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提升Low K晶圆划片良率与可靠性的组合划片工艺研究
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作者 李奇哲 夏晨辉 +2 位作者 叶刚 周超杰 王刚 《电子产品可靠性与环境试验》 2023年第6期9-15,共7页
以低介电常数(Low-K)材料覆盖的晶圆为研究对象,对Low K晶圆的划片方案、划片方式和划片工艺参数进行了研究,以解决Low K晶圆划片后崩裂严重等问题,降低Low K晶圆划片后单芯片来料崩裂、隐裂、高金属凸起等缺陷,提升封装后产品的良率与... 以低介电常数(Low-K)材料覆盖的晶圆为研究对象,对Low K晶圆的划片方案、划片方式和划片工艺参数进行了研究,以解决Low K晶圆划片后崩裂严重等问题,降低Low K晶圆划片后单芯片来料崩裂、隐裂、高金属凸起等缺陷,提升封装后产品的良率与可靠性。探讨了适用于Low K晶圆的划片方案,首先,先采用激光开槽剥离Low K层,降低了崩裂等缺陷隐患,随后采用机械切割完成硅基底的切割;然后,基于来料晶圆划片槽特性,采用W式划片方式,提升划片效率;最后,对划片中工艺参数进行调控优化,如降低激光功率以减弱过烧蚀(热效应扩散)带来的划片槽边缘金属凸起高度太大导致的短路风险,将划片后划片槽边缘金属凸起高度控制在≤7μm的要求内。经工艺调试后,采用激光开槽与机械划片的组合方式划片,划片槽边缘完整,无明显崩裂,划片槽宽为45.10μm,边缘金属凸起的平均高度为3.575μm,满足单芯片来料检验规范,保证了划片后单芯片的良率和可靠性。 展开更多
关键词 low k 激光开槽 机械切割 热效应 可靠性
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基于Low K介质QFN 55nm铜线键合ILD断层的分析 被引量:1
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作者 张金辉 程秀兰 《光电技术应用》 2013年第2期44-50,共7页
主要介绍了低介电常数介质芯片层间介质层的分类,特别是对铜线键合过程中低介电常数介质层间介质断层方面的分析,以及铜线键合过程中如何优化工艺。在工艺优化过程中主要采用了键合参数的优化来改善芯片本身存在的设计缺陷,这主要是从... 主要介绍了低介电常数介质芯片层间介质层的分类,特别是对铜线键合过程中低介电常数介质层间介质断层方面的分析,以及铜线键合过程中如何优化工艺。在工艺优化过程中主要采用了键合参数的优化来改善芯片本身存在的设计缺陷,这主要是从工艺稳定性方面考虑。通过一系列工艺的优化,通过大量实验设计,获得了尽可能少的层间介质断层缺陷。 展开更多
关键词 低介电常数 层间介质 铜线键合 实验设计
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Low K芯片引线键合工艺计算机仿真与参数优化 被引量:2
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作者 黄卫东 《电子与封装》 2008年第2期1-5,共5页
Low K材料具有较高的脆性,在芯片封装测试过程中容易被损坏,因而Cu/low-K的结构的引入对芯片的封装工艺提出了很大的挑战。文章中提出引线键合工艺中冲击阶段的近似数学模型,由计算机仿真结果证实该理论模型的合理性。通过对计算机仿真... Low K材料具有较高的脆性,在芯片封装测试过程中容易被损坏,因而Cu/low-K的结构的引入对芯片的封装工艺提出了很大的挑战。文章中提出引线键合工艺中冲击阶段的近似数学模型,由计算机仿真结果证实该理论模型的合理性。通过对计算机仿真结果的分析得到优化的Low K芯片引线键合工艺参数设置范围,实验设计的优化结果表明本研究提出的计算机仿真优化方法是有效的。 展开更多
关键词 low k 引线键合 有限元分析 优化
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基于AKNN异常检验与ADPC聚类的低压台区拓扑识别方法 被引量:3
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作者 史子轶 夏向阳 +3 位作者 刘佳斌 谷阳洋 王玉龙 洪佳瑶 《中国电力》 CSCD 北大核心 2024年第5期168-177,共10页
低压台区拓扑信息的准确记录是进行台区线损分析、三相不平衡治理等工作的基础。针对目前拓扑档案排查成本高且效率低的问题,提出一种基于自适应k近邻(adaptive k nearest neighbor,AKNN)异常检验和自适应密度峰值(adaptive density pea... 低压台区拓扑信息的准确记录是进行台区线损分析、三相不平衡治理等工作的基础。针对目前拓扑档案排查成本高且效率低的问题,提出一种基于自适应k近邻(adaptive k nearest neighbor,AKNN)异常检验和自适应密度峰值(adaptive density peaks clustering,ADPC)聚类的低压台区拓扑识别方法。该方法利用动态时间弯曲(dynamic time warping,DTW)距离度量低压台区用户间电压序列的相似性,通过AKNN异常检验算法检验并校正异常的用户与变压器之间的关系(简称“户变关系”),在得到正确户变关系的基础上,采用ADPC聚类算法对台区内用户进行相位识别;最后,通过实际台区算例分析验证了该方法不需要人为设置参数,能有效实现低压台区的拓扑识别,具有较高的适用性与准确性。 展开更多
关键词 低压台区 户变关系 相位识别 自适应k近邻 自适应密度峰值
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Isolation and Genetic Analysis of Arabidopsis Mutants with Low_K^+ Tolerance 被引量:5
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作者 赵淑清 林春 +1 位作者 杨小贺 武维华 《Acta Botanica Sinica》 CSCD 2001年第1期105-107,共3页
Ethyl methane-sulfonate (EMS)-mutagenized Arabidopsis M-2 populations were screened in low-K+ medium using the root-bending assay. Forty-two putative low-k(+)-tolerant (lkt) mutants were selected from 150 000 tested M... Ethyl methane-sulfonate (EMS)-mutagenized Arabidopsis M-2 populations were screened in low-K+ medium using the root-bending assay. Forty-two putative low-k(+)-tolerant (lkt) mutants were selected from 150 000 tested M-2 seedlings, and two of these mutants maintained their low-K+-tolerant phenotype in their M-3 generations, respectively. Genetic analysis showed that either one of these two mutants has a monogenic recessive mutation in a nuclear gene, and that the two mutations in two independent mutants are allelic to each other. 展开更多
