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Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints 被引量:16
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作者 LI Guo-yuan SHI Xun-qing 《中国有色金属学会会刊:英文版》 CSCD 2006年第B02期739-743,共5页
The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To inve... The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed. 展开更多
关键词 sn-Ag-Cu合金 无铅焊料 焊接接头 金属间化合物
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Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints 被引量:3
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作者 YAN Yanfu YAN Hongxing CHEN Fuxiao ZHANG Keke ZHU Jinhong 《Rare Metals》 SCIE EI CAS CSCD 2007年第1期51-55,共5页
Lap joints with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancemem 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the s... Lap joints with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancemem 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the solder joints. The results indicate that the creep resistance of the composite solder joints is generally superior to that of the conventional 63Sn37Pb solder joints. At the same time, the creep rupture life of the composite solder joints is declined with increasing stress and drops faster than that of the 63Sn37Pb eutectic solder joints. 展开更多
关键词 composite solder STRESS creep rupture life particle-enhancement 63sn37pb
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A Study on Plastic Deformation Resistance of Sn-Pb-RE Solder 被引量:1
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作者 朱颖 康慧 +2 位作者 曲平 方洪渊 钱乙余 《Journal of Rare Earths》 SCIE EI CAS CSCD 1999年第4期289-292,共4页
The plastic deformation of solder joint depends on the plastic deformation resistance of solder. The studyon plastic deformation resistance of Sn-Pb-RE solder at room temperature shows that with the increase 0f RE con... The plastic deformation of solder joint depends on the plastic deformation resistance of solder. The studyon plastic deformation resistance of Sn-Pb-RE solder at room temperature shows that with the increase 0f RE content, theplastic deformation resistance of Sn-Pb-RE solder enhances. The microstructure investigation reveals'that the addition ofRE makes the microstructure of solder fine and homogeneous, which enhances hwher hardening and multi-sliding hardening. Moreover, RE on grain boundaries hinders the grain boundary sliding. Therefore, the deformation resistance ofsolder enhances. However, since it is very hard, the intermetallic compounds of RE near fracture surface will cause intergranular cracks around it. 展开更多
关键词 Rare earths Plastic deformation resistance sn-pb-RE solder
