According to the inland micro electro-mechanical system (MEMS) process technique level, a design platform of piezoresistive micro electro-mechanical accelerometer is given. This platform is much more adaptable to th...According to the inland micro electro-mechanical system (MEMS) process technique level, a design platform of piezoresistive micro electro-mechanical accelerometer is given. This platform is much more adaptable to the inland designer compared with the current MEMS CAD software. The design flow is presented in detail, and the key techique in the platform is analyzed amply. The structure design methodology is exemplified in the design of a piezoresistive accelerometer, and the accelerometer is the optimized structure for the given performance requirements. The accelerometer is now being manufactured.展开更多
随着工业技术的进步,高温高动态压力传感器的应用需求显著增加。提出一种集成专用补偿电路的高动态硅压阻式微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)压力传感器,进行压力敏感芯片的结构设计和加工工艺设计,并对压力传感...随着工业技术的进步,高温高动态压力传感器的应用需求显著增加。提出一种集成专用补偿电路的高动态硅压阻式微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)压力传感器,进行压力敏感芯片的结构设计和加工工艺设计,并对压力传感器进行封装和温度补偿电路设计。多层绝缘体上硅(Silicon On Insulator,SOI)材料能够使传感器在高温环境下正常工作。无引线的封装方式可有效提升传感器的频响性能。传感器后端集成了桥阻式专用集成电路(Application Specific Integrated Circuits,ASIC),能够显著减小传感器的体积,同时提升传感器整体性能。该MEMS传感器通过自动压力测试系统进行性能试验,结果表明MEMS压力传感器经过补偿后能够实现较高的线性度、稳定的零点输出特性以及理想的动态输出特性。展开更多
文摘According to the inland micro electro-mechanical system (MEMS) process technique level, a design platform of piezoresistive micro electro-mechanical accelerometer is given. This platform is much more adaptable to the inland designer compared with the current MEMS CAD software. The design flow is presented in detail, and the key techique in the platform is analyzed amply. The structure design methodology is exemplified in the design of a piezoresistive accelerometer, and the accelerometer is the optimized structure for the given performance requirements. The accelerometer is now being manufactured.
文摘随着工业技术的进步,高温高动态压力传感器的应用需求显著增加。提出一种集成专用补偿电路的高动态硅压阻式微电子机械系统(Micro-Electro-Mechanical Systems,MEMS)压力传感器,进行压力敏感芯片的结构设计和加工工艺设计,并对压力传感器进行封装和温度补偿电路设计。多层绝缘体上硅(Silicon On Insulator,SOI)材料能够使传感器在高温环境下正常工作。无引线的封装方式可有效提升传感器的频响性能。传感器后端集成了桥阻式专用集成电路(Application Specific Integrated Circuits,ASIC),能够显著减小传感器的体积,同时提升传感器整体性能。该MEMS传感器通过自动压力测试系统进行性能试验,结果表明MEMS压力传感器经过补偿后能够实现较高的线性度、稳定的零点输出特性以及理想的动态输出特性。