关键词 Arabidopsis thaliana low k+-tolerance MUTANT
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Potassium channel AKT1 is involved in the auxin-mediated root growth inhibition in Arabidopsis response to low K^+stress 被引量:11
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作者 Juan Li Wei-Hua Wu Yi Wang 《Journal of Integrative Plant Biology》 SCIE CAS CSCD 2017年第12期895-909,共15页
The changes in external K^+ concentration affect plant root growth. However, the molecular mechanism for perceiving a K^+ signal to modulate root growth remains unknown. It is hypothesized that the K^+ channel AKTI... The changes in external K^+ concentration affect plant root growth. However, the molecular mechanism for perceiving a K^+ signal to modulate root growth remains unknown. It is hypothesized that the K^+ channel AKTI is involved in low K^+ sensing in the Arabidopsis root and subsequent regulation of root growth. Along with the decline of external K^+ concentration, the primary root growth of wild-type plants was gradually inhibited. However, the primary root of the akt1 mutant could still grow under low K^+(LK) conditions. Application of NAA inhibited akt1 root growth, but promoted wild-type root growth under LK conditions. By using the ProDR5:GFP and ProPIN1:PIN1-GFP lines, we found that LK treatment reduced auxin accumulation in wild-type root tips by degrading PIN1 proteins, which did not occur in the akt1 mutant. The LK-induced PIN1 degradation may be due to the inhibition of vesicle trafficking of PIN1 proteins. In conclusion, our findings indicate that AKT1 is required for an Arabidopsis response to changes in external K^+, and subsequent regulation of K^+-dependent root growth by modulating PINt degradation and auxin redistribution in the root. 展开更多
关键词 Potassium channel AkT1 is involved in the auxin-mediated root growth inhibition in Arabidopsis response to low k STRESS Lk Figure
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多孔Low-k材料各向异性特性声表面波测量模型
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作者 李志国 姚素英 +1 位作者 肖夏 白茂森 《天津大学学报》 EI CAS CSCD 北大核心 2007年第12期1391-1396,共6页
声表面波技术可无损测量纳米多孔介电薄膜材料的机械特性参数.采用横观各向同性模型表征二维周期性多孔薄膜的结构特性,推导了表面波在周期性纳米多孔薄膜/硅基底结构中的传播模型.通过编程计算数值算例,得到了薄膜各向异性结构特性及... 声表面波技术可无损测量纳米多孔介电薄膜材料的机械特性参数.采用横观各向同性模型表征二维周期性多孔薄膜的结构特性,推导了表面波在周期性纳米多孔薄膜/硅基底结构中的传播模型.通过编程计算数值算例,得到了薄膜各向异性结构特性及弹性模量对表面波色散曲线的影响.结果表明,纳米通孔方向与传播方向间的角度差会对色散曲线产生明显影响,在垂直于通孔的传播方向不能测出弹性模量E′.最后给出了有助于改善测量精度的措施.此模型可用于纳米多孔低介电常数材料各向异性特性测试实验. 展开更多
关键词 声表面波测试 纳米多孔低介电常数材料 各向异性模型
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A novel partial silicon on insulator high voltage LDMOS with low-k dielectric buried layer
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作者 罗小蓉 王元刚 +1 位作者 邓浩 Florin Udreab 《Chinese Physics B》 SCIE EI CAS CSCD 2010年第7期530-536,共7页
