Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology

A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sealing ring and the bonding processing are designed, and the amount of solder and the bonding parameters are optimized based on both theoretical and experimental results. Verification shows that oxidation of the solder layer, voids and the scalloped-edge appearance of the Cu6Sn5 phase are successfully avoided. An average shear strength of 19.5 MPa and an excellent leak rate of around 1.9 × 10-9 atm cc/s are possible, meeting the demands of MIL-STD-883E.

Phase field modeling of dendrite growth

Single dendrite and multi-dendrite growth for Al-2 mol pct Si alloy during isothermal solidification are simulated by phase field method. In the case of single equiaxed dendrite growth, the secondary and the necking phenomenon can be observed. For multi-dendrite growth, there exists the competitive growth among the dendrites during solidification. As solidification proceeds, growing and coarsening of the primary arms occurs, together with the branching and coarsening of the secondary arms. When the diffusion fields of dendrite tips come into contact with those of the branches growing from the neighboring dendrites, the dendrites stop growing and being to ripen and thicken.

Dynamic study in partial transient liquid phase bonding of Si_3N_4

Dynamics in partial transient liquid phase bonding (PTLP bonding) of Si_3N_4 ceramic with Ti/Cu/Ti multi-interlayer was systematically studied through micro-analysis of joint interfaces. The results show that growth of reaction layer and isothermal solidification procession do at the same time. Growth of reaction layer and moving of isothermal solidification interface obey the parabolic law governed by the diffusion of participating elements during the PTLP bonding. Coordination of the above two dynamics process is done through time and temperature. When reaction layer thickness is suitable and isothermal solidification process is finished, the high bonding strength at room temperature and high temperature are obtained.

Transient Liquid Phase Bonding of IN738LC/MBF-15/IN738LC:Solidification Behavior and Mechanical Properties

Transient liquid phase（TLP） bonding of IN738 LC superalloy was carried out using a rapidly solidified MBF-15 Ni-based foil. The effects of bonding temperature（1130–1170 °C） and time（5–120 min） as well as foil thickness（35–140 μm） were studied on the microstructure of joint region and its mechanical properties. The solidification sequence in the joint region was found to be（i） formation of γ solid solution in the isothermally solidified zone, followed by（ii） ternary eutectic of γ ＋ Ni3 B ＋ Cr B, and finally（iii） binary eutectic of γ ＋ Ni3 Si in the athermally solidified zone. Fine Ni3 Si particles were also formed via a solid state transformation within the γ matrix in the vicinity of eutectic products. A deviation of isothermal solidification kinetics from the standard parabolic TLP model was observed by increasing the bonding temperature to 1170 °C, which resulted in the formation of eutectic constituents at the joint centerline.The analysis of mechanical and fractographic test results revealed that the samples with complete isothermal solidification exhibit the highest shear strength, whereas the hard eutectic constituents act as preferential failure sites and lead to a significant reduction in the joint shear strength in samples with incomplete isothermal solidification.

Investigation of Solidification and Segregation Characteristics of Cast Ni-Base Superalloy K417G

Differential scanning calorimetry （DSC） analysis, isothermal solidification experiment and Thermo-Calc simulation were employed to investigate solidification characteristics of K417G Ni-base superalloy. Elec- tron probe microanalysis （EPMA） was employed to analyze the segregation characteristics. Liquidus, solidus and the formation temperatures of main phases were measured. In the process of solidification, the volume fraction of liquid dropped dramatically in the initial stage, while the dropping rate became very low in the final stage due to severe segregation of positive segregation elements into the residual liquid. The solidification began with the formation of primary γ. Then with solidification proceeding, Ti and Mo were enriched in the liquid interdendrite, which resulted in the precipitation of MC carbides in the interdendrite. A1 accumulated into liquid at the initial stage, but gathered to solid later due to the precipitation of γ/γ＇ eutectic at the intermediate stage of solidification. However, Co tended to segregate toward the solid phase. In the case of K417G alloy, combining DSC analysis and isothermal solidification experiment is a good way to investigate the solidification characteristics. Thermo-Calc simulation can serve as reference to investigate K417G alloy.