal Stress Mitigation

Si is a promising anode material for Li ion batteries because of its high specific capacity,abundant reserve,and low cost.However,its rate performance and cycling stability are poor due to the severe particle pulverization during the lithiation/delithiation process.The high stress induced by the Li concentration gradient and anisotropic deformation is the main reason for the fracture of Si particles.Here we present a new stress mitigation strategy by uniformly distributing small amounts of Sn and Sb in Si micron-sized particles,which reduces the Li concentration gradient and realizes an isotropic lithiation/delithiation process.The Si8.5Sn0.5Sb microparticles(mean particle size:8.22μm)show over 6000-fold and tenfold improvements in electronic conductivity and Li diffusivity than Si particles,respectively.The discharge capacities of the Si_(8.5)Sn_(0.5)Sb microparticle anode after 100 cycles at 1.0 and 3.0 A g^(-1)are 1.62 and 1.19 Ah g^(-1),respectively,corresponding to a retention rate of 94.2%and 99.6%,respectively,relative to the capacity of the first cycle after activation.Multicomponent microparticle anodes containing Si,Sn,Sb,Ge and Ag prepared using the same method yields an ultra-low capacity decay rate of 0.02%per cycle for 1000 cycles at 1 A g^(-1),corroborating the proposed mechanism.The stress regulation mechanism enabled by the industry-compatible fabrication methods opens up enormous opportunities for low-cost and high-energy-density Li-ion batteries.

Construction of 3D Shape-Changing Hydrogels via Light-Modulated Internal Stress Fields

The 3D shape-changing hydrogels are highly pursued for numerous applications.However,up to now,the construction of complex 3D shape-changing hydrogels remains a challenge.The reported design strategies are mainly applied to fabricate 2D ones by introducing anisotropic microstructures into hydrogel sheets/membranes.Herein,we present a convenient photolithography strategy for constructing complex 3D shape-changing hydrogels by simultaneously modulating anisotropic microstructures and internal stress fields of gel sheets.When the precursor solution containing ultraviolet(UV)absorber is irradiated by single-side UV light,the attenuated polymerization rate can cause the generation of asymmetric internal stress field in the resulting hydrogel sheet.In the meantime,the directional diffusion of unpolymerized monomers allows for the formation of vertical gradient structure within hydrogel.Therefore,by applying different photomasks to modulate the local gradient structures and internal stress fields of the gel sheets,they can spontaneously transform into various complex 3D shape-changing hydrogels in the air.Response to the external stimuli,these 3D shape-changing hydrogels(e.g.,fighter plane,birdie,and multi-storey origami lattices)can deform in a novel 3D_(1)-to-3D_(2)-to-3D_(3)mode.This new design strategy contributes to the development of complex biomedical implants and soft robotics.

Internal stress analysis of electroplated films based on electron theory

Cu films on Fe, Ni and Ag substrates, Ni films on Fe and Ag substrates, Ag film on Cu substrate, Cr film on Fe substrate, Ag film on Ag substrate, Ni film on Ni substrate and Cu film on Cu substrate were deposited by electroplating. The average internal stress in all films, except Cr, was in-situ measured by the cantilever beam test. The interfacial stress is very large in the films with different materials with substrates and is zero in the films with the same material with substrates. The interfacial stress character obtained from the cantilever beam bending direction is consistent with that obtained from the modified Thomas–Fermi–Dirac electron theory.

Effect of the Cool System on Internal Stress of CaO-Al_2O_3-SiO_2 Glass-ceramic System

The samples were attained through altering the cooling system of producing glass-ceramics. The X-ray diffraction was used to test the stress value of different samples. The relation of the cooling system and internal stress were also investigated. The experimental results show that the stress of glass-ceramic had a close relation with starting cool temperature. Above 800 ~C, glass-ceramic could be accelerated cooling and did not bring stress. Temperature between 500 ℃ and 800℃ was an important temperature range of the formation of stress in glass-ceramic, in which the glass-ceramic stress would change obviously. Cool system was the key on how to control and eliminate internal stress in order to reduce the destroy of materials crated by internal stress. In addition, glass particles size increase, glass-ceramic stress increase in consequent.