A novel partial silicon-on-insulator (PSOI) high voltage device with a low-k (relative permittivity) dielectric buried layer (LK PSOI) and its breakdown mechanism are presented and investigated by MEDICI. At a l... A novel partial silicon-on-insulator (PSOI) high voltage device with a low-k (relative permittivity) dielectric buried layer (LK PSOI) and its breakdown mechanism are presented and investigated by MEDICI. At a low k value the electric field strength in the dielectric buried layer (EI) is enhanced and a Si window makes the substrate share the vertical drop, resulting in a high vertical breakdown voltage; in the lateral direction, a high electric field peak is introduced at the Si window, which modulates the electric field distribution in the SOI layer; consequently, a high breakdown voltage (BV) is obtained. The values of EI and BV of LK PSOI with ki = 2 on a 2μm thick SOI layer over 1μm thick buried layer are enhanced by 74% and 19%, respectively, compared with those of the conventional PSOI. Furthermore, the Si window also alleviates the self-heating effect. 展开更多
关键词 SILICON-ON-INSULATOR low k dielectric electric field breakdown voltage
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Low-K介质与Cu互连技术在新型布线系统中的应用前景 被引量:1
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作者 张华健 《科技创新导报》 2013年第12期119-120,共2页
集成电路(IC)的快速发展对ULSI布线系统提出了更高的要求。本文通过对ULSI互连布线系统的分析,在介绍了ULSI新型布线系统的同时,尝试预测互连技术的趋势走向,同时展望Low-K介质与Cu互连技术在新型布线系统中的应用前景。
关键词 ULSI low-k介质 CU互连
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Effect of F doping on capacitance-voltage characteristics of SiCOH low-k films metal-insulator-semiconductor
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作者 叶超 宁兆元 《Chinese Physics B》 SCIE EI CAS CSCD 2010年第5期553-557,共5页
This paper investigates the capacitance-voltage (C-V) characteristics of F doping SiCOH low dielectric constant films metal-insulator-semiconductor structure. The F doping SiCOH films are deposited by decamethylcycl... This paper investigates the capacitance-voltage (C-V) characteristics of F doping SiCOH low dielectric constant films metal-insulator-semiconductor structure. The F doping SiCOH films are deposited by decamethylcyclopentasilox-ane [DMCPS) and trifluromethane (CHF3) electron cyclotron resonance plasmas. With the CHF3/DMCPS flow rate ratio from 0 to 0.52, the positive excursion of C-V curves and the increase of fiat-band voltage VFB from -6.1 V to 32.2V are obtained. The excursion of C-V curves and the shift of VFB are related to the change of defects density and type at the Si/SiCOH interface due to the decrease of Si and O concentrations, and the increase of F concentration. At the CHF3/DMCPS flow rate ratio is 0.12, the compensation of F-bonding dangling bond to Si dangling bond leads to a small VFB of 2.0V. 展开更多
关键词 F-SiCOH low-k dielectrics capacitance-voltage characteristic
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Influence of roughness on the detection of mechanical characteristics of low-k film by the surface acoustic waves
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作者 肖夏 陶冶 孙远 《Chinese Physics B》 SCIE EI CAS CSCD 2014年第10期424-428,共5页
