通过机械合金化制备了 Al-15%Pb-4%Si-1%Sn-1.5%Cu(质量分数)纳米晶粉末。采用 X 射线衍射(XRD),扫描电镜(SEM)和透射电镜(TEM)对不同球磨时间的混合粉末的组织结构、晶粒大小、微观形貌以及颗粒中化学成分分布情况进行了研究。结果表...通过机械合金化制备了 Al-15%Pb-4%Si-1%Sn-1.5%Cu(质量分数)纳米晶粉末。采用 X 射线衍射(XRD),扫描电镜(SEM)和透射电镜(TEM)对不同球磨时间的混合粉末的组织结构、晶粒大小、微观形貌以及颗粒中化学成分分布情况进行了研究。结果表明混合粉末经过球磨后形成了纳米晶,其组织非常均匀。球磨对 Pb 的作用效果明显大于对 Al 的作用效果,经过 40 h 球磨后 Pb 粒子达到 40 nm,而 Al 在球磨 60 h 后晶粒为 65 nm;经球磨后,Cu 和 Si 固溶于 Al 的晶格中,而 Sn 则固溶于 Pb 晶格中,并且 Al 和 Pb 发生了互溶,形成了 Pb(Al)超饱和固溶体;在球磨过程中硬度高的脆性粒子 Si 难于完全实现合金化。展开更多
The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To inve...The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.展开更多
文摘通过机械合金化制备了 Al-15%Pb-4%Si-1%Sn-1.5%Cu(质量分数)纳米晶粉末。采用 X 射线衍射(XRD),扫描电镜(SEM)和透射电镜(TEM)对不同球磨时间的混合粉末的组织结构、晶粒大小、微观形貌以及颗粒中化学成分分布情况进行了研究。结果表明混合粉末经过球磨后形成了纳米晶,其组织非常均匀。球磨对 Pb 的作用效果明显大于对 Al 的作用效果,经过 40 h 球磨后 Pb 粒子达到 40 nm,而 Al 在球磨 60 h 后晶粒为 65 nm;经球磨后,Cu 和 Si 固溶于 Al 的晶格中,而 Sn 则固溶于 Pb 晶格中,并且 Al 和 Pb 发生了互溶,形成了 Pb(Al)超饱和固溶体;在球磨过程中硬度高的脆性粒子 Si 难于完全实现合金化。
文摘The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.