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Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate
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作者 Yingzong Liu Yuanxing Li +1 位作者 Hui Chen Zongtao Zhu 《Journal of Magnesium and Alloys》 SCIE EI CAS CSCD 2024年第2期726-741,共16页
Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joi... Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals. 展开更多
关键词 Ultrasonic-assisted soldering Mg_(2)sn Ni coating layer Shear strength
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质谱测定锰硅合金中Pb、Sn、As、Mo含量方法研究
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作者 张纪君 段宏然 《冶金标准化与质量》 2024年第5期17-21,共5页
采用质谱仪运用In内标法测定锰硅合金中Pb、Sn、As、Mo的含量,其测定结果的精密度、准确度满足分析要求,此方法简便、快捷、可操作性强。该测试方法满足锰硅合金产品的检测要求。
关键词 ICP-MS In内标 锰硅合金 pb sn AS Mo
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Influence of electroless Sn/Bi on Sn/Pb soldered joint strength
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作者 禹胜林 朱小军 严伟 《中国有色金属学会会刊:英文版》 CSCD 2005年第S3期349-352,共4页
The solder joint strength of Pb/Sn soldering aluminum with electroless layer Sn/Bi and Cu was studied. The results show that the joint shear strength of electroless Sn/Bi on aluminum surface is lower than that of Cu. ... The solder joint strength of Pb/Sn soldering aluminum with electroless layer Sn/Bi and Cu was studied. The results show that the joint shear strength of electroless Sn/Bi on aluminum surface is lower than that of Cu. A Pb-riched region with porosity is formed in region of soldering fillet with electroless Sn/Bi. Both the electroless Sn/Bi layer and Pb-riched layer become thicker, which are the reasons why the shear strength of the solder joint with electroless Sn/Bi on aluminum surface is lower than that of electroless Cu, and the higher the thickness of the electroless Sn/Bi layer is, the lower the shear strength of solder joint is. 展开更多
关键词 ELECTROLESS layer soldered JOINT sn/pb sn/Bi SHEAR STRENGTH
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High temperature rupture of Sn-Pb-0.05RE solder alloy
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作者 王莉 方洪渊 钱乙余 《中国有色金属学会会刊:英文版》 EI CSCD 1999年第4期822-825,共4页
Specimens of Sn-Pb-0.05RE solder alloy were tested to failure under two different stress states,uniaxial tension using smooth bar specimens and triaxial tension using notched bar specimens. The tests were conducted at... Specimens of Sn-Pb-0.05RE solder alloy were tested to failure under two different stress states,uniaxial tension using smooth bar specimens and triaxial tension using notched bar specimens. The tests were conducted at a temperature of 125℃, far above 0. 