The surface acoustic wave (SAW) technique is a precise and nondestructive method to detect the mechanical charac- teristics of the thin low dielectric constant (low-k) film by matching the theoretical dispersion c... The surface acoustic wave (SAW) technique is a precise and nondestructive method to detect the mechanical charac- teristics of the thin low dielectric constant (low-k) film by matching the theoretical dispersion curve with the experimental dispersion curve. In this paper, the influence of sample roughness on the precision of SAW mechanical detection is inves- tigated in detail. Random roughness values at the surface of low-k film and at the interface between this low-k film and the substrate are obtained by the Monte Carlo method. The dispersive characteristic of SAW on the layered structure with rough surface and rough interface is modeled by numerical simulation of finite element method. The Young's moduli of the Black DiamondTM samples with different roughness values are determined by SAWs in the experiment. The results show that the influence of sample roughness is very small when the root-mean-square (RMS) of roughness is smaller than 50 nm and correlation length is smaller than 20 μm. This study indicates that the SAW technique is reliable and precise in the nondestructive mechanical detection for low-k films. 展开更多
关键词 low-k film mechanical character detection rough surface rough interface surface acoustic wave
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C_2F_6 /O_2 /Ar Plasma Chemistry of 60 MHz/2 MHz Dual-Frequency Discharge and Its Effect on Etching of SiCOH Low-k Film
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作者 袁颖 叶超 +6 位作者 陈天 葛水兵 刘卉敏 崔进 徐轶君 邓艳红 宁兆元 《Plasma Science and Technology》 SCIE EI CAS CSCD 2012年第1期48-53,共6页
This work investigated C2F6/O2/Ar plasma chemistry and its effect on the etching characteristics of SiCOH low-k dielectrics in 60 MHz/2 MHz dual-frequency capacitively coupled discharge. For the C2F6/Ar plasma, the in... This work investigated C2F6/O2/Ar plasma chemistry and its effect on the etching characteristics of SiCOH low-k dielectrics in 60 MHz/2 MHz dual-frequency capacitively coupled discharge. For the C2F6/Ar plasma, the increase in the low-frequency (LF) power led to an increased ion impact, prompting the dissociation of C2F6 with higher reaction energy. As a result, fluorocarbon radicals with a high F/C ratio decreased. The increase in the discharge pressure led to a decrease in the electron temperature, resulting in the decrease of C2F6 dissociation. For the C2F6/O2/Ar plasma, the increase in the LF power prompted the reaction between 02 and C2F6, resulting in the elimination of CF3 and CF2 radicals, and the production of an F-rich plasma environment. The F-rich plasma improved the etching characteristics of SiCOH low-k films, leading to a high etching rate and a smooth etched surface. 展开更多
关键词 fluorocarbon plasma dual-frequency discharge low-k films etching
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Effect of CHF_3 Plasma Treatment on the Characteristics of SiCOH Low-k Film
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作者 邢振宇 叶超 +2 位作者 袁静 徐轶君 宁兆元 《Plasma Science and Technology》 SCIE EI CAS CSCD 2009年第6期674-678,共5页
