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A review of passive thermal management of LED module
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作者 叶怀宇 Sau Koh +2 位作者 Henk van Zeijl A.W.J.Gielen 张国旗 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2011年第1期57-60,共4页
Recently, the high-brightness LEDs have begun to be designed for illumination application. The increased electrical currents used to drive LEDs lead to thermal issues. Thermal management for LED module is a key design... Recently, the high-brightness LEDs have begun to be designed for illumination application. The increased electrical currents used to drive LEDs lead to thermal issues. Thermal management for LED module is a key design parameter as high operation temperature directly affects their maximum light output, quality, reliability and life time. In this review, only passive thermal solutions used on LED module will be studied. Moreover, new thermal interface materials and passive thermal solutions applied on electronic equipments are discussed which have high potential to enhance the thermal performance of LED Module. 展开更多
关键词 HB LEDs LED module thermal management passive thermal solution thermal interface material
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