Direct oxidation of composite Al/Ti metal films as gate insulators for AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistors(MOSHEMTs/HEMTs)is successfully realized.The devices fabricated with this no...Direct oxidation of composite Al/Ti metal films as gate insulators for AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistors(MOSHEMTs/HEMTs)is successfully realized.The devices fabricated with this novel process exhibit four orders of magnitude reduction in gate leakage current and remarkable breakdown voltage(V br=490 V vs 88 V for normal HEMT)improvement,compared with conventional Schottky-gate HEMTs.Furthermore,the transconductance of the MOSHEMT is only slightly lower(2.6%)than that of Schottky-gate HEMTs and have a wider full width of half maximum.The notable enhancement in device performance renders this new process highly promising for GaN-based microwave power amplifier applications in communication and radar systems.展开更多
Gate-recessed AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs) on sapphire substrates are fabricated.The devices with a gate length of 160nm and a gate periphery of 2 × 75μmexhib...Gate-recessed AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs) on sapphire substrates are fabricated.The devices with a gate length of 160nm and a gate periphery of 2 × 75μmexhibit two orders of magnitude reduction in gate leakage current and enhanced off-state breakdown characteristics,compared with conventional HEMTs.Furthermore,the extrinsic transconductance of an MOSHEMT is 237.2mS/mm,only 7% lower than that of Schottky-gate HEMT.An extrinsic current gain cutoff frequency fT of 65 GHz and a maximum oscillation frequency fmax of 123 GHz are deduced from rf small signal measurements.The high fmax demonstrates that gate-recessed MOSHEMTs are of great potential in millimeter wave frequencies.展开更多
We investigate the influence of interface charge on electrical performance of NbAIO/A1GaN/GaN metal-oxide- semiconductor high electron mobility transistors （MOSHEMTs）. Through C-V measurements and simulations, we fi...We investigate the influence of interface charge on electrical performance of NbAIO/A1GaN/GaN metal-oxide- semiconductor high electron mobility transistors （MOSHEMTs）. Through C-V measurements and simulations, we find that the donor-type interface fixed charge density Qit of 2.2 × 10^13 cm^-2 exists at the NbA10/A1GaN interface, which induces the shift of the threshold voltage much more negative. Furthermore, a trap density of approximately 0.43 × 10^13-1.14 ×10^13 cm^-2 eV^-1 is obtained at the NaA10/AlGaN interface, which is consistent with the frequency-dependent capacitance and conductance measurement results.展开更多
A mathematical model is developed predicting the behavior of gate capacitance with the nanoscale variation of barrier thickness in AlN/GaN MOSHEMT and its effect on gate capacitances of AIInN/GaN and AlGaN/GaN MOSHEMT...A mathematical model is developed predicting the behavior of gate capacitance with the nanoscale variation of barrier thickness in AlN/GaN MOSHEMT and its effect on gate capacitances of AIInN/GaN and AlGaN/GaN MOSHEMTs through TCAD simulations is compared analytically. AlN/GaN and AIInN/GaN MOSHEMTs have an advantage of a significant decrease in gate capacitance up to 108 fF/μm^2 with an increase in barrier thickness up to 10 nm as compared to conventional AlGaN/GaN MOSHEMT. This decrease in gate capacitance leads to improved RF performance and hence reduced propagation delay.展开更多
A model predicting the behavior of various parameters, such as 2DEG sheet charge density and thresh- old voltage, with the variation of barrier thickness and oxide thickness considering interface density of states is ...A model predicting the behavior of various parameters, such as 2DEG sheet charge density and thresh- old voltage, with the variation of barrier thickness and oxide thickness considering interface density of states is presented. The mathematical dependence of these parameters is derived in conjunction with the interface density of states. The dependence of sheet charge density with the barrier thickness and with the oxide thickness is plotted and an insight into the barrier scaling properties of AIInN based MOSHEMTs is presented. The threshold voltage is also plotted with respect to barrier thickness and oxide thickness, which reveals the possibility of the enhance- ment mode operation of the device at low values of the interface DOS. The results are in good agreement with the fabricated device available in the literature.展开更多
