IMPROVING MATERIAL REMOVAL RATE OF BRITTLE CERAMICS THROUGH HONING INCIDENTAL TENSILE STRESSES

The stress intensity factors and stress conditions of machining cracks are analyzed by fracture mechanics on the basis of honing characteristics and of brittle ceramic mechanical behavior.Because the honing incidental tensile stresses effectively decrease the critical grinding stresses and increase the stress intensity factors of machining cracks,the honing process can be carried out easily.The results show that honing can be an efficient machining method for brittle materials.

Material Removal Model Considering Influence of Curvature Radius in Bonnet Polishing Convex Surface

The bonnet tool polishing is a novel, advanced and ultra-precise polishing process, by which the freeform surface can be polished. However, during the past few years, not only the key technology of calculating the dwell time and controlling the surface form in the bonnet polishing has been little reported so far, but also little attention has been paid to research the material removal function of the convex surface based on the geometry model considering the influence of the curvature radius. Firstly in this paper, for realizing the control of the freeform surface automatically by the bonnet polishing, on the basis of the simplified geometric model of convex surface, the calculation expression of the polishing contact spot on the convex surface considering the influence of the curvature radius is deduced, and the calculation model of the pressure distribution considering the influence of the curvature radius on the convex surface is derived by the coordinate transformation. Then the velocity distribution model is built in the bonnet polishing the convex surface. On the basis of the above research and the semi-experimental modified Preston equation obtained from the combination method of experimental and theoretical derivation, the material removal model of the convex surface considering the influence of the curvature radius in the bonnet polishing is established. Finally, the validity of the model through the simulation method has been validated. This research presents an effective prediction model and the calculation method of material removal for convex surface in bonnet polishing and prepares for the bonnet polishing the free surface numerically and automatically.

On investigating the soda-lime shot blasting of AZ31 alloy:Effects on surface roughness,material removal rate,corrosion resistance,and bioactivity

In the present study,a novel method of surface finish improvement is proposed using shot blasting of soda lime(SBSL)beads on the Mg-AZ31 alloy.The effect of the soda blasting process parameters,such as blast pressure,stand-off distance,and blast duration,have been studied in-response of material removal rate(MRR)and surface roughness(SR)and corresponding statistical models have been obtained.The multi-objective optimization has also been performed to obtain parameters for maximum MRR and minimum SR.The corrosion behavior of the treated specimens has been performed to study their in-vitro biodegradability in simulated body fluid(SBF)for 1,3,7,10,15,and 21 days.The wettability study of the SBSL treated samples has been investigated using sessile drop methodology.Further,cell adhesion test has also been performed to study the biocompatibility characteristics of the SBSL treated samples using Huh7 liver cell lines.Based on obtained quantitative data as well as scanning electron microscopy analysis of treated samples,the SBSL treatment of the AZ31 alloy has been found highly useful in producing biocompatibility surfaces along with desirable morphological features.

EFFECTS OF POLISHING PARAMETERS ON MATERIAL REMOVAL FOR CURVED OPTICAL GLASSES IN BONNET POLISHING

The paper firstly analyzes the influence factor on material removal rate of curved optical work-pieces in the bonnet polishing. Then the experiments are conducted to reveal the effects of several polishing parameters on the material removal rate when the spherical optical glasses are polished with different curvature radius, such as the decrement of the bonnet, the rotational speed of the bonnet and the curvature radius of the work-piece＇s surface using a bonnet trial-manufacturing machine developed by our assignment groups. In the end, the curvilinear relationships between these parameters and the material removal rate are acquired and the laws of the effects on material removal rate in bonnet polishing by several parameters are given. When the spherical-pieces are polished with smaller curvature radius, it is not proportional to either bonnet decrement or bonnet rotational speed as described by the Preston equation although the removal rate increases as the relative velocity or the applied pressure increases. Therefore, for the purpose of calculating more accurately the material removal of the spherical work-pieces, the Preston equation should be modified and studied further.

