High-performance amorphous In–Ga–Zn–O thin-film transistor nonvolatile memory with a novel p-SnO/n-SnO_(2) heterojunction charge trapping stack

Amorphous In–Ga–Zn–O(a-IGZO)thin-film transistor(TFT)memories with novel p-SnO/n-SnO_(2) heterojunction charge trapping stacks(CTSs)are investigated comparatively under a maximum fabrication temperature of 280℃.Compared to a single p-SnO or n-SnO_(2) charge trapping layer(CTL),the heterojunction CTSs can achieve electrically programmable and erasable characteristics as well as good data retention.Of the two CTSs,the tunneling layer/p-SnO/nSnO_(2)/blocking layer architecture demonstrates much higher program efficiency,more robust data retention,and comparably superior erase characteristics.The resulting memory window is as large as 6.66 V after programming at 13 V/1 ms and erasing at-8 V/1 ms,and the ten-year memory window is extrapolated to be 4.41 V.This is attributed to shallow traps in p-SnO and deep traps in n-SnO_(2),and the formation of a built-in electric field in the heterojunction.

Low voltage program-erasable Pd-Al_2O_3-Si capacitors with Ru nanocrystals for nonvolatile memory application

Pd-Al2O3-Si capacitors with Ru nanocrystals are fabricated and electrically characterized for nonvolatile memory application. While keeping the entire insulator Al2O3 thickness fixed, the memory window has a strong dependence on the tunneling layer thickness under low operating voltages, whereas it has weak dependence under high operating voltages. As for the optimal configuration comprised of 6-nm tunneling layer and 22-nm blocking layer, the resulting memory window increases from 1.5 V to 5.3 V with bias pulse increasing from 10-5 s to 10-2 s under ±7 V. A ten-year memory window as large as 5.2 V is extrapolated at room temperature after ±8 V/1 ms programming/erasing pulses.

Preparation of size controllable copper nanocrystals for nonvolatile memory applications

A method of fabricating Cu nanocrystals embedded in SiO2 dielectric film for nonvolatile memory applications by magnetron sputtering is introduced in this paper. The average size and distribution density of Cu nanocrystal grains are controlled by adjusting experimental parameters. The relationship between nanocrystal floating gate micro-structure and its charge storage capability is also discussed theoretically.

Improved performance of Au nanocrystal nonvolatile memory by N2-plasma treatment on HfO2blocking layer

The N2-plasma treatment on a HfO2 blocking layer of Au nanocrystal nonvolatile memory without any post annealing is investigated. The electrical characteristics of the MOS capacitor with structure of Al–Ta N/HfO2/Si O2/p-Si are also characterized. After N2-plasma treatment, the nitrogen atoms are incorporated into HfO2 film and may passivate the oxygen vacancy states. The surface roughness of HfO2 film can also be reduced. Those improvements of HfO2 film lead to a smaller hysteresis and lower leakage current density of the MOS capacitor. The N2-plasma is introduced into Au nanocrystal（NC） nonvolatile memory to treat the HfO2 blocking layer. For the N2-plasma treated device, it shows a better retention characteristic and is twice as large in the memory window than that for the no N2-plasma treated device. It can be concluded that the N2-plasma treatment method can be applied to future nonvolatile memory applications.

Scaling dependence of memory windows and different carrier charging behaviors in Si nanocrystal nonvolatile memory devices

Based on the charge storage mode,it is important to investigate the scaling dependence of memory performance in silicon nanocrystal（Si-NC） nonvolatile memory（NVM） devices for its scaling down limit.In this work,we made eight kinds of test key cells with different gate widths and lengths by 0.13-μm node complementary metal oxide semiconductor（CMOS） technology.It is found that the memory windows of eight kinds of test key cells are almost the same of about1.64 V @ ±7 V/1 ms,which are independent of the gate area,but mainly determined by the average size（12 nm） and areal density（1.8×10^（11）/cm^2） of Si-NCs.The program/erase（P/E） speed characteristics are almost independent of gate widths and lengths.However,the erase speed is faster than the program speed of test key cells,which is due to the different charging behaviors between electrons and holes during the operation processes.Furthermore,the data retention characteristic is also independent of the gate area.Our findings are useful for further scaling down of Si-NC NVM devices to improve the performance and on-chip integration.