We have developed a physics based analytical model for the calculation of threshold voltage, two dimensional electron gas（2DEG） density and surface potential for Al Ga N/Ga N metal oxide semiconductor high electron ...We have developed a physics based analytical model for the calculation of threshold voltage, two dimensional electron gas（2DEG） density and surface potential for Al Ga N/Ga N metal oxide semiconductor high electron mobility transistors（MOSHEMT）. The developed model includes important parameters like polarization charge density at oxide/Al Ga N and Al Ga N/Ga N interfaces, interfacial defect oxide charges and donor charges at the surface of the Al Ga N barrier. The effects of two different gate oxides（Al_2O_3 and HfO_2/ are compared for the performance evaluation of the proposed MOSHEMT. The MOSHEMTs with Al_2O_3 dielectric have an advantage of significant increase in 2DEG up to 1.2 10^（13） cm^2 with an increase in oxide thickness up to 10 nm as compared to HfO_2 dielectric MOSHEMT. The surface potential for HfO_2 based device decreases from 2 to –1.6 e V within10 nm of oxide thickness whereas for the Al_2O_3 based device a sharp transition of surface potential occurs from 2.8to –8.3 e V. The variation in oxide thickness and gate metal work function of the proposed MOSHEMT shifts the threshold voltage from negative to positive realizing the enhanced mode operation. Further to validate the model,the device is simulated in Silvaco Technology Computer Aided Design（TCAD） showing good agreement with the proposed model results. The accuracy of the developed calculations of the proposed model can be used to develop a complete physics based 2DEG sheet charge density and threshold voltage model for Ga N MOSHEMT devices for performance analysis.展开更多
Recently there has been a rapid domestic development in group iII nitride semiconductor electronic materials and devices. This paper reviews the important progress in GaN-based wide bandgap microelectronic materials a...Recently there has been a rapid domestic development in group iII nitride semiconductor electronic materials and devices. This paper reviews the important progress in GaN-based wide bandgap microelectronic materials and devices in the Key Program of the National Natural Science Foundation of China, which focuses on the research of the fundamental physical mechanisms of group III nitride semiconductor electronic materials and devices with the aim to enhance the crystal quality and electric performance of GaN-based electronic materials, develop new GaN heterostructures, and eventually achieve high performance GaN microwave power devices. Some remarkable progresses achieved in the program will be introduced, including those in GaN high electron mobility transistors （HEMTs） and metal-oxide-semiconductor high electron mobility transistors （MOSHEMTs） with novel high-k gate insulators, and material growth, defect analysis and material properties of InAlN/GaN heterostructures and HEMT fabrication, and quantum transport and spintronic properties of GaN-based heterostructures, and high- electric-field electron transport properties of GaN material and GaN Gunn devices used in terahertz sources.展开更多
基金Supported by the National Natural Science Foundation of China under Grant Nos.60406004 and 60736033Key Laboratory of Wide Band-Gap Semiconductor Materials and Devices of the Ministry of Education,Microelectronics Institute,Xidian University.
文摘Direct oxidation of composite Al/Ti metal films as gate insulators for AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistors(MOSHEMTs/HEMTs)is successfully realized.The devices fabricated with this novel process exhibit four orders of magnitude reduction in gate leakage current and remarkable breakdown voltage(V br=490 V vs 88 V for normal HEMT)improvement,compared with conventional Schottky-gate HEMTs.Furthermore,the transconductance of the MOSHEMT is only slightly lower(2.6%)than that of Schottky-gate HEMTs and have a wider full width of half maximum.The notable enhancement in device performance renders this new process highly promising for GaN-based microwave power amplifier applications in communication and radar systems.
基金Supported by Major Program of the National Natural Science Foundation of China under Grant No 60890191the National Basic Research Program of China under Grant No 2010CB327503.
文摘Gate-recessed AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors (MOSHEMTs) on sapphire substrates are fabricated.The devices with a gate length of 160nm and a gate periphery of 2 × 75μmexhibit two orders of magnitude reduction in gate leakage current and enhanced off-state breakdown characteristics,compared with conventional HEMTs.Furthermore,the extrinsic transconductance of an MOSHEMT is 237.2mS/mm,only 7% lower than that of Schottky-gate HEMT.An extrinsic current gain cutoff frequency fT of 65 GHz and a maximum oscillation frequency fmax of 123 GHz are deduced from rf small signal measurements.The high fmax demonstrates that gate-recessed MOSHEMTs are of great potential in millimeter wave frequencies.