Structure and internal stress of Au films deposited on SiO_2/Si(100) and mica by dc sputtering

Au films with a thickness of about 300 nm were deposited on SiO_2/Si(100) andmica substrates by dc sputtering. X-ray diffraction spectroscopy and field emission scanningelectron microscopy were used to analyze the structure and internal stress of the Au films. Thefirms grown on SiO_2/Si(100) show a preferential orientation of [111] in the growth direction.However the films grown on mica have mixture crystalline orientations of [111], [200], [220] and[311] in the growth direction and the orientations of [200] and [311] are slightly more than thoseof [111] and [220]. An internal stress in the films grown on SiO_2/Si(100) is tensile. For Au filmsgrown on mica the internal stresses in the [111]- and [311]-orientation grains are compressive whilethose in the [200]- and [220]-orientation grains are tensile. Au films grown SiO_2/Si(100) havesome very large grains with a size of about 400 nm and have a wider grain size distribution comparedwith those grown on mica.

Effect of Wafer Size on the Film Internal Stress Measurement by Wafer Curvature Method

Wafer curvature method has been applied to determine the internal stress in the films using Stoney＇s equation.During the film deposition,the wafer fixation on the sample holder will restrict the deformation of the rectangle-shaped wafer,which may result in the stress datum difference along length and width direction.In this paper,the effect of wafer size and the wafer fixation on the TiN film internal stress measured by wafer curvature method was discussed.The rectangle-shaped wafers with different length/width ratios（L/W=1：1,2：1,3：1 and 4：1） were fixed as a cantilever beam.After the TiN films deposition,the profiles of the film/wafer were measured using a stylus profilometer and then the internal stress was calculated using the Stoney equation in the film.The results showed that the fixed end of the wafers limited to some degree the curvature of the wafers along the width direction.For film internal stress measured by wafer curvature method,the wafer profile should be scanned along the length direction and the scan distance should be greater than or equal to half of wafer length.When the length/width ratio of the wafer reached 3：1,the wafer curvature and the calculated stress were basically the same at different positions along the length direction.For film internal stress measured by wafer curvature method,it was recommended that the length/width ratio of wafer should be considered to be greater than or equal to 3：1,and the deformed profile was scanned along the length direction.

Geometrical shape of in-plane inclusion characterized by polynomial internal stress field under uniform eigenstrains

The internal stress field of an inhomogeneous or homogeneous inclusion in an infinite elastic plane under uniform stress-free eigenstrains is studied. The study is restricted to the inclusion shapes defined by the polynomial mapping functions mapping the exterior of the inclusion onto the exterior of a unit circle. The inclusion shapes, giving a polynomial internal stress field, are determined for three types of inclusions, i.e., an inhomogeneous inclusion with an elastic modulus different from the surrounding matrix, an inhomogeneous inclusion with the same shear modulus but a different Poisson＇s ratio from the surrounding matrix, and a homogeneous inclusion with the same elastic modulus as the surrounding matrix. Examples are presented, and several specific conclusions are achieved for the relation between the degree of the polynomial internal stress field and the degree of the mapping function defining the inclusion shape.

Problems in the Determination of Internal Stresses in Plasma Assisted CVD TiN Films

The measurement of internal stresses in a PACVD TiN film proved experimentally to be difficult by a conventional X-ray diffraction technique.The linear relationship between 2θ and sin^2(?) could hardly be reached in some cases.Nevertheless.a good confirmation between the variation of FWHM-sin^2(?) and 20-sin^2(?) was revealed for every nonlinear forms.It followed that the effect of nondistributed micro-strains might exist in plasma assisted vapor deposited films,which usually have a strong crystal orientation,and the method of effectively separating macro-stress and micro-strain must be applied for the precise determination of internal stresses in PACVD films.