Study of the material removal mechanism of glass-ceramics based on consecutive incremental loading in ductile-regime grinding

Glass-ceramics have many excellent properties and are widely used in various fields. During the grinding process,the workpiece surface is typically subject to material removal by grit of incremental heights, which has rarely been the focus of research. As such, it is necessary to study the material removal mechanism of glass-ceramics under consecutive incremental loading, which more closely reflects the actual grinding process. In this paper,to analyze the plastic deformation and residual stress of lithium aluminosilicate(LAS) glass-ceramics, a finite element model is established based on the Drucker–Prager yield criterion for ductile regimes. A nano-scratch test was also conducted and the test results show that both the residual depth and residual stress increase with an increase in the number of increments, and that consecutive incremental loading promotes the plastic deformation of glass-ceramics and increases the residual stress of the material in the ductile-regime process. These findings provide guidance for achieving higher dimensional accuracy in the actual grinding of glass-ceramics parts.

Molecular dynamics simulation of the material removal in the scratching of 4H-SiC and 6H-SiC substrates

Single crystal silicon carbide(SiC)is widely used for optoelectronics applications.Due to the anisotropic characteristics of single crystal materials,the C face and Si face of single crystal SiC have different physical properties,which may fit for particular application purposes.This paper presents an investigation of the material removal and associated subsurface defects in a set of scratching tests on the C face and Si face of 4H-SiC and 6H-SiC materials using molecular dynamics simulations.The investigation reveals that the sample material deformation consists of plastic,amorphous transformations and dislocation slips that may be prone to brittle split.The results showed that the material removal at the C face is more effective with less amorphous deformation than that at the Si face.Such a phenomenon in scratching relates to the dislocations on the basal plane(0001)of the SiC crystal.Subsurface defects were reduced by applying scratching cut depths equal to integer multiples of a half molecular lattice thickness,which formed a foundation for selecting machining control parameters for the best surface quality.

Effect of mechanical anisotropy on material removal rate and surface quality during polishing CdZnTe wafers

The mechanical characters of CdZnTe crystal were investigated by nanoscratch tests, and the effects of mechanical anisotropy on the material removal rate and surface quality were studied by polishing tests. There is a peak of frictional coefficient at the early stage of scratch, and increasing the vertical force will result in the increase of peak value correspondingly. The fluctuation phenomenon of frictional coefficient is generated at high vertical force. The lateral forces show the apparent twofold and threefold symmetries on （110） and （111） planes, respectively. To obtain high surface quality, low polishing pressure and hard direction （〈 T10 〉 directions on （110） plane and 〈 112 〉 directions on （111） plane） should be selected, and to achieve high material removal rate, high polishing pressure and soft direction （〈001〉 directions on （110） plane and 〈 121 〉 directions on （111） plane） should be selected.

Material Removal Characteristics of Single-Crystal 4H-SiC Based on Varied-Load Nanoscratch Tests

Single-crystal silicon carbide(SiC)has been widely applied in the military and civil fields because of its excellent physical and chemical properties.However,as is typical in hard-to-machine materials,the good mechanical properties result in surface defects and subsurface damage during precision or ultraprecision machining.In this study,single-and double-varied-load nanoscratch tests were systematically performed on single-crystal 4H-SiC using a nanoindenter system with a Berkovich indenter.The material removal characteristics and cracks under different planes,indenter directions,normal loading rates,and scratch intervals were analyzed using SEM,FIB,and a 3D profilometer,and the mechanisms of material removal and crack propagation were studied.The results showed that the Si-plane of the single-crystal 4H-SiC and edge forward indenter direction are most suitable for material removal and machining.The normal loading rate had little effect on the scratch depth,but a lower loading rate increased the ductile region and critical depth of transition.Additionally,the crack interaction and fluctuation of the depth-distance curves of the second scratch weakened with an increase in the scratch interval,the status of scratches and chips changed,and the comprehensive effects of the propagation and interaction of the three cracks resulted in material fractures and chip accumulation.The calculated and experimental values of the median crack depth also showed good consistency and relativity.Therefore,this study provides an important reference for the high-efficiency and precision machining of single-crystal SiC to ensure high accuracy and a long service life.

