期刊文献+
共找到1篇文章
< 1 >
每页显示 20 50 100
Microstructure and Thermal Properties of SiCp/Cu Composites with Mo Coating on SiC Particles
1
作者 刘猛 白淑心 +2 位作者 LI Shun ZHAO Xun XIONG Degan 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2017年第5期1013-1018,共6页
SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between co... SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of Si Cp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the Si Cp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. Si Cp/Cu composites with a maximum thermal conductivity of 274.056 W/(m·K) and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these Si Cp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices. 展开更多
关键词 SiCp/Cu composites hot-pressing magnetron sputtering molybdenum coating thermal conductivity
下载PDF
上一页 1 下一页 到第
使用帮助 返回顶部