SPONTANEOUS POLARIZATION AND THE DISTRIBUTION OF INTERNAL STRESS AND ELECTRIC FIELDS AROUND A TRIPLE POINT

In this article, distributions of internal stress and internal electric fields around a triple point of ferroelectric polycrystals generated by the spontaneous deformation and spontaneous polarization were investigated. It was found that when all three grains consist of a single domain, the internal stresses and the internal electric fields do not vanish. Though it may be determined according to the principle of energy, the spontaneous configuration will not be unique without involving other conditions due to the symmetry of the crystal structure.

MEASUREMENT OF INTERNAL STRESSES OF METAL MULTILAYER COMPOSITE COATINGS

The principle, formula and determination of internal stresses of metal multilayer composite coatings by means of the bending strip method were studied. Using this method, internal stresses of ion-plated metal multilayer composite coatings and thick monolayer coating of aluminium bronze, stainless steel and nickel-iron alloy were determined. The reason of decrement in internal stresses of multilayer composite coatings was discussed.

Measurements of Creep Internal Stress Based on Constant Strain Rate and Its Application to Engineering

This research is carried out on the basis of Constant Strain Rate （CSR） to measure creep internal stress. Measurements of creep internal stress are conducted on the material test machine by using the CSR method. A mathematical model of creep internal stress is also proposed and its application is presented in this paper.

Brightening thiocyanate-anion layered perovskite through internal stress modulated nano phase segregation

Thiocyanate-anion(SCN−)two-dimensional(2D)layered perovskite with internal stress-controlled nano phase segregation has been firstly demonstrated as a promising material system for luminescence applications.An interesting energy band structure is found as well as charge transfer process caused by nano phase segregation,which provide an alternative route to overcome the indirect-bandgap luminescence limit of SCN layered perovskites.It is revealed that,within the SCN layered framework,the segregated nano phases exist in a quantum well form,possessing much higher carrier localization and second-order radiative recombination abilities.With the help of internal stress modulation,these advantages can be significantly enhanced and finally contribute to high luminescence performances in visible-red regions.This work provides more potential opportunities for 2D layered perovskite materials in the future optoelectronic applications.

Reduction of internal stress in SU-8 photoresist layer by ultrasonic treatment

At present, high internal stress in SU-8 photoresist layer has become one of the most primary problems and restricted structure stability and higher aspect ratio of SU-8 photoresist. However, the existing studies all focused on optimizing the process pa-rameters or mask design, and could not be popularized. The purpose of this paper is to reduce the internal stress in cured SU-8 photoresist layer by ultrasonic stress relief technology. The ultrasonic stress relief mechanism in SU-8 photoresist layer was presented. Based on improved Stoney’s formula, the profile mothod calculation model for SU-8 internal stress was proposed. The effect of ultrasonic stress relief on SU-8 layers was studied by experiments. Some important factors, such as amplitude of vibration, power input and relief time, were discussed. The values of internal stress before and after the ultrasonic stress relief process were compared. The research results show that the internal stress in cured SU-8 layer can be reduced effectively if the proper experimental parameters are chosen, and ultrasonic stress relief technology in nonmetal field has some practical value.

The effect of intragranular microstress in A1203-SiC nanocomposites

A theoretical model is established to investigate the intragranular particle residual stress in A1203-SiC nanocom-posites. Using this model, we calculate the average compressive stress on the A1203 grain boundary （GB） and the average tensile stress within A1203 grains caused by SiC nanoparticles. The normal compressive stress strengthens the GB, and the average tensile stress weakens the grains. The model gives a reasonable interpretation of the strength changes of A1203-SiC nanocomposites with the number of SiC particles.

Influence of Mechanical Behavior between the Grains on Stress Fluctuation of Aluminum Alloy Thick Plate

The research on fluctuation and inhomogeneity of internal stress of aluminum alloy thick plate is theoretical and technological base for stress control technology. By using X-ray diffraction technique and mechanical test method, aluminum alloy with typical fine sub-grains, coarse recrystallized grains, and second phase was analyzed; the interactive mechanical model between grains was built for analysis of variation of internal stress within the local micro structure by imitating the actual distribution of grains. The experimental result shows that the mechanical model can effectively explain the reason for fluctuation of microscopic stress, which also proves that the inhomogeneous distribution of metal organization is the cause for the complex distribution of microscopic stress. The model can well describe stress distribution of thick plate caused by thermal deformation. Besides, it well describes mechanism of stress fluctuation.

