Research on Crucial Manufacturing Process of Rigid-Flex PCB

The main characteristics, applications, the emphases of manufacturing process are introduced, and the research of new product of rigid-flex Printed Circuit Board （PCB） is also described. In particular, the plasma desmear process, which is the crucial problems of manufacturing process, is discussed in detail. Samsung 4-layer rigid-flex PCB has been developed successfully, and the qualification rate reaches to 89.4%.

Modeling of Micropores Drilling Force for Printed Circuit Board Micro-holes Based on Energy Method

The quality of printed circuit board(PCB)micro-hole processing directly determines the stability of the inner and outer circuit connections.Micro-hole drilling technology is a typical method for PCB micro-hole processing.The problem of optimal control of its drilling force is one of the main factors affecting the quality of micro-hole machining.To address this problem,the thrust forces and torques in PCB drilling were first modeled and analyzed,and the corresponding prediction models were established.The drilling force analysis was carried out through the micro-hole drilling experiment,the specific cutting energy under different feed rates was calculated,the influence of the size effect was clarified,and the accuracy of the prediction model was verified.The result shows that during the drilling of glass fiber cloth,changes in the material removal mechanism are induced as the feed per revolution is varied.When the feed per revolution is less than the tool edge radius,the glass fiber is not cut by the main cutting edge,but is crushed and broken.When the feed per revolution is greater than the radius of the tool edge,the glass fiber is cut by the main cutting edge.At the same time,the established analytical model can accurately reflect the influence of the size effect on the drilling torque in PCB micro-hole drilling,and the error is within 10%.This method has certain practical application value in controlling PCB micro hole processing quality.

Study on High-power LED Heat Dissipation Based on Printed Circuit Board

In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.

Characterization of a New DC-Glow Discharge Plasma Set-Up to Enhance the Electronic Circuits Performance

The (DC-GDPAU) is a DC glow discharge plasma experiment that was designed, established, and operated in the Physics Department at Ain Shams University (Egypt). The aim of this experiment is to study and improve some properties of a printed circuit board (PCB) by exposing it to the plasma. The device consists of cylindrical discharge chamber with movable parallel circular copper electrodes (cathode and anode) fixed inside it. The distance between them is 12 cm. This plasma experiment works in a low-pressure range (0.15 - 0.70 Torr) for Ar gas with a maximum DC power supply of 200 W. The Paschen curves and electrical plasma parameters (current, volt, power, resistance) characterized to the plasma have been measured and calculated at each cm between the two electrodes. Besides, the electron temperature and ion density are obtained at different radial distances using a double Langmuir probe. The electron temperature (KTe) was kept stable in range 6.58 to 10.44 eV;whereas the ion density (ni) was in range from 0.91 × 1010 cm−3 to 1.79 × 1010 cm−3. A digital optical microscope (800×) was employed to draw a comparison between the pre-and after effect of exposure to plasma on the shaping of the circuit layout. The experimental results show that the electrical conductivity increased after plasma exposure, also an improvement in the adhesion force in the Cu foil surface. A significant increase in the conductivity can be directly related to the position of the sample surfaces as well as to the time of exposure. This shows the importance of the obtained results in developing the PCBs manufacturing that uses in different microelectronics devices like those onboard of space vehicles.

一种实现双面通孔回流的焊接技术

本文主要介绍了一种可实现双面通孔回流（THR）的焊接技术，希望给业界同行提供一些借鉴。

Experimental Study on the Expansion Uniformity of Armature

A measurement system has been developed based on high-precision printed probes in printed circuit board （PCB） and steep rising-time probe adapters, which can be applied to study the expansion uniformity of armature in a helical magnetic flux compression generator （HFCG）. The influences of wall thickness and initiation position on the expansion uniformity of armature in HFCG were experimentally investigated. The results show that the armature with thinner wall thickness will easily rupture due to the high pressure of detonation products inside, the armature with larger wall thickness will easily crack due to the tensile stress on the outer surface of the wall, the influence of the end effect on the expansion uniformity can be ignored if the distance between the first group of probe and the initiation point is more than 3 times the armature diameter.

Preparation of Pure Copper Powder from Acidic Copper Chloride Waste Etchant

The method for the recycling of copper from copper chloride solution was developed. This process consists of extraction of copper, purification and particle size reduction. In the first step, reductive metal scraps were added to acidic copper chloride waste enchants produced in the PCB industry to obtain copper powder. Composition analysis showed that this powder contained impurities such as Fe, Ni, and water. So, drying and purification were carried out by using microwave and a centrifugal separator. Thereby the copper powder had a purity of higher than 99% and spherical form in morphology. The copper powder size was decreased by ball milling.

Research on Selective Shredding of Wasted Printed Circuit Boards

Electronic scrap, especially wasted printed circuit boards (PCBs), is regarded as an environmental challenge. At present, the physical separation is thought to be the environmental friendly and economical method of treating and reutilizing electronic waste. An effective liberation of metals from non metallic components is a crucial step towards mechanical separation and recycling of wasted PCBs. In this paper, the selective shredding theory and mechanics characteristics of wasted PCBs were analyzed, and the shredded experiments of wasted PCBs by hammer mill were investigated. The result shows that the selective shredding exists in the wasted PCBs shredded process by hammer mill. The shredding velocity of non metallic components is far greater than that of metals in the wasted PCBs shredding, which makes the metals concentrate in the coarser fraction. And the impact force of hammer mill is superior to metal liberation from non metallic components, a satisfied metal liberation degree can be achieved in the wasted PCBs shredding by hammer mill.