Borophene-ZnO heterostructures:Preparation and application as broadband photonic nonvolatile memory

High-performance photonic nonvolatile memory which combines data storage and photosensing can achieve low power consumption and ensure computational energy efficiency.Heterostructure has been theoretically and experimentally proved to have synergistic effects between two materials,which can lead to promising electronic and optical properties for advanced optoelectronic devices.Herein,we report the preparation of borophene-ZnO heterostructures and their applications of broadband photonic nonvolatile memory.The memory shows a good switching ratio(5×10^(3))and long-term stability(3,600 s),which are superior to those of the pristine borophene or ZnO quantum dots(QDs).It is found that the memory shows a broad light response from ultraviolet(365 nm)to near infrared(850 nm).Besides,the SET voltage will decrease when the device is exposed to light,which can be attributed to the separation of holes and electrons in accelerating the formation of vacancy conductive filament.This work not only provides a promising material for next-generation photoelectric information,but also paves the way for borophene-based memory towards data storage devices.

Ferroelectric-gated ReS_(2)field-effect transistors for nonvolatile memory

Ferroelectric field-effect transistors(FeFET)with nondestructive readout capability have emerged as an attractive candidate for next-generation nonvolatile memory technology.Herein,we demonstrate ferroelectric-gated nonvolatile memory featuring a top gate architecture by combining multi-layer ReS_(2)with ferroelectric poly(vinylidene fluoride-trifluoroethylene)(P(VDF-TrFE))copolymer films.The ReS_(2)FeFET using hBN as substrate shows a large memory window of~30 V.Repeated write/erase operations are successfully performed by applying pulse voltage of±25 V with 1 ms width to the ferroelectric P(VDF-TrFE),and an ultra-high write/erase ratio of~107 can be achieved.Furthermore,the ReS_(2)FeFET shows stable data retention capability of longer than 2,000 s and reliable endurance of greater than 2,000 cycles.These characteristics highlight that such ferroelectricgated nonvolatile memory has great potential in future non-volatile memory applications.

Density-controllable nonvolatile memory devices having metal nanocrystals through chemical synthesis and assembled by spin-coating technique

A novel two-step method is employed, for the first time, to fabricatc nonvolatile memory devices that have metal nanoerystals. First, size-averaged Au nanocrystals are synthesized chemically; second, they are assembled into memory devices by a spin-coating technique at room temperature. This attractive approach makes it possible to tailor the diameter and control the density of nanocrystals individually. In addition, processes at room temperature prevent Au diffusion, which is a main concem for the application of metal nanocrystal-based memory. The experimental results, both the morphology characterization and the electrical measurements, reveal that there is an optimum density of nanocrystal monolayer to balance between long data retention and a large hysteresis memory window. At the same time, density-controllable devices could also feed the preferential emphasis on either memory window or retention time. All these facts confirm the advantages and novelty of our two-step method.

A low temperature processed Si-quantum-dot poly-Si TFT nonvolatile memory device

This paper reports on a successful demonstration of poly-Si TFT nonvolatile memory with a much reduced thermal-budget.The TFT uses uniform Si quantum-dots（size -10 nm and density -10-（11） cm-（-2）） as storage media,obtained via LPCVD by flashing SiH4/H2 at 580℃for 15 s on a Si3N4 surface.The poly-Si grain-enlargement step was shifted after source/drain formation.The NiSix-silicided source/drain enables a fast lateral-recrystallization,and thus grain-enlargement can be accomplished by a much reduced thermal-cycle（i.e., 550℃/4 h）.The excellent memory characteristics suggest that the proposed poly-Si TFT Si quantum-dot memory and associated processes are promising for use in wider TFT applications,such as system-on-glass.

Formation of stacked ruthenium nanocrystals embedded in SiO_2 for nonvolatile memory applications

Two methods are proposed to fabricate stacked ruthenium （Ru） nanocrystals （NCs）： rapid thermal annealing （RTA） for the whole gate stacks, and RTA before each SiO2 layer deposition. The size and aerial density of Ru NCs are 2-4 nm and 3 × 10^12 cm^-2 for the former method, compared to 3-7 nm and 2 ×10^12 cm^-2 for the latter. Because of the higher surface trap density and more uniform electron tunneling path between upper and lower Ru NCs, a 5.2 V memory window and 1 V after a period of 10 years are observed in metal oxide semiconductor （MOS） capacitors fabricated by the former method, which are much better than 4.6 V and no window remaining after one year observed in the latter. The former method is compatible with conventional CMOS technology.