Experimental Investigation of Material Removal in Elliptical Vibration Cutting of Cortical Bone

To benefit tissue removal and postoperative rehabilitation,increased efficiency and accuracy and reduced operating force are strongly required in the osteotomy.A novel elliptical vibration cutting(EVC)has been introduced for bone cutting compared with conventional cutting(CC)in this paper.With the assistance of high-speed microscope imaging and the dynamometer,the material removals of cortical bone and their cutting forces from two cutting regimes were recorded and analysed comprehensively,which clearly demonstrated the chip morphology improvement and the average cutting force reduction in the EVC process.It also revealed that the elliptical vibration of the cutting tool could promote fracture propagation along the shear direction.These new findings will be of important theoretical and practical values to apply the innovative EVC process to the surgical procedures of the osteotomy.

Analysis of Material Removal in Alumina Ceramic Honing

The removal mechanism is of importance to the grinding of hard and brittle ceramic materials. It is more suitable to analyze the material removal during ceramics honing processes by means of indention fracture approach. There are two honing characteristics different from grinding, the honing incidental tensile stresses and the crosshatch pattern. The stresses may influence material removal of brittle ceramics with lower tensile strength. In addition, the criss-cross cutting pattern on a bore known as crosshatch may also have its effect on the material removal of ceramics. The material removal of alumina is analyzed on the basis of honing characteristics, honing incidental tensile stresses and crosshatch pattern. By means of indentation fracture mechanics of brittle solids, the theoretical analysis of stress intensity factor and the crack response prove that honing incidental tensile stresses can increase the stress intensity factor of honing cracks and decrease the grinding stresses. So, the fracture criterion for crack propagation can be met easily. Therfore, it is possible to machine ceramic materials with small grinding forces in honing processes. The alumina honing experiments show that material at crosshatch intersecting point is removed by way of chipping which is similar to the edge-crumbled of ceramics. For brittle ceramics with lower tensile strength, such as Al 2O 3, SiO 2, the influences of the honing incidental tensile stresses and the crosshatch pattern on material removal are bigger than that of ceramics with relative higher toughness, such as ZrO 2 and Si 3N 4. Hence, the honing of Al 2O 3, SiO 2, is superior in cutting ability to the grinding. The large stock removal of brittle ceramic materials can be obtained through higher honing pressures. The increase in honing pressures can increase intensity factor of honing cracks, decrease the grinding stresses, and remarkably improve material removal rate. The researches show that honing is an efficient bore machining operation for brittle ceramics.

Material Removal Rate Prediction of Electrical Discharge Machining Process Using Artificial Neural Network

This article presents an Artificial Neural Network （ANN） architecture to model the Electrical Discharge Machining （EDM） process. It is aimed to develop the ANN model using an input-output pattern of raw data collected from an experimental of EDM process, whereas several research objectives have been outlined such as experimenting machining material for selected gap current, identifying machining parameters for ANN variables and selecting appropriate size of data selection. The experimental data （input variables） of copper-electrode and steel-workpiece is based on a selected gap current where pulse on time, pulse off time and sparking frequency have been chosen at optimum value of Material Removal Rate （MRR）. In this paper, the result has significantly demonstrated that the ANN model is capable of predicting the MRR with low percentage prediction error when compared with the experimental result.