The characteristics of SiCOH low dielectric constant film treated by a trifluromethane (CHF3) electron cyclotron resonance (ECR) plasma was investigated. The flat-band voltage VFB and leakage current of the Cu/SiC... The characteristics of SiCOH low dielectric constant film treated by a trifluromethane (CHF3) electron cyclotron resonance (ECR) plasma was investigated. The flat-band voltage VFB and leakage current of the Cu/SiCOH/Si structure, and the hydrophobic property of the SiCOH film were obtained by the measurements of capacitance-voltage, current-voltage and water contact angle. The structures of the SiCOH film were also analyzed by Fourier transform infrared spectroscopy and atomic force microscopy. The CHF3 plasma treatment of the SiCOH film led to a reduction in both the fiat-band voltage VFB shift and leakage current of the Cu/SiCOH/Si structure, a decrease in surface roughness, and a deterioration of the hydrophobic property. The changes in the film's characteristics were related to the formation of Si-F bond, the increase in Si-OH bond, and the C:F deposition at the surface of the SiCOH film. 展开更多
关键词 CHFa plasma treatment SiCOH low-k film
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一种基于改进K-means算法的高能效时钟网络设计 被引量:1
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作者 潘达杉 黄金明 马超 《微电子学与计算机》 2023年第8期101-107,共7页
本文针对先进处理器中部件级时钟网络设计面临的时钟网络偏斜难控制、时钟负载重动态功耗大的问题,实现了一种高能效局部时钟网络设计方法,提出了基于考虑负载K-means算法的时钟驱动点位置优化算法TKDLO(Timing driven K-means based Dr... 本文针对先进处理器中部件级时钟网络设计面临的时钟网络偏斜难控制、时钟负载重动态功耗大的问题,实现了一种高能效局部时钟网络设计方法,提出了基于考虑负载K-means算法的时钟驱动点位置优化算法TKDLO(Timing driven K-means based Driver Location Optimization),在不影响时序的前提下,实现了局部门控时钟驱动单元的位置优化,降低了时钟网络的偏斜.通过采用不同触发器规模的设计验证,模块级时钟长度可以优化15%以上,时钟偏斜优化30%以上.以访存执行部件的时钟设计为例,本文所提出的局部时钟设计方法,相比于传统CTS的实现方式,在时钟延迟和偏斜方面实现了超过50%的优化,整个设计等效频率提升14%、平均功耗优化28%、最终模块能效提升58.7%;相比于基于触发器聚类的fishbone时钟结构,在15.2%的时钟延迟恶化和5%功耗恶化代价下,使模块的频率提升7.6%,能效优化14.2%. 展开更多
关键词 高能效 时钟网络 低偏斜 k-MEANS
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A Low Energy Consumption Clustering Routing Protocol Based on K-Means
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作者 Shan Zhong Guihua Wang +3 位作者 Xiaohui Leng Xiaona Wang Lian Xue Yue Gu 《Journal of Software Engineering and Applications》 2012年第12期1013-1015,共3页
A low energy consumption clustering algorism based on LEACH is researched. Firstly, A method for obtaining the number of clusters k is given, then using the K-Means algorism to divide all the sensor nodes in WSN to th... A low energy consumption clustering algorism based on LEACH is researched. Firstly, A method for obtaining the number of clusters k is given, then using the K-Means algorism to divide all the sensor nodes in WSN to the k clusters, in the whole network life cycle the cluster will not changed, and when the energy of cluster head is lower than some threshold, it will be changed. The data transmission between cluster heads to sink node use mixed model, namely, the cluster near the sink node using the single hop and the one far from it using the multiple hops. The experiment shows our method has the longer life cycle and more received information. It is an effective clustering protocol. 展开更多