5 melting temperature of Sn-Pb-0.05RE solder alloy,which leads to a distinctive creep deformation. Rupture times were compared for uniaxial and triaxial stress states with respect to multiaxial stress parameters that are directly related to physical fracture mechanisms.The success of the parameters was judged according to how well the stress parameters correlate with the time to rupture. The results show that the Mises effective stress is the stress factor which dominates the creep rupture of Sn-Pb-0. 05RE solder alloy. It further suggests that the cavity nucleation on a grain boundary plays an important role in the creep rupture process of Sn-Pb-0.05RE solder alloy. 展开更多
关键词 sn-pb-0.05RE soder alloy CREEP RUPTURE STRESS factor MULTIAXIAL STRESS
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The influence of temperature on creep behavior of Cu particle enhanced SnPb based composite soldered joints
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作者 闫焉服 闫红星 +2 位作者 陈拂晓 张柯柯 朱锦洪 《China Welding》 EI CAS 2007年第1期41-46,共6页
Creep property of solder alloys is one of the important factors to affect the reliabdity of soldered joints in SMT (surface mount technology). Particle-enhancement is a way to improve the properties of solder alloys... Creep property of solder alloys is one of the important factors to affect the reliabdity of soldered joints in SMT (surface mount technology). Particle-enhancement is a way to improve the properties of solder alloys and has caused much more attention than before. Temperatures applied to soldered joints are one of the primary factors of affecting creep properties of particle enhancement composite soldered joints. In this paper single shear lap creep specimens with a 1 mm^2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37 Pb based composite soldered joints and 63Sn37 Pb eutectic soldered joints to examine the influence of temperature on creep behavior of soldered joints. Results indicated that the creep resistance of soldered joints of Cu particle enhancement 63Sn37Pb based composite soldered joint was generally superior to that of the conventional 63Sn37Pb soldered joint. At the same time, creep rupture life of the composite soldered joint was declined with increasing temperature and drop faster than that of the conventional 63Sn37 Pb eutectic soldered joint. 展开更多
关键词 creep rupture life composite soldered joints particle-enhancement 63sn37pb TEMPERATURE
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Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization
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作者 Hongtao CHEN Chunqing WANG +1 位作者 Mingyu LI Dewen TIAN 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2007年第1期68-72,共5页