Influence of Input Factors on Surface Roughness and Material Removal Speed when Wire-EDM a Hardened SKD11 Steel Curve Profile

The goal of this research is to identify the best set of process machining parameters for wire-EDM(Electrical Discharge Machining)cutting of hardened SKD11 steel when machining a curve profile.The multi-objective function includes reducing surface roughness and increasing MRR(Material Removal Rate).The optimization process is prepared by using Taguchi method coupled Grey Relational Analysis.The obtained results revealed that Toff has the greatest influence on the average grey value(48.30%),followed by the influence of WF(Wire Feed,15.99%),VM(Cutting Voltage,9.33%),SV(Server Voltage,5.05%),Ton(Pulse on Time,1.81%),while SPD(Cutting Speed)has a negligible effect(0.89%).Moreover,using the optimal set of machining parameters generates in surface roughness of 1.25399mm and MRR of 26.5562 mm^(2)/min.The verification experiment and Anderson-Darling method demonstrate the validity of the proposed model,which can be utilized for estimating surface roughness and MRR.

Two material removal modes in chemical mechanical polishing:mechanical plowing vs.chemical bonding

With the rapid development of semiconductors,the number of materials needed to be polished sharply increases.The material properties vary significantly,posing challenges to chemical mechanical polishing(CMP).Accordingly,the study aimed to classify the material removal mechanism.Based on the CMP and atomic force microscopy results,the six representative metals can be preliminarily classified into two groups,presumably due to different material removal modes.From the tribology perspective,the first group of Cu,Co,and Ni may mainly rely on the mechanical plowing effect.After adding H_(2)O_(2),corrosion can be first enhanced and then suppressed,affecting the surface mechanical strength.Consequently,the material removal rate(MRR)and the surface roughness increase and decrease.By comparison,the second group of Ta,Ru,and Ti may primarily depend on the chemical bonding effect.Adding H_(2)O_(2)can promote oxidation,increasing interfacial chemical bonds.Therefore,the MRR increases,and the surface roughness decreases and levels off.In addition,CMP can be regulated by tuning the synergistic effect of oxidation,complexation,and dissolution for mechanical plowing,while tuning the synergistic effect of oxidation and ionic strength for chemical bonding.The findings provide mechanistic insight into the material removal mechanism in CMP.

Wear behavior of copper material removal during fluid jet polishing:A comparative study between experiment and simulation

As a crucial part in micro-electromechanical manufacture,local ultra-precision processing of highly ductile copper is expected to be realized by fluid jet polishing(FJP),which widely utilized in optical elements.Since copper exhibits different wear behavior from stiff and brittle material,there is currently no abrasive wear prediction model applicable for copper to investigate the polishing mechanism.This research reveals that the copper material removal is dominated by deformation wear rather than cutting wear through abrasive jet impact experiments and localized wear scars analysis.A three-dimensional gas-liquid-particle triphasic wear model for copper in FJP is developed by considering impact energy and wear mechanism simultaneously.Ultimately,validation assessments at various working pressures and impingement angles achieve the goodness-of-fit up to 0.92–0.97 in quantitative comparison between simulations and experimental measurements,which demonstrate the wear prediction ability of the proposed model.This investigation facilitates a better understanding of copper wear mechanism and provides theoretical guidance for FJP process optimization.

Modeling and analysis for material removal and surface roughness in fluid jet polishing of optical glass

luid jet polishing(FJP)is a non-contact polishing technology that can fabricate free-form optical surfaces with sub-micron-level form accuracy and nano-level surface roughness,especially for hard and brittle materials.The surface generation model of FJP can be used to guide the determination and optimization of process parameters and is of great significance for understanding the evolution mechanism of surface microtopography.However,predictive models for the microscopic topography of polished surfaces are still lacking.This study established a macroscopic surface profile model for predicting 3D material removal characteristics and surface texture by combining the 3D computer fluid dynamics(CFD)simulation model and single-particle erosion mechanism.A fractal theory-based erosion model has been built to calculate the material removal caused by the erosion of a single abrasive particle on the rough surface;thus,it predicts the micro-topography and surface roughness of the polished samples.A series of polishing experiments were conducted to analyze the feasibility and accuracy of the model quantitatively and study the influence mechanism of process parameters on the material removal characteristics and surface quality.Results indicated that the models could well predict material removal and surface roughness.The prediction accuracy of the surface roughness Ra and maximum removal depth is better than 91.6%and 90%,respectively.It is also found that the material removal rate of FJP could reach 0.517 mm3/min,and the surface roughness convergence rate could reach 62.9%.