关键词 CLUSTERING ROUTING low ENERGY CONSUMPTION k-MEANS
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Invar36合金中厚板K-TIG焊接头组织及性能分析 被引量:1
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作者 刘红兵 宣扬 +3 位作者 李一凡 程文浩 华学明 吕正南 《农业装备与车辆工程》 2023年第2期95-100,共6页
Invar36合金具有与航空复合材料相近的低膨胀系数,是制备航空复合材料模具的首选材料,涉及材料厚度多介于10~20mm,采用传统MIG多层多道焊工艺存在焊接效率低、使用成本高及成品率低等问题。鉴于此,选用厚度为10mm和19mm厚Invar36合金,采... Invar36合金具有与航空复合材料相近的低膨胀系数,是制备航空复合材料模具的首选材料,涉及材料厚度多介于10~20mm,采用传统MIG多层多道焊工艺存在焊接效率低、使用成本高及成品率低等问题。鉴于此,选用厚度为10mm和19mm厚Invar36合金,采用K-TIG焊和摆动MIG焊工艺进行了试验研究。焊缝组织及接头性能分析表明,10mm和19mm厚Invar36合金焊缝各区域均未发生相变,热影响区为粗大的奥氏体等轴晶,焊缝为奥氏体柱状晶。10mm厚Invar36合金K-TIG接头热影响区晶粒尺寸为178μm;19mm厚Invar36合金K-TIG侧和摆动MIG侧的热影响区晶粒尺寸分别为150,131μm。10mm和19mm厚Invar36合金接头抗拉强度分别为427,452MPa,延伸率分别为31%和36%。 展开更多
关键词 k-TIG Invar36合金 低膨胀合金 奥氏体 中厚板
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K-means聚类-DCT压缩算法在振动传感器中的研究与应用
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作者 王昱钦 王鑫 +2 位作者 刘保强 李轶 洪晟 《电子技术应用》 2023年第1期81-85,共5页
为延长无线振动传感器在需要对大量高频振动数据进行采集情况下的使用寿命,首先对现有振动数据压缩算法进行了研究,对其存在的问题进行了分析,并在此基础上提出了一种基于K-means聚类-DCT双重数据压缩算法的压缩方法。所采用的K-means聚... 为延长无线振动传感器在需要对大量高频振动数据进行采集情况下的使用寿命,首先对现有振动数据压缩算法进行了研究,对其存在的问题进行了分析,并在此基础上提出了一种基于K-means聚类-DCT双重数据压缩算法的压缩方法。所采用的K-means聚类-DCT双重数据压缩算法针对预测性维护数据特点,首先利用K-means算法对振动数据进行聚合分类,再根据振动信号频域特点进行离散余弦变换(Discret Cosine Transform,DCT)压缩。通过实际验证表明,采用该算法对振动数据进行数据聚合,可以非常明显地提高数据压缩的效率,从而在传输时将冗余数据有效减少。而在相同数据量情况下,采用改进的双重压缩算法的峰值信噪比与其他算法相比,其具有更好的性能。 展开更多
关键词 传感器 低频振动 中频振动 高频振动 k-means聚类-DCT压缩
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基于K-medoids聚类算法的异常低压台区线损识别方法研究 被引量:1
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作者 吕家慧 《信息与电脑》 2023年第24期61-63,共3页
在电力系统中,设备老化、技术缺陷等原因容易导致低压台区线损异常,影响运行。为此,文章基于K-medoids聚类算法,探讨一种用于识别异常低压台区线损的方法,阐述技术原理,通过聚类分析异常低压线损数据,发现特征,实现准确识别和定位。结... 在电力系统中,设备老化、技术缺陷等原因容易导致低压台区线损异常,影响运行。为此,文章基于K-medoids聚类算法,探讨一种用于识别异常低压台区线损的方法,阐述技术原理,通过聚类分析异常低压线损数据,发现特征,实现准确识别和定位。结果表明,该方法可较好地识别异常低压台区线损,并具有高精度。基于K-medoids聚类算法的异常低压台区线损识别方法提供了一种高效、准确的识别工具,为电力系统管理者及时解决异常低压问题提供了技术调节方式。 展开更多
关键词 k-medoids聚类算法 异常低压台区 线损识别方法
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Mn/TiO_(2)低温SCR催化剂钾中毒机理研究 被引量:1
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作者 方鼎立 张成 +4 位作者 李君臣 谭鹏 马仑 方庆艳 陈刚 《燃料化学学报(中英文)》 EI CAS CSCD 北大核心 2024年第2期195-205,共11页
Mn/TiO_(2)具有良好的低温NH3选择性催化还原NOx(SCR)的活性。烟气中存在的碱金属会从物理和化学上毒害催化剂导致Mn/TiO_(2)催化剂中毒失活。论文以暴露{101}面TiO_(2)为载体制备Mn/TiO_(2)催化剂,采用浸渍法制备K中毒催化剂,研究了Mn/... Mn/TiO_(2)具有良好的低温NH3选择性催化还原NOx(SCR)的活性。烟气中存在的碱金属会从物理和化学上毒害催化剂导致Mn/TiO_(2)催化剂中毒失活。论文以暴露{101}面TiO_(2)为载体制备Mn/TiO_(2)催化剂,采用浸渍法制备K中毒催化剂,研究了Mn/TiO_(2)低温SCR催化剂钾中毒机理。实验发现,Mn/TiO_(2)催化剂脱硝效率随K中毒浓度增加而减少;新鲜Mn/TiO_(2)催化剂表面NH3-SCR反应由E-R和L-H机理共同控制;K吸附会导致催化剂比表面积降低,催化剂表面Mn4+、化学吸附氧比例降低,表面酸性位点数量减少,导致脱硝活性降低;同时K更易吸附在Mn顶位以及桥接O位附近,导致NO的吸附活化受到严重遏制,同时削弱NH3的吸附,使得L-H机理受到阻断,只能以E-R机理控制为主。 展开更多
关键词 低温SCR Mn/TiO_(2) 钾中毒 催化剂
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低k层间介质研究进展 被引量:7
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作者 苏祥林 吴振宇 +1 位作者 汪家友 杨银堂 《微纳电子技术》 CAS 2005年第10期463-468,共6页
介绍了低k介质材料的研究和发展状况,从制备方法和材料特性等不同角度对低k材料进行分类,并结合ULSI对低k材料的要求讨论了低k材料在ULSI中的应用前景。
关键词 k介质 互连 超大规模集成电路
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