The influence of thermal cycling on the microstructure and joint strength of Sn3.5Ag0.75Cu (SAC) and Sn63Pb37 (SnPb) solder joints was investigated. SAC and SnPb solder balls were soldered on 0.1 and 0.9 μm Au fi... The influence of thermal cycling on the microstructure and joint strength of Sn3.5Ag0.75Cu (SAC) and Sn63Pb37 (SnPb) solder joints was investigated. SAC and SnPb solder balls were soldered on 0.1 and 0.9 μm Au finished metallization, respectively. After 1000 thermal cycles between -40℃ and 125℃, a very thin intermetallic compound (IMC) layer containing Au, Sn, Ni, and Cu formed at the interface between SAC solder joints and underneath metallization with 0.1 μm Au finish, and (Au, Ni, Cu)Sn4 and a very thin AuSn-Ni-Cu IMC layer formed between SAC solder joints and underneath metallization with 0.9 μm Au finish. For SnPb solder joints with 0.1 μm Au finish, a thin (Ni, Cu, Au)3Sn4 IMC layer and a Pb-rich layer formed below and above the (Au, Ni)Sn4 IMC, respectively. Cu diffused through Ni layer and was involved into the IMC formation process. Similar interfacial microstructure was also found for SnPb solder joints with 0.9μm Au finish. The results of shear test show that the shear strength of SAC solder joints is consistently higher than that of SnPb eutectic solder joints during thermal cycling. 展开更多
关键词 sn3.5Ag0.75Cu solder joint Au finish Intermetallic compound
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SnAgCu/Cu和SnPb/Cu界面热剪切循环条件下化合物的生长行为 被引量:9
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作者 齐丽华 黄继华 +3 位作者 张建纲 王烨 张华 赵兴科 《中国有色金属学报》 EI CAS CSCD 北大核心 2006年第10期1705-1709,共5页
对热剪切循环条件下Sn-3.5Ag-0.5Cu/Cu和Sn-Pb/Cu界面上原子扩散和化合物的生长行为进行了研究。结果表明:再流焊后,在两界面上均形成一种Cu6Sn5化合物;随着热剪切循环周数的增加,两界面上化合物的形态均从扇贝状向层状生长,其厚度随循... 对热剪切循环条件下Sn-3.5Ag-0.5Cu/Cu和Sn-Pb/Cu界面上原子扩散和化合物的生长行为进行了研究。结果表明:再流焊后,在两界面上均形成一种Cu6Sn5化合物;随着热剪切循环周数的增加,两界面上化合物的形态均从扇贝状向层状生长,其厚度随循环周数的增加而增加,且生长基本遵循抛物线规律,说明Cu原子的扩散控制了Cu6Sn5化合物的生长。界面近域的钎料内,颗粒状的Ag3Sn聚集长大成块状。 展开更多
关键词 sn-3.5Ag-0.5Cu钎料 sn-pb钎料 热剪切循环 金属间化合物
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倒装焊SnPb焊点热循环失效和底充胶的影响 被引量:10
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作者 陈柳 张群 +2 位作者 王国忠 谢晓明 程兆年 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2001年第1期107-112,共6页
采用实验方法 ,确定了倒装焊 Sn Pb焊点的热循环寿命 .采用粘塑性和粘弹性材料模式描述了 Sn Pb焊料和底充胶的力学行为 ,用有限元方法模拟了 Sn Pb焊点在热循环条件下的应力应变过程 .基于计算的塑性应变范围和实验的热循环寿命 ,确定... 采用实验方法 ,确定了倒装焊 Sn Pb焊点的热循环寿命 .采用粘塑性和粘弹性材料模式描述了 Sn Pb焊料和底充胶的力学行为 ,用有限元方法模拟了 Sn Pb焊点在热循环条件下的应力应变过程 .基于计算的塑性应变范围和实验的热循环寿命 ,确定了倒装焊 Sn Pb焊点热循环失效 Coffin- Manson经验方程的材料参数 .研究表明 ,有底充胶倒装焊 Sn Pb焊点的塑性应变范围比无底充胶时明显减小 ,热循环寿命可提高约 2 0倍 。 展开更多
关键词 倒装焊 snpb焊点 底充胶 热循环 有限元模拟 封装 电子器件