Material removal rate in chemical-mechanical polishing of wafers based on particle trajectories

Distribution forms of abrasives in the chemical mechanical polishing（CMP） process are analyzed based on experimental results.Then the relationships between the wafer,the abrasive and the polishing pad are analyzed based on kinematics and contact mechanics.According to the track length of abrasives on the wafer surface,the relationships between the material removal rate and the polishing velocity are obtained.The analysis results are in accord with the experimental results.The conclusion provides a theoretical guide for further understanding the material removal mechanism of wafers in CMP.

Effects of the reciprocating parameters of the carrier on material removal rate and non-uniformity in CMP

Based on the Preston equation, the mathematical model of the material removal rate （MRR）, aiming at a line-orbit chemical mechanical polisher, is established. The MRR and the material removal non-uniformity （MRNU） are numerically calculated by MATLAB, and the effects of the reciprocating parameters on the MRR and the MRNU are discussed. It is shown that the smaller the inclination angle and the larger the amplitude, the higher the MRR and the lower the MRNU. The reciprocating speed of the carrier plays a minor role to improve the MRR and decrease the MRNU. The results provide a guide for the design of a polisher and the determination of a process in line-orbit chemical mechanical polishing.

Material removal rate of 6H-SiC crystal substrate CMP using an alumina(Al_2O_3) abrasive

The influences of the polishing slurry composition,such as the pH value,the abrasive size and its concentration,the dispersant and the oxidants,the rotational velocity of the polishing platen and the carrier and the polishing pressure,on the material removal rate of SiC crystal substrate（0001） Si and a（0001） C surface have been studied based on the alumina abrasive in chemical mechanical polishing（CMP）.The results proposed by our research here will provide a reference for developing the slurry,optimizing the process parameters,and investigating the material removal mechanism in the CMP of SiC crystal substrate.

Kinematics constrained five-axis tool path planning for high material removal rate

Traditional five-axis tool path planning methods mostly focus on differential geometric characteristics between the cutter and the workpiece surface to increase the material removal rate(i.e.,by minimizing path length,improving curvature matching,maximizing local cutting width,etc.) . However,material removal rate is not only related to geometric conditions such as the local cutting width,but also constrained by feeding speed as well as the motion capacity of the five-axis machine. This research integrates machine tool kinematics and cutter-workpiece contact kinematics to present a general kinematical model for five-axis machining process. Major steps of the proposed method include:(1) to establish the forward kinematical relationship between the motion of the machine tool axes and the cutter contact point;(2) to establish a tool path optimization model for high material removal rate based on both differential geometrical property and the contact kinematics between the cutter and workpiece;(3) to convert cutter orientation and cutting direction optimization problem into a concave quadratic planning(QP) model. Tool path will finally be generated from the underlying optimal cutting direction field. Through solving the time-optimal trajectory generation problem and machining experiment,we demonstrate the validity and effectiveness of the proposed method.

Mechanical model of nanoparticles for material removal in chemical mechanical polishing process

Chemical mechanical polishing (CMP) is the most effective method for surface planarization in the semiconductor industry. Nanoparticles are significant for material removal and ultra-smooth surface formation. This research investigates the mechanical effects of the material removal in the CMP process. The various contact states of pad, individual particle, and wafer caused by the variations of working conditions and material properties are analyzed. Three different mechanical models for the material removal in the CMP process, i.e., abrasive wear, adhesive wear, and erosive wear are investigated, with a focus on the comparison of the results for different models. The conclusions and methods obtained could potentially contribute to the understanding and evaluation of the CMP process in further work.