Effect of CF and RPP on the Mechanical and Electrical Properties of Smart Aggregate

By using redispersible polymer powder（RPP） and carbon fiber（CF） to adjust the flexibility and electrical properties of the smart aggregate, a new kind of smart aggregate with Z type structure was proposed. The study shows that Z type aggregate is more sensitive to the feedback of external force than the prism aggregate in the same loading environment, and it indicates that Z type aggregate is more suitable for the research and application of concrete health monitoring. Although the incorporation of RPP would cause the compressive strength of the aggregates and the elastic modulus of hardened cement mortar to reduce slightly within the dosage of RPP by 2.25% because of the polymer film formed in the internal system, this would improve the deformability of the aggregates. In the early loading stage（in the first 60 seconds）, the intelligent concrete specimens implanted with Z type smart aggregate do not show higher sensitivity as expected, although the resistance change rate changes a little bit more, the overall of it is still in balance. Adding RPP could improve the flexibility of smart aggregates exactly, and it plays an active role in prolonging the life of the smart aggregates. By implanting Z type aggregates the damage and failure of the concrete structure could be predicted accurately in this study. The results of this paper will help to promote further research and application of intelligent concrete.

Effect of Ti additions on microstructure and mechanical properties of Cu-Cr-Zr alloy

Ti additions in Cu–Cr–Zr alloys are useful for achieving high mechanical properties.In this work,the influence of Ti contents(0.25 wt%,0.6 wt%,and 1.02 wt%)on the microstructure,mechanical,and electrical properties of Cu–Cr–Zr alloys has been investigated experimentally,along with thermodynamic and kinetic calculations.The electrical conductivity decreased but the hardness/strength increased with increasing Ti content.The lower electrical conductivity is due to increased electron scattering through the solution of more Ti atoms in the Cu matrix.As for the higher hardness/strength,it is mainly owing to higher dislocation density and finer FCC-Cr precipitates.Furthermore,a model considering the size distributions of precipitates is adopted to calculate precipitation strengthening quantitatively.The calculated yield strengths are consistent with the experimental ones for the alloys.The thermodynamic and kinetic calculations reveal that increasing Ti content can facilitate the nucleation of FCC-Cr but enhance its activation energy,hence hindering the growth process.The present work study can provide an effective strategy for producing copper alloys with expected performance.

A Study of the Replacement of Materials in Smart Card

Gold, nickel and copper are usually used in connector of the smart card. Since Au is expensive and Ni is an allergenic material, simulated (CES) and bibliographical work is carried out in order to replace the Au and Ni layer in smart card connectors without sacrificing reliability. During the work, mechanical and electrical properties, corrosion resistance, cost, toxicity and process compatibility of the samples have been taken into consideration. Cu alloying with Zn or Sn, Cr and stainless steel were selected for electrodeposition process. Secondly, carbides (WC, TiC, ZrC), Ti, TiN, borides (TiB2) and silicide (MoSi2) are considered as a vapour deposited materials and some Cu alloying with Al, N or Mg also considered via ion implantation processes. But, vapour deposition and implantation are high energy processes compared to the electrodeposition process, which is expensive. Therefore, electrodeposited materials such as, Cu alloys (Brass or bronze), Cr and stainless steel could be considered as promising candidate to replace the Au and Ni layer in smart card connectors.