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功率超声对Pb-Sn合金凝固行为的影响 被引量:21
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作者 冯伟骏 谭家隆 +1 位作者 李喜孟 李光 《铸造》 CAS CSCD 北大核心 2004年第5期376-378,共3页
研究了功率超声对铅锡合金凝固过程的影响,分析了其影响机制。结果表明,在功率超声作用下,声空化效应和声流效应使含铅5%的铅锡合金的凝固组织明显细化,并且经过功率600W的超声处理后,先析出相的析出温度升高3℃,凝固温度升高了5℃。随... 研究了功率超声对铅锡合金凝固过程的影响,分析了其影响机制。结果表明,在功率超声作用下,声空化效应和声流效应使含铅5%的铅锡合金的凝固组织明显细化,并且经过功率600W的超声处理后,先析出相的析出温度升高3℃,凝固温度升高了5℃。随着超声功率的增加,合金组织的细化程度提高,但功率提高到一定程度时,细化作用减弱。 展开更多
关键词 功率超声 pbsn合金 凝固组织 声空化 声流
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不同温度下Sn-Pb-RE钎料的力学性能实验研究 被引量:3
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作者 朱颖 康慧 +2 位作者 曲平 方洪渊 钱乙余 《稀土》 EI CAS CSCD 北大核心 1999年第2期54-56,共3页
本文分别在-55℃、25℃及125℃下对稀土含量为0~1.5%的Sn-Pb-RE系列钎料的拉伸性能进行了研究,结果表明,不同温度下,稀土的加入均可使钎料的拉伸强度提高,且稀土含量增加,提高程度增加。同时,本文还对稀土... 本文分别在-55℃、25℃及125℃下对稀土含量为0~1.5%的Sn-Pb-RE系列钎料的拉伸性能进行了研究,结果表明,不同温度下,稀土的加入均可使钎料的拉伸强度提高,且稀土含量增加,提高程度增加。同时,本文还对稀土的作用行为进行了初步讨论。 展开更多
关键词 稀土 钎粒 拉伸强度 力学性能
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Pb/Sn凸点的制备 被引量:3
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作者 刘豫东 谭智敏 +1 位作者 钱志勇 马莒生 《电子元件与材料》 CAS CSCD 北大核心 2002年第9期4-5,20,共3页
介绍了用电镀法制备Pb / Sn凸点的工艺,包括:凸点的设计,圆片的准备,溅射UBM(凸点下金属层),厚膜光刻,电镀Cu柱, Pb / Sn凸点,回流凸点等。结果表明:采用电镀法可以得到球形Pb / Sn凸点,50μm的厚胶工艺是可行的。
关键词 凸点 电镀法 pb/sn焊料 封装技术
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高能球磨制备Al-Pb-Si-Sn-Cu纳米晶粉末的特性 被引量:7
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作者 冉广 周敬恩 +2 位作者 李鹏亮 席生岐 张中武 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2004年第12期1312-1316,共5页
通过机械合金化制备了 Al-15%Pb-4%Si-1%Sn-1.5%Cu(质量分数)纳米晶粉末。采用 X 射线衍射(XRD),扫描电镜(SEM)和透射电镜(TEM)对不同球磨时间的混合粉末的组织结构、晶粒大小、微观形貌以及颗粒中化学成分分布情况进行了研究。结果表... 通过机械合金化制备了 Al-15%Pb-4%Si-1%Sn-1.5%Cu(质量分数)纳米晶粉末。采用 X 射线衍射(XRD),扫描电镜(SEM)和透射电镜(TEM)对不同球磨时间的混合粉末的组织结构、晶粒大小、微观形貌以及颗粒中化学成分分布情况进行了研究。结果表明混合粉末经过球磨后形成了纳米晶,其组织非常均匀。球磨对 Pb 的作用效果明显大于对 Al 的作用效果,经过 40 h 球磨后 Pb 粒子达到 40 nm,而 Al 在球磨 60 h 后晶粒为 65 nm;经球磨后,Cu 和 Si 固溶于 Al 的晶格中,而 Sn 则固溶于 Pb 晶格中,并且 Al 和 Pb 发生了互溶,形成了 Pb(Al)超饱和固溶体;在球磨过程中硬度高的脆性粒子 Si 难于完全实现合金化。 展开更多
关键词 机械合金化 Al—pb—Si—sn—Cu合金 轴瓦合金 纳米晶材料
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Sn-Pb合金枝晶生长的同步辐射X射线衍射增强成像研究 被引量:4
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作者 王同敏 许菁菁 +3 位作者 黄万霞 刘晟初 曹志强 李廷举 《核技术》 CAS CSCD 北大核心 2010年第6期443-446,共4页
用北京同步辐射光源X射线衍射增强成像法对Sn-Pb金属合金的结晶过程进行实时成像研究,成功地获得枝晶生长行为及形貌演变的系列动态图像,为研究金属合金结晶理论提供直接的实验数据。实验观察到接近共晶成分的Sn-50wt.%Pb合金,在一定的... 用北京同步辐射光源X射线衍射增强成像法对Sn-Pb金属合金的结晶过程进行实时成像研究,成功地获得枝晶生长行为及形貌演变的系列动态图像,为研究金属合金结晶理论提供直接的实验数据。实验观察到接近共晶成分的Sn-50wt.%Pb合金,在一定的温度梯度和冷却速率下呈现先等轴晶后柱状晶形貌生长。同步辐射X射线衍射增强成像技术为原位研究不透明的金属合金枝晶生长过程提供了崭新的实验手段,为验证或完善金属合金结晶过程的微观动力学模型提供了有效途径。 展开更多
关键词 枝晶生长 同步辐射 结晶 衍射增强成像 snpb
