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Microstructure and microwave dielectric properties of lead borosilicate glass ceramics with Al_2O_3 被引量:4
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作者 韦鹏飞 周洪庆 +2 位作者 王杰 张一源 曾凤 《Journal of Central South University》 SCIE EI CAS 2011年第6期1838-1843,共6页
The effects of Al2O3 addition on both the sintering behavior and microwave dielectric properties of PbO-B203-SiO2 glass ceramics were investigated by Fourier transform infrared spectroscope (FTIR), differential ther... The effects of Al2O3 addition on both the sintering behavior and microwave dielectric properties of PbO-B203-SiO2 glass ceramics were investigated by Fourier transform infrared spectroscope (FTIR), differential thermal analysis (DTA), X-ray diffraction (XRD) and scanning electron microscopy (SEM). The results show that with the increase of Al2O3 content the bands assigned to [SiO4] nearly disappear. Aluminum replaces silicon in the glass network, which is helpful for the formation of boron-oxygen rings. The increase of the transition temperature Tg and softening temperature Tf of PbO-B2O3-SiO2 glass ceramics leads to the increase of liquid phase precipitation temperature and promotes the structure stability in the glasses, and consequently contributes to the decreasing trend of crystallization. Densification and dielectric constants increase with the increase of Al2O3 content, but the dielectric loss is worsened. By contrast, the 3% (mass fraction) Al2O3-doped glass ceramics sintered at 725℃ have better properties of density p=2.72 g/cm3, dielectric constant Er=6.78, dielectric loss tan8=2.6×10^-3 (measured at 9.8 GHz), which suggest that the glass ceramics can be applied in multilayer microwave devices requiring low sintering temperatures. 展开更多
关键词 PbO-B203-SiO2 glass ceramics AL2O3 Fourier transform infrared spectroscope MICROSTRUCTURE dielectric properties
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55%SiCp/6061Al复合材料与PbO-ZnO-B_2O_3玻璃封接机理研究 被引量:3
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作者 许磊 陈志茹 +2 位作者 历长云 王有超 米国发 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2018年第1期169-174,共6页
主要研究了55%SiCp/Al复合材料与PbO-ZnO-B_2O_3玻璃封接过程中的润湿性和界面结合机理。研究结果显示:随温度升高,玻璃在4种母材上的铺展面积逐渐变大,润湿角减小,润湿能力提高,Al_2O_3陶瓷和SiC陶瓷与玻璃封接的铺展面积较大,润湿角较... 主要研究了55%SiCp/Al复合材料与PbO-ZnO-B_2O_3玻璃封接过程中的润湿性和界面结合机理。研究结果显示:随温度升高,玻璃在4种母材上的铺展面积逐渐变大,润湿角减小,润湿能力提高,Al_2O_3陶瓷和SiC陶瓷与玻璃封接的铺展面积较大,润湿角较小,润湿性要优于复合材料。在450~490℃范围内将玻璃与55%SiCp/6061Al进行封接时,当封接温度高于470℃,在封接界面出现气泡,且随着温度升高气泡数量增多,尺寸变大;在460℃下封接时,玻璃与55%SiC/Al复合材料封接界面存在约为12μm的元素互渗区域,490℃时玻璃与Al_2O_3陶瓷的界面分界线清晰,与SiC陶瓷封接界面处,偏向玻璃侧存在SiC颗粒的渗入。 展开更多
关键词 55%SiCp/Al复合材料 pbo-zno-b2O3玻璃 封接 润湿性 界面结合
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