基金Supported by the Basic Science Research Fund for the Central Universities of China under Grant No JB141104
文摘We investigate the influence of interface charge on electrical performance of NbAIO/A1GaN/GaN metal-oxide- semiconductor high electron mobility transistors （MOSHEMTs）. Through C-V measurements and simulations, we find that the donor-type interface fixed charge density Qit of 2.2 × 10^13 cm^-2 exists at the NbA10/A1GaN interface, which induces the shift of the threshold voltage much more negative. Furthermore, a trap density of approximately 0.43 × 10^13-1.14 ×10^13 cm^-2 eV^-1 is obtained at the NaA10/AlGaN interface, which is consistent with the frequency-dependent capacitance and conductance measurement results.
文摘A mathematical model is developed predicting the behavior of gate capacitance with the nanoscale variation of barrier thickness in AlN/GaN MOSHEMT and its effect on gate capacitances of AIInN/GaN and AlGaN/GaN MOSHEMTs through TCAD simulations is compared analytically. AlN/GaN and AIInN/GaN MOSHEMTs have an advantage of a significant decrease in gate capacitance up to 108 fF/μm^2 with an increase in barrier thickness up to 10 nm as compared to conventional AlGaN/GaN MOSHEMT. This decrease in gate capacitance leads to improved RF performance and hence reduced propagation delay.
文摘A model predicting the behavior of various parameters, such as 2DEG sheet charge density and thresh- old voltage, with the variation of barrier thickness and oxide thickness considering interface density of states is presented. The mathematical dependence of these parameters is derived in conjunction with the interface density of states. The dependence of sheet charge density with the barrier thickness and with the oxide thickness is plotted and an insight into the barrier scaling properties of AIInN based MOSHEMTs is presented. The threshold voltage is also plotted with respect to barrier thickness and oxide thickness, which reveals the possibility of the enhance- ment mode operation of the device at low values of the interface DOS. The results are in good agreement with the fabricated device available in the literature.
文摘We have developed a physics based analytical model for the calculation of threshold voltage, two dimensional electron gas（2DEG） density and surface potential for Al Ga N/Ga N metal oxide semiconductor high electron mobility transistors（MOSHEMT）. The developed model includes important parameters like polarization charge density at oxide/Al Ga N and Al Ga N/Ga N interfaces, interfacial defect oxide charges and donor charges at the surface of the Al Ga N barrier. The effects of two different gate oxides（Al_2O_3 and HfO_2/ are compared for the performance evaluation of the proposed MOSHEMT. The MOSHEMTs with Al_2O_3 dielectric have an advantage of significant increase in 2DEG up to 1.2 10^（13） cm^2 with an increase in oxide thickness up to 10 nm as compared to HfO_2 dielectric MOSHEMT. The surface potential for HfO_2 based device decreases from 2 to –1.6 e V within10 nm of oxide thickness whereas for the Al_2O_3 based device a sharp transition of surface potential occurs from 2.8to –8.3 e V. The variation in oxide thickness and gate metal work function of the proposed MOSHEMT shifts the threshold voltage from negative to positive realizing the enhanced mode operation. Further to validate the model,the device is simulated in Silvaco Technology Computer Aided Design（TCAD） showing good agreement with the proposed model results. The accuracy of the developed calculations of the proposed model can be used to develop a complete physics based 2DEG sheet charge density and threshold voltage model for Ga N MOSHEMT devices for performance analysis.
基金Project supported by the Key Program of the National Natural Science Foundation of China(No.60736033)
文摘Recently there has been a rapid domestic development in group iII nitride semiconductor electronic materials and devices. This paper reviews the important progress in GaN-based wide bandgap microelectronic materials and devices in the Key Program of the National Natural Science Foundation of China, which focuses on the research of the fundamental physical mechanisms of group III nitride semiconductor electronic materials and devices with the aim to enhance the crystal quality and electric performance of GaN-based electronic materials, develop new GaN heterostructures, and eventually achieve high performance GaN microwave power devices. Some remarkable progresses achieved in the program will be introduced, including those in GaN high electron mobility transistors （HEMTs） and metal-oxide-semiconductor high electron mobility transistors （MOSHEMTs） with novel high-k gate insulators, and material growth, defect analysis and material properties of InAlN/GaN heterostructures and HEMT fabrication, and quantum transport and spintronic properties of GaN-based heterostructures, and high- electric-field electron transport properties of GaN material and GaN Gunn devices used in terahertz sources.
