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Laser-Induced Single Event Transients in Local Oxidation of Silicon and Deep Trench Isolation Silicon-Germanium Heterojunction Bipolar Transistors 被引量:2
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作者 李培 郭红霞 +2 位作者 郭旗 张晋新 魏莹 《Chinese Physics Letters》 SCIE CAS CSCD 2015年第8期204-207,共4页
We present a study on the single event transient (SET) induced by a pulsed laser in different silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) with the structure of local oxidation of silicon ... We present a study on the single event transient (SET) induced by a pulsed laser in different silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) with the structure of local oxidation of silicon (LOCOS) and deep trench isolation (DTI). The experimental results are discussed in detail and it is demonstrated that a SiGe HBT with the structure of LOCOS is more sensitive than the DTI SiGe HBT in the SET. Because of the limitation of the DTI structure, the charge collection of diffusion in the DTI SiGe HBT is less than that of the LOCOS SiGe HBT. The SET sensitive area of the LOCOS SiGe HBT is located in the eollector-substrate (C/S) junction, while the sensitive area of the DTI SiGe HBT is located near to the collector electrodes. 展开更多
关键词 LOCOS DTI HBT Laser-Induced Single Event Transients in local oxidation of silicon and Deep Trench Isolation silicon-Germanium Heterojunction Bipolar Transistors
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A novel structure for improving the SEGR of a VDMOS 被引量:1
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作者 唐昭焕 胡刚毅 +4 位作者 陈光炳 谭开洲 刘勇 罗俊 徐学良 《Journal of Semiconductors》 EI CAS CSCD 2012年第4期38-41,共4页
The mechanism of single-event gate-rupture in an N-channel VDMOS in a space radiation environment was analyzed. Based on the mechanism, a novel structure of VDMOS for improving single-event gate-rupture is proposed, a... The mechanism of single-event gate-rupture in an N-channel VDMOS in a space radiation environment was analyzed. Based on the mechanism, a novel structure of VDMOS for improving single-event gate-rupture is proposed, and the structure is simulated and it is demonstrated that it can improve a VDMOS SEGR threshold voltage by 120%. With this structure, the specific on-resistance value of a VDMOS is reduced by 15.5% as the breakdown voltage almost maintains the same value. As only one mask added, which is local oxidation of silicon instead of an active processing area, the new structure VDMOS it is easily fabricated. The novel structure can be widely used in high-voltage VDMOS in a space radiation environment. 展开更多
关键词 VDMOS single event gate-rupture local oxidation of silicon specific on-resistance
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