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Pb-Sn-Me铅酸电池板栅合金的耐腐蚀性能研究 被引量:5
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作者 陈建 相佳媛 +2 位作者 吴贤章 丁平 陈亮 《电源技术》 CAS CSCD 北大核心 2013年第12期2170-2173,共4页
通过对添加不同金属组元的Pb-Sn板栅合金进行微观形态与组织成分的分析,从晶界腐蚀数量、基体腐蚀深度、晶界腐蚀深度三个方面综合评价了Pb-Sn-Me系合金的耐腐蚀性能,并研究了Me的添加对合金耐腐蚀性能,尤其是晶界腐蚀特性的影响。研究... 通过对添加不同金属组元的Pb-Sn板栅合金进行微观形态与组织成分的分析,从晶界腐蚀数量、基体腐蚀深度、晶界腐蚀深度三个方面综合评价了Pb-Sn-Me系合金的耐腐蚀性能,并研究了Me的添加对合金耐腐蚀性能,尤其是晶界腐蚀特性的影响。研究发现,Me的添加对Pb0.3Sn系浇铸板栅的基体腐蚀深度和晶界腐蚀深度有较大影响。Yb、Bi、Si等组元可较好地改善板栅的耐腐蚀性能,而细化晶粒的稀土元素La、Ce等则会恶化板栅的耐腐蚀性能。总体而言,第三组元Me对Pb-Sn合金耐腐蚀的作用机理主要基于对合金晶粒尺寸、是否形成Sn-Me金属间化合物以及抗生长能力这三个方面的影响。 展开更多
关键词 pbsn合金 铅酸蓄电池板栅 合金元素添加 晶界腐蚀
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Al-Pb-Si-Sn-Cu轴瓦合金的微观结构及特征 被引量:7
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作者 冉广 周敬恩 +1 位作者 席生岐 曹利强 《金属热处理》 CAS CSCD 北大核心 2004年第2期3-6,共4页
采用机械合金化、冷压与热挤压法制备了Al 15 %Pb 4 %Si 1%Sn 1 5 %Cu(质量分数 ,% )轴瓦合金。试验结果表明 ,块体材料的组织分布很均匀。Pb粒子细小均匀弥散分布在Al基体上 ,呈纳米晶粒。Al基体晶粒大小约 1 2 μm ,在其晶界和晶粒内... 采用机械合金化、冷压与热挤压法制备了Al 15 %Pb 4 %Si 1%Sn 1 5 %Cu(质量分数 ,% )轴瓦合金。试验结果表明 ,块体材料的组织分布很均匀。Pb粒子细小均匀弥散分布在Al基体上 ,呈纳米晶粒。Al基体晶粒大小约 1 2 μm ,在其晶界和晶粒内都有粒子析出。在Al基体上还分布着由非晶和亚微米晶粒构成的混合相。研究表明 ,该工艺是制备Al Pb系列轴瓦合金的较佳方法 ;并为制备室温不互溶、高温存在很宽固溶间隙、有较大密度差异的合金组元且组织均匀的合金奠定了工艺基础。 展开更多
关键词 机械合金化 Al—pb—Si—sn—Cu合金 轴瓦合金 热挤压
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混合集成电路用Pb-Sn-Sb-Ag钎料的热疲劳 被引量:2
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作者 郭福 刘素婷 +1 位作者 左勇 马立民 《北京工业大学学报》 CAS CSCD 北大核心 2016年第7期1114-1120,共7页
为了解决混合集成电路中环境温度变化引发的焊点可靠性问题,开发了具有高可靠性的新型钎料来满足微型化和高密度化的混合集成电路的焊接需要.对新研发的Pb-Sn-Sb-Ag四元合金钎料进行了DSC熔点测试,热电偶测试了回流焊的温度曲线,对焊点... 为了解决混合集成电路中环境温度变化引发的焊点可靠性问题,开发了具有高可靠性的新型钎料来满足微型化和高密度化的混合集成电路的焊接需要.对新研发的Pb-Sn-Sb-Ag四元合金钎料进行了DSC熔点测试,热电偶测试了回流焊的温度曲线,对焊点显微组织进行了相分析,并参照IPC-9701A测试方法进行了热循环实验,结果发现热循环前后钎料的显微组织和力学性能发生了明显的变化.研究表明:钎料合金液相点在245℃;回流焊峰值温度为267℃;显微组织中主要有Pb、Sb2Sn3和Ag3Sn三种相;热失配产生的剪切应力导致了微裂纹产生,温度交变使裂纹持续扩展,最终导致焊点出现了整体剥离的断裂失效模式;金属间化合物厚度和剪切强度呈现逐渐递减的近似线性关系;对比已应用的钎料,新研制的Pb-Sn-Sb-Ag钎料显微组织均匀,在-40~150℃热循环条件下表现出高的可靠性. 展开更多
关键词 pb-sn-Sb-Ag钎料 热疲劳 显微组织 剪切应力
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旋转磁场作用下Pb-Sn合金的凝固行为 被引量:6
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作者 王建元 陈长乐 孟小华 《材料导报》 EI CAS CSCD 北大核心 2006年第3期152-154,共3页
采用永磁体旋转装置实现了Pb-50wt%Sn亚共晶、Pb-61.9wt%Sn共晶合金旋转磁场条件下的凝固,并对其凝固规律进行了研究。发现与常规条件下相比,旋转磁场导致的合金熔体内部强迫对流加快了合金熔体的冷却速率,提高熔体初始形核温度,促发熔... 采用永磁体旋转装置实现了Pb-50wt%Sn亚共晶、Pb-61.9wt%Sn共晶合金旋转磁场条件下的凝固,并对其凝固规律进行了研究。发现与常规条件下相比,旋转磁场导致的合金熔体内部强迫对流加快了合金熔体的冷却速率,提高熔体初始形核温度,促发熔体提前形核并能使凝固时间缩短。Pb-61.9wt%Sn共晶合金的宏观偏析被有效抑制,在整个样品中得到了二元共晶组织,共晶层片粗化,局域地区出现了不规则共晶组织。对于Pb-50wt%Sn亚共晶,初生相(Pb)的生长方式由粗大枝晶转变为细小的球状颗粒,且晶粒显著细化。 展开更多
关键词 旋转磁场 pbsn合金 形核与生长 强迫对流
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