Growth Rate of a-Si∶H Film Influenced by Magnetic Field Gradient in MWECR CVD Plasma System

The magnetic field profiles,which are produced by three ways in the deposition chamber and plasma chamber of single coil divergent field MWECR CVD system,are investigated.The magnetic field gradient of these magnetic field profiles is obtained quantitatively by using Lorentz fit.The results indicate that the gradient value of the magnetic field profile near by the substrate,which is produced by a coil current with 137.7A if a SmCo permanent magnet is equipped under the substrate holder,is the largest;when the SmCo permanent magnet is taken away,the larger one is produced by the coil current with 137.7A and the smallest one produced by a coil current with 115.2A.High deposition rate of a-Si∶H film is observed near by the substrate with high magnetic field gradient.But uneven deposition rate along the radius of the sample holder is also found by infrared analysis technology when sample is deposited in magnetic field profile,which is produced by the coil current with 137.7A if the SmCo permanent magnet is equipped under the substrate holder.

Preparation and Properties of a-Si:H Thin Films Deposited on Different Substrates

The effects of different substrates on the structure and hydrogen evolution from a-Si： H thin films deposited by plasma enhanced chemical vapour deposition were studied, as well as the similar films exposed to an hydrogen plasma. Spectroscopic ellipsometry and hydrogen evolution measurements were used to analyse the effects of the substrate and hydrogen plasma on the films microstructure, thickness, hydrogen content, hydrogen bonding and hydrogen evolution. The hydrogen evolution spectra show a strong substrate dependence. In particular on crystalline silicon substrate, the formation of bubbles was observed. For different substrates, hydrogen plasma treatments lightly affected the hydrogen evolution spectra. These results indicate that the action of hydrogen in a-Si：H was modified by the nature of the substrate.

Hazy Backside Gettering with a-Si: H Film

Hazy backside gettering of boron-doped <111> siljcon wafer with a-Si: H film deposited by rf glow discharge technique (rf-GD) has been investigated by SEM, optical microscope and preferential etching tech- lique. lt is evident that the deposited film can effectively getter the haze after annealing at l l00℃in wet oxy- len ambient for 120 min. The pre-crystallization annealing at 650℃ in argon ambient for 10 min enhances the gettering effectiveness. The low temperature(200～300℃) process of growing extrinsic gettering film reduces the processing contamination.

Dependence of Threshold Voltage of a-Si:H TFT on a-SiN_x:H Film

The relation between threshold voltage for hydrogenated amorphous silicon thin film transistors (a-Si:H TFTs) and deposition conditions for hydrogenated amorphous silicon nitride (a-SiN x :H) films is investigated.It is observed that the threshold voltage, V th ,of a-Si:H TFT increases with the increase of the thickness of a-SiN x :H film,and the threshold voltage is reduced apparently with the increase of NH 3/SiH 4 gas flow rate ratio.

Study on stability of hydrogenated amorphous silicon films

Hydrogenated amorphous silicon （a-Si：H） films with high and same order of magnitude photosensitivity （-10^5） but different stability were prepared by using microwave electron cyclotron resonance chemical vapour deposition system under the different deposition conditions. It was proposed that there was no direct correlation between the photosensitivity and the hydrogen content （CH） as well as H-Si bonding configurations, but for the stability, they were the critical factors. The experimental results indicated that higher substrate temperature, hydrogen dilution ratio and lower deposition rate played an important role in improving the microstructure of a-Si：H films. We used hydrogen elimination model to explain our experimental results.

Solid-phase Crystallization of Hydrogenated Amorphous Silicon on Glass Substrates

Amorphous silicon films prepared by PECVD on glass substrate have been crystallized by conventional furnace annealing and rapid thermal annealing(RTA), respectively. From the Raman spectra, X-ray diffraction and scanning electron microscope, it is found that the grain size is crystallized at 850℃ in both techniques. The thin film made by RTA is smooth and of perfect structure, the thin film annealed by FA has a highly structural disorder. An average grain size of about 30nm is obtained by both techniques.

Hydrogen bonding in hydrogenated amorphous silicon thin films prepared at different precursor gas temperatures with undiluted silane

Hydrogen bonding configurations and hydrogen content in hydrogenated amorphous silicon (a-Si:H) thin films prepared at different precursor gas temperatures with undiluted silane have been investigated by means of Fourier transform infrared (FTIR) spectroscopy.The results show that the gas temperature before precursor gases entering the glow-discharge zone re-markably influences the hydrogen bonding configurations and the hydrogen content in a-Si:H thin films.The hydrogen content decreases from 18% down to 11% when increasing the gas temperature from room temperature (RT) to 433 K.Meanwhile,the clustered hydrogen at the physical film surface or at the internal surfaces of the microvoids decreases,indicating that a-Si:H thin films are densified at higher precursor gas temperatures.For a-Si:H thin films deposited at gas temperature of 433 K,the isolated silicon-hydrogen bonding configuration is predominant in the testing films.

Infrared-transmission spectra and hydrogen content of hydrogenated amorphous silicon

In this paper, two kinds of methods of calculating the hydrogen content of a-Si:H thin film by means of the wagging mode and the stretching modes of infrared-transmission spectra , are investigated. The reason for the difference in these two calculation results is analyzed. If the contents of SiH2 and (SiH2)n are indicated in terms of a structure factor F=(I840+I880)/I2000, it is shown that the calculation results obtained from the two different methods are almost equal when the refractive index n is approximately 3.4 or the fitting thickness is between 0.71 and 0.89 mm in the case of a small F. It is shown that the ways of fabrication of thin film can influence silicon-hydrogen bonding configuration of a-Si:H film, and different ways of fabrication can lead to different contents of SiH2 and (SiH2)n. The uniformity of the thin film with a big F is bad. In this case, there is great difference between the thickness measured by the SurfCom408A surface profile apparatus and the thickness obtained by fitting the fringes; and the hydrogen contents of a-Si:H films obtained by means of the wagging mode and the stretching modes are different, too. But the fabrication of the MWECR CVD assisted by CAT CVD can effectively restrain the formation of SiH2 and (SiH2)n.