Computing environmental life of electronic products based on failure physics

In some situations, the accelerated life test on environmental stress for electronic products is not easily implemented due to various restrictions, and thus engineers are lacking of data of the product life test. Concerning this problem, environmental life of the printed circuit board（PCB） board is calculated by way of physics of failure. Influences of thermal cycle and vibration on PCB and its components are studied. Based on the analysis of force and stress between components and the PCB board in thermal cycle events and vibration events, four life computing models of pins and soldered dots are established. The miller damage ratio is used to calculate the accumulated damage of a pin or a soldered dot, and then the environment life of the PCB board can be determined by the first failed one. Finally, an example is used to illustrate the models and their calculations.

RELIABILITY OF TEST LANDS TARGETING IN BED-OF-NAILS STYLE TEST FIXTURE

A systematic, accurate and robust evaluating method for fine pitch printed circuit board （PCB） positioning assessment in testing fixture is developed. Targeting reliability of bed-of-nails tester is successfully evaluated by the 2D pattern transform. Probe offset vector with its Weibull and Gaussian distribution estimates are obtained for further investigation about the causes of misalignment on the basis of a batch tests for same kind of PCBs.

High power triboelectric nanogenerator based on printed circuit board （PCB） technology

Harvesting mechanical energy from our surroundings to acquire a steady and high power output has attracted intensive interest due to the fast development of portable electronics. In this work the disk-structured triboelectric nanogenerator （TENG） was prepared based on the mature printed drcuit board （PCB） technology and the composite structure for effectively improving the utilization in space. A narrow grating of 1~ was designed to produce high output. Operated at a rotation rate of 1,000 rpm, the TENG produces a high output power density of 267 mW/cm2 （total power output of 25.7 W） at a matched load of 0.93 MfZ After introducing a transformer, the output power can be managed so that it can be directly used to charge a battery for a smart phone. With the PCB production technology, fabrication of high performance TENG at low cost and large-scale becomes feasible.

Multiple Detection Model Fusion Framework for Printed Circuit Board Defect Detection

The printed circuit board(PCB)is an indispensable component of electronic products,which deter-mines the quality of these products.With the development and advancement of manufacturing technology,the layout and structure of PCB are getting complicated.However,there are few effective and accurate PCB defect detection methods.There are high requirements for the accuracy of PCB defect detection in the actual pro-duction environment,so we propose two PCB defect detection frameworks with multiple model fusion including the defect detection by multi-model voting method(DDMV)and the defect detection by multi-model learning method(DDML).With the purpose of reducing wrong and missing detection,the DDMV and DDML integrate multiple defect detection networks with different fusion strategies.The effectiveness and accuracy of the proposed framework are verified with extensive experiments on two open-source PCB datasets.The experimental results demonstrate that the proposed DDMV and DDML are better than any other individual state-of-the-art PCB defect detection model in F1-score,and the area under curve value of DDML is also higher than that of any other individual detection model.Furthermore,compared with DDMV,the DDML with an automatic machine learning method achieves the best performance in PCB defect detection,and the Fl-score on the two datasets can reach 99.7%and 95.6%respectively.

Products Made from Nonmetallic Materials Reclaimed from Waste Printed Circuit Boards

Printed circuit boards （PCBs） are in all electronic equipment, so with the sharp increase of electronic waste, the recovery of PCB components has become a critical research field. This paper presents a study of the reclaimation and reuse of nonmetallic materials recovered from waste PCBs. Mechanical processes, such as crushing, milling, and separation, were used to process waste PCBs. Nonmetallic materials in the PCBs were separated using density-based separation with separation rates in excess of 95%. The recovered nonmetals were used to make models, construction materials, composite boards, sewer grates, and amusement park boats. The PCB nonmetal products have better mechanical characteristics and durability than traditional materials and fillers. The flexural strength of the PCB nonmetallic material composite boards is 30% greater than that of standard products. Products derived from PCB waste processing have been brought into industrial production. The study shows that PCB nonmetals can be reused in profitable and environmentally friendly ways.

Preparation of pure SnO_2 powders from tin slag of printed circuit boards waste

The recycling method and principle of SnO2 from the tin slag of printed circuit boards（PCB） waste were investigated. In this study, pure SnO2 powders were obtained through a multi-step process including ball-milling, roasting, dissolving, precipitating, and pickling. The total recovery rate of tin can be up to 91 %. The SnO2 powders obtained is the single phase, and the content of SnO2 is up to 99.9 %. However, the SnO2 particles are easier to agglomerate during the precipitation process. The agglomerate SnO2 particles are about 7.778 lm in mean particle size（D50）. This preparation method presents a viable alternative for the tin slag recycling. The tin is not only recycled, but also reused directly to prepare pure SnO2 powders.

Thermal Deformation Measurement and Stress Analysis of PQFP Assembly during Power Cycling

The three dimensional displacements fields in a surface mounted plastic quad flat pack (PQFP) assembly are measured during power cycling using a combination of holographic interferometry and high sensitivity moire interferometry. Detailed in plane and out of plane whole field displacement data of the top and bottom ends of the gull wing leads and their distributions along the edge of PQFP are provided. The maximum deformations of the gull wing leads occur at the four corners of the PQFP. The experimental results are used as displacement boundary condition in a linear elastic analysis of the thermal stresses of the corner lead and its solder joint using a 3 D finite element method (FEM). The highest stresses occur in the area connecting the lead and the solder joint. The results should be useful in the evaluation of thermal fatigue damage of surface mount assemblies.