Pasting properties are among the most important characteristics of starch, determining its applications in food processing and other industries. Pasting temperature derived from the Rapid Visco-analyser （RVA） （Newp...Pasting properties are among the most important characteristics of starch, determining its applications in food processing and other industries. Pasting temperature derived from the Rapid Visco-analyser （RVA） （Newport Scientific）, in most cases, is overestimated by the Thermocline for Windows software program. Here, two methods facilitating accurate measurement of pasting temperature by RVA were described. One is to change parameter setting to ＇screen＇ the true point where the pasting viscosity begins to increase, the other is to manually record the time （T1） when the pasting viscosity begins to increase and calculate the pasting temperature with the formula of （45/3.8）×（T1-1）＋50 for rice flour. The latter method gave a manually determined pasting temperature which was significantly correlated with the gelatinization temperature measured by differential scanning calorimetry.展开更多
The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low...The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low-temperature conductive silver paste.Afterwards,the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR,DMA and SEM.The results revealed that the prepared conductive paste has good conductivity,film-forming performance,printing performance,low-temperature curing performance,and anti-aging performance.When the mass percentage of the bonding phase/conductive phase was 40/60,the lowest volume resistivity of the conductive silver paste was 4.9×10^(−6)Ω⋅cm,and the conductivity was the best.展开更多
基金This research was financially supported in part by the National High Technology Development Project of China(Grant No.2006AA10Z193)the National Natural Science Foundation of China(Grant No.30300227)the Science and Technology Department of Zhejiang Province(Grant No.2007C32014).
文摘Pasting properties are among the most important characteristics of starch, determining its applications in food processing and other industries. Pasting temperature derived from the Rapid Visco-analyser （RVA） （Newport Scientific）, in most cases, is overestimated by the Thermocline for Windows software program. Here, two methods facilitating accurate measurement of pasting temperature by RVA were described. One is to change parameter setting to ＇screen＇ the true point where the pasting viscosity begins to increase, the other is to manually record the time （T1） when the pasting viscosity begins to increase and calculate the pasting temperature with the formula of （45/3.8）×（T1-1）＋50 for rice flour. The latter method gave a manually determined pasting temperature which was significantly correlated with the gelatinization temperature measured by differential scanning calorimetry.
基金fund for this work was provided by the“Research on Key Technologies of Photosensitive Conductive Silver Paste Based on Domestic Circuit Protection Micro Chip Components”(Project No.BE2020008 and Supporting Author:Chen P).
文摘The poly(epoxy-N-methylaniline)conductive organic carrier was used as the bonding phase of the low-temperature conductive silver paste.Then,this was mixed with different proportions of silver powder to prepare the low-temperature conductive silver paste.Afterwards,the effect of the conductive organic carrier on the properties of the low-temperature conductive silver paste was determined by IR,DMA and SEM.The results revealed that the prepared conductive paste has good conductivity,film-forming performance,printing performance,low-temperature curing performance,and anti-aging performance.When the mass percentage of the bonding phase/conductive phase was 40/60,the lowest volume resistivity of the conductive silver paste was 4.9×10^(−6)Ω⋅cm,and the conductivity was the best.