Performance and Reliability of Multilayer Silicon Nanocrystal Nonvolatile Memory

Nonvolatile memories （NVMs） with triple layers of silicon nanocrystals were fabricated with conventional CMOS technology. This paper explores the program/erase performance and reliability of NVMs with three layers of nanocrystais. The results indicate that the nanocrystals in the triple-layer nanocrystal NVM （NCNVM） are difficult to fully charge during the programming process. The programming speed of the triple-layer NCNVMs is quicker than that of single-layer NCNVMs, which means that the second and third layers of nanocrystals in the triple-layer NCNVM affect the charge of the first layer nanocrystals. Reliability tests show that the memory window has little degradation after 1× 10^4 cycles.

Surface-type nonvolatile electric memory elements based on organic-on-organic CuPc-H_2Pc heterojunction

A novel surface-type nonvolatile electric memory elements based on organic semiconductors CuPc and H2Pc are fabricated by vacuum deposition of the CuPc and H2Pc films on preliminary deposited metallic （Ag and Cu） electrodes. The gap between Ag and Cu electrodes is 3040μm. For the current-voltage （I-V） characteristics the memory effect, switching effect, and negative differential resistance regions are observed. The switching mechanism is attributed to the electric-field-induced charge transfer. As a result the device switches from a low to a high-conductivity state and then back to a low conductivity state if the opposite polarity voltage is applied. The ratio of resistance at the high resistance state to that at the low resistance state is equal to 120-150. Under the switching condition, the electric current increases -- 80-100 times. A comparison between the forward and reverse I-V characteristics shows the presence of rectifying behavior.

Improved Operation Characteristics for Nonvolatile Charge-Trapping Memory Capacitors with High-κ Dielectrics and SiGe Epitaxial Substrates

A novel high-κ~ A1203/HfO2/AI203 nanolaminate charge trapping memory capacitor structure based on SiGe substrates with low interface densities is successfully fabricated and investigated. The memory capacitor exhibits excellent program-erasable characteristics. A large memory window of ~4 V, a small leakage current density of ~2 ×10-6 Acre-2 at a gate voltage of 7V, a high charge trapping density of 1.42 × 1013 cm-2 at a working vo]tage of 4-10 V and good retention characteristics are observed. Furthermore, the programming （△ VFB = 2.8 V at 10 V for 10μs） and erasing speeds （△VFB =-1.7 V at -10 V for 10μs） of the fabricated capacitor based on SiGe substrates are significantly improved as compared with counterparts reported earlier. It is concluded that the high-κ Al2O3/HfO2/Al2O3 nanolaminate charge trapping capacitor structure based on SiGe substrates is a promising candidate for future nano-scaled nonvolatile flash memory applications.

Improvement of Electrical Properties of the Ge2Sb2Te5 Film by Doping Si for Phase-Change Random Access Memory

Si-doped Ge2Sb2Te5 films have been prepared by dc magnetron co-sputtering with Ge2Sb2Te5 and Si targets. The addition of Si in the Ge2Sb2Te5 film results in the increase of both crystallization temperature and phasetransition temperature from face-centred-cubic （fcc） phase to hexagonal （hex） phase. The resistivity of the Ge2Sb2Te5 film shows a significant increase with the Si doping. When doping 11.8 at.% of Si in the film, the resistivity after 460℃ annealing increases from 1 to 11 mΩ.cm and dynamic resistance increase from 64 to 99Ω compared to the undoped Ge2Sb2Te5 film. This is very helpful to writing current reduction of phase-change random access memory.

Design and Analysis of Low Power Hybrid Memristor-CMOS Based Distinct Binary Logic Nonvolatile SRAM Cell

Memristor is a newly found fourth circuit element for the next generation emerging nonvolatile memory technology. In this paper, design of new type of nonvolatile static random access memory cell is proposed by using a combination of memristor and complemented metal oxide semiconductor. Biolek memristor model and CMOS 180 nm technology are used to form a single cell. By introducing distinct binary logic to avoid safety margin is left for each binary logic output and enables better read/write data integrity. The total power consumption reduces from 0.407 mw (milli-watt) to 0.127 mw which is less than existing memristor based memory cell of the same CMOS technology. Read and write time is also significantly reduced. However, write time is higher than conventional 6T SRAM cell and can be reduced by increasing motion of electron in the memristor. The change of the memristor state is shown by applying piecewise linear input voltage.