Formation mechanism of ordered stress-relief patterns in a free sustained Cu film system

A nearly free sustained copper （Cu） film system has been successfully fabricated by thermal evaporation deposition of Cu atoms on silicone oil surfaces, and a characteristic ordered pattern has been systematically studied. The ordered pattern, namely, band, is composed of a large number of parallel key-formed domains with different width w but nearly uniform length L; its characteristic values of w and L are very susceptible to the growth period, deposition rate and nominal film thickness. The formation mechanism of the ordered patterns is well explained in terms of the relaxation of the internal stress in the films, which is related to the nearly zero adhesion of the solid-liquid interface. By using a two-time deposition method, it is confirmed that the ordered patterns really form in the vacuum chamber.

Correlation between the Cyclic Stress Behavior and Microstructure in 316LN based on the Analysis of Hysteresis Loops

Total strain controlled cyclic test was performed on 316 LN under uniaxial loadings. Through the partitioning of hysteresis loops, the evolution of two components of cyclic flow stress, the internal and effective stresses, was reported. The former one determines the cyclic stress response. Based on the transmission electron microscopic（TEM） observation on specimens loaded with scheduled cycles, it is found that planar dislocation structures prevail during the entire cyclic process at low strain amplitude, while a remarkable dislocation rearrangement from planar structures to heterogeneous spatial distributions is companied by a cyclic softening behavior at high strain amplitude. The competition between the evolution of the intergranular and the intragranular components of the internal stress caused by the transition of slip mode induces the cyclic hardening and softening at high strain levels. The intergranular internal stress represents the most part of the internal stress at low strain level.

REAL EFFECTS & DIVERSITY TO BE STRESSED IN INTERNATIONAL COOPERATION

In recent years, the Shanghai Institute of Organic Chemistry under the CAS has freed itself from the stereotyped rut of conventional forms in its external intercourse while still sticking fast to upholding its strategic goal of disciplinary development. Our stress in this aspect has shifted to the pursuit of real effects and diversified forms in international S&T exchange. Our exploration features the following four characteristics:

Progress and Challenges Toward Effective Flexible Perovskite Solar Cells

The demand for building-integrated photovoltaics and portable energy systems based on flexible photovoltaic technology such as perovskite embedded with exceptional flexibility and a superior power-to-mass ratio is enormous.The photoactive layer,i.e.,the perovskite thin film,as a critical component of flexible perovskite solar cells(F-PSCs),still faces long-term stability issues when deformation occurs due to encountering temperature changes that also affect intrinsic rigidity.This literature investigation summarizes the main factors responsible for the rapid destruction of F-PSCs.We focus on long-term mechanical stability of F-PSCs together with the recent research protocols for improving this performance.Furthermore,we specify the progress in F-PSCs concerning precise design strategies of the functional layer to enhance the flexural endurance of perovskite films,such as internal stress engineering,grain boundary modification,self-healing strategy,and crystallization regulation.The existing challenges of oxygen-moisture stability and advanced encapsulation technologies of F-PSCs are also discussed.As concluding remarks,we propose our viewpoints on the large-scale commercial application of F-PSCs.

Effect of Black Plate on Corrosion Resistance of T5 Tinplate

The effect of black plate on corrosion resistance of T5 tinplate was studied by glow discharge spectrograph, X-ray diffractometer （XRD）, stress tester, roughness tester and metallographic microscope. The result shows that black plate influences corrosion resistance of T5 tinplate intensely. It also indicates that the increase of content of manganese, phosphorus, silicon and aluminum in black plate would reduce the corrosion resistance of T5 tinplate and the increase of degree of crystal orientation on （200） crystal face, ｜X-Y｜ value （internal stress difference within two orientation）, roughness and exposure degree of iron grain after the same acid wash of black plate would enhance the corrosion resistance of T5 tinplate and the grain number of black plate has small effect on corrosion resistance of T5 tinplate.