We formulate a “Moore’s law” for photonic integrated circuits (PICs) and their spatial integration density using two methods. One is decomposing the integrated photonics devices of diverse types into equivalent bas...We formulate a “Moore’s law” for photonic integrated circuits (PICs) and their spatial integration density using two methods. One is decomposing the integrated photonics devices of diverse types into equivalent basic elements, which makes a comparison with the generic elements of electronic integrated circuits more meaningful. The other is making a complex compo- nent equivalent to a series of basic elements of the same functionality, which is used to calculate the integration density for func- tional components realized with different structures. The results serve as a benchmark of the evolution of PICs and we can con- clude that the density of integration measured in this way roughly increases by a factor of 2 per year. The prospects for a continued increase of spatial integration density are discussed.展开更多
This paper reviews recent progress on integrated multi-chip modules composed of silica-based planar lightwave circuits (PLCs) with a relatively high core-to-cladding index contrast A. These compact and highly function...This paper reviews recent progress on integrated multi-chip modules composed of silica-based planar lightwave circuits (PLCs) with a relatively high core-to-cladding index contrast A. These compact and highly functional modules were fabricated by using the PLC-PLC direct attachment technique.展开更多
文摘We formulate a “Moore’s law” for photonic integrated circuits (PICs) and their spatial integration density using two methods. One is decomposing the integrated photonics devices of diverse types into equivalent basic elements, which makes a comparison with the generic elements of electronic integrated circuits more meaningful. The other is making a complex compo- nent equivalent to a series of basic elements of the same functionality, which is used to calculate the integration density for func- tional components realized with different structures. The results serve as a benchmark of the evolution of PICs and we can con- clude that the density of integration measured in this way roughly increases by a factor of 2 per year. The prospects for a continued increase of spatial integration density are discussed.
文摘This paper reviews recent progress on integrated multi-chip modules composed of silica-based planar lightwave circuits (PLCs) with a relatively high core-to-cladding index contrast A. These compact and highly functional modules were fabricated by using the PLC-PLC direct attachment technique.