Resistive random access memory and its applications in storage and nonvolatile logic

The resistive random access memory（RRAM） device has been widely studied due to its excellent memory characteristics and great application potential in different fields. In this paper, resistive switching materials,switching mechanism, and memory characteristics of RRAM are discussed. Recent research progress of RRAM in high-density storage and nonvolatile logic application are addressed. Technological trends are also discussed.

Ferromagnetic and ferroelectric two-dimensional materials for memory application

The discoveries of ferromagnetic and ferroelectric two-dimensional(2D)materials have dramatically inspired intense interests due to their potential in the field of spintronic and nonvolatile memories.This review focuses on the latest 2D ferromagnetic and ferroelectric materials that have been most recently studied,including insulating ferromagnetic,metallic ferromagnetic,antiferromagnetic and ferroelectric 2D materials.The fundamental properties that lead to the long-range magnetic orders of 2D materials are discussed.The low Curie temperature(Tc)and instability in 2D systems limits their use in practical applications,and several strategies to address this constraint are proposed,such as gating and composition stoichiometry.A van der Waals(vdW)heterostructure comprising 2D ferromagnetic and ferroelectric materials will open a door to exploring exotic physical phenomena and achieve multifunctional or nonvolatile devices.

Sub-femto-Joule energy consumption memory device based on van der Waals heterostructure for in-memory computing

In-memory computing has carried out calculations in situ within each memory unit and its main power consumption comes from data writ-ing and erasing.Further improvements in the energy efficiency of in-memory computing require memory devices with sub-femto-Joule energy consumption.Floating gate memory devices based on two-dimensional(2D)material heterostructures have outstanding char-acteristics such as non-volatility,multi-bit storage,and low opera-tion energy,suitable for application in in-memory computing chips.Here,we report a floating gate memory device based on a WSe 2/h-BN/Multilayer-graphene/h-BN heterostructure,the energy consump-tion of which is in sub-femto Joule(0.6 fJ)per operation for pro-gram/erase,and the read power consumption is in the tens of femto Watt(60 fW)range.We show a Hopfield neural network composed of WSe 2/h-BN/Multilayer-graphene/h-BN heterostructure floating gate memory devices,which can recall the original patterns from incorrect patterns.These results shed light on the development of future com-pact and energy-efficient hardware for in-memory computing sys-tems.

BACH： A Bandwidth-Aware Hybrid Cache Hierarchy Design with Nonvolatile Memories

Limited main memory bandwidth is becoming a fundamental performance bottleneck in chipmultiprocessor （CMP） design. Yet directly increasing the peak memory bandwidth can incur high cost and power consumption. In this paper, we address this problem by proposing a memory, a bandwidth-aware reconfigurable cache hierarchy, BACH, with hybrid memory technologies. Components of our BACH design include a hybrid cache hierarchy, a reconfiguration mechanism, and a statistical prediction engine. Our hybrid cache hierarchy chooses different memory technologies with various bandwidth characteristics, such as spin-transfer torque memory （STT-MRAM）, resistive memory （ReRAM）, and embedded DRAM （eDRAM）, to configure each level so that the peak bandwidth of the overall cache hierarchy is optimized. Our reconfiguration mechanism can dynamically adjust the cache capacity of each level based on the predicted bandwidth demands of running workloads. The bandwidth prediction is performed by our prediction engine. We evaluate the system performance gain obtained by BACH design with a set of multithreaded and multiprogrammed workloads with and without the limitation of system power budget. Compared with traditional SRAM-based cache design, BACH improves the system throughput by 58% and 14% with multithreaded and multiprogrammed workloads respectively.

A novel 2-T structure memory device using a Si nanodot for embedded application

Performance and reliability ofa 2 transistor Si nanocrystal nonvolatile memory （NVM） are investigated. A good performance of the memory cell has been achieved, including a fast program/erase （P/E） speed under low voltages, an excellent data retention （maintaining for 10 years） and good endurance with a less threshold voltage shift of less than 10% after 104 P/E cycles. The data show that the device has strong potential for future embedded NVM applications.