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基于PA-YOLO v5的印制电路板缺陷检测
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作者 陈锦妮 拜晓桦 +1 位作者 李云红 田谷丰 《红外技术》 CSCD 北大核心 2024年第6期654-662,共9页
针对印制电路板裸板布局复杂,在对其表面进行缺陷检测时存在被检测图像对比度不高、亮度不均匀、缺陷位置小、形状不规则等特点,在增加网络深度时会造成参数量大、出现过拟合现象、丢失部分特征信息等问题,提出了基于YOLO v5与混合注意... 针对印制电路板裸板布局复杂,在对其表面进行缺陷检测时存在被检测图像对比度不高、亮度不均匀、缺陷位置小、形状不规则等特点,在增加网络深度时会造成参数量大、出现过拟合现象、丢失部分特征信息等问题,提出了基于YOLO v5与混合注意力机制融合,精度更高的印制电路板检测模型PA-YOLO v5(precision and attention-YOLO v5),抑制一般特征的干扰,保证网络提取特征时更加关注缺陷目标细节特征。并引用自适应双向特征融合模块(Bi FPN)网络,对每个特征图的尺度不同进行充分利用,对不同的检测目标赋予不同权重,提高网络的各个特征表达能力,最后利用FRe LU激活函数,通过将ReLU增加空间拓展成为一个2D激活函数,增强感受野对细节捕捉的能力,提高模型的鲁棒性和泛化性。在DeepPCB数据集中对6种缺陷分别进行测试,实验结果表明,文中提出的PA-YOLO v5的检测模型在该数据集上的准确率可达99.4%,并同时设置消融实验和对比实验验证了该模型的有效性。 展开更多
关键词 缺陷检测 注意力机制 印刷电路板 深度学习
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基于LWN-Net的印刷电路板缺陷检测算法 被引量:2
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作者 文斌 胡晖 杨超 《计算机集成制造系统》 EI CSCD 北大核心 2024年第2期496-507,共12页
针对现阶段印刷电路板缺陷检测任务中网络精度低、速度慢、模型参数量大的问题,提出基于改进YOLOv3的轻量级权重新型网络(LWN-Net),并提出轻量级特征增强网络作为模型的特征提取网络,解决YOLOv3中主干网络Darknet53参数量过多的问题。... 针对现阶段印刷电路板缺陷检测任务中网络精度低、速度慢、模型参数量大的问题,提出基于改进YOLOv3的轻量级权重新型网络(LWN-Net),并提出轻量级特征增强网络作为模型的特征提取网络,解决YOLOv3中主干网络Darknet53参数量过多的问题。考虑到特征提取过程中语义信息和位置信息不平衡会导致检测精度降低,构建权重聚合分配机制消除不平衡,以提高模型特征提取能力。提出新型特征金字塔网络,增强网络对细节信息的提取能力并降低信息冗余度。采用回归损失函数SIoU加快模型的收敛速度并提高检测精度。结果表明,相比YOLOv3,LWN-Net网络的模型规模压缩了87.5%,而检测速度提升了8.32帧·s^(-1),预测精度和召回率分别提升了0.88%和1.6%。该网络的提出为印刷电路板的缺陷检测问题提供了一种更高效的方法。 展开更多
关键词 PCB缺陷检测 YOLOv3 轻量级 SIoU损失函数
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粉末压片-波长色散型X射线荧光光谱法测定废弃印刷线路板中10种金属元素的含量
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作者 代东利 朱月琴 +4 位作者 高捷 盛成 卓尚军 顾哲明 钱荣 《理化检验(化学分册)》 CAS CSCD 北大核心 2024年第9期922-926,共5页
测定废弃印刷线路板(WPCBs)中金属元素含量的方法均需对样品进行消解,操作复杂耗时;X射线荧光光谱法无需样品消解,但由于缺少相似基体的标准样品而定量不准确。基于此,以与WPCBs在元素组成上较为相似的地质类标准物质作为本底物,按不同... 测定废弃印刷线路板(WPCBs)中金属元素含量的方法均需对样品进行消解,操作复杂耗时;X射线荧光光谱法无需样品消解,但由于缺少相似基体的标准样品而定量不准确。基于此,以与WPCBs在元素组成上较为相似的地质类标准物质作为本底物,按不同比例添加环氧树脂及铜粉制备一系列校准样品并绘制校准曲线,提出了题示研究。取WPCBs研磨,过200目(0.074 mm)筛,于105℃烘干,取上述样品5 g置于不锈钢模具中,加入硼酸镶边,用压片机(压力200 kPa,保压时间20 s)制成直径40 mm圆片,采用波长色散型X射线荧光光谱法(WD-XRF)测定其中银、钡、铬、铜、铁、锰、镍、铅、硅、钛等10种金属元素的含量。结果表明:各元素的质量分数在一定范围内与响应强度呈线性关系;方法用于分析其他校准样品,测定值的相对误差的绝对值不大于20%;方法用于测定2个实际WPCBs样品分析,硅的测定结果与氟硅酸钾容量法的基本一致,其他元素测定结果与电感耦合等离子体原子发射光谱法(ICP-AES)的基本一致。 展开更多
关键词 粉末压片 波长色散型X射线荧光光谱法 废弃印刷线路板 金属元素
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过氧化氢-硫酸体系铜箔微蚀工艺及其稳定剂筛选
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作者 曾祥健 袁振杰 +4 位作者 周仲鑫 潘湛昌 胡光辉 周勇胜 邓贤江 《电镀与涂饰》 CAS 北大核心 2024年第10期56-63,共8页
[目的]过氧化氢-硫酸体系用于PCB(印制线路板)微蚀时存在过氧化氢易分解和微蚀速率过高的问题,研发适宜的稳定剂具有重要的意义。[方法]采用由过氧化氢、硫酸和铜离子组成的溶液对铜箔进行微蚀。先通过研究温度和各组分质量浓度对微蚀... [目的]过氧化氢-硫酸体系用于PCB(印制线路板)微蚀时存在过氧化氢易分解和微蚀速率过高的问题,研发适宜的稳定剂具有重要的意义。[方法]采用由过氧化氢、硫酸和铜离子组成的溶液对铜箔进行微蚀。先通过研究温度和各组分质量浓度对微蚀速率的影响以确定微蚀液的基础成分,然后设计了一系列不同组合的复配稳定剂,以获得适用于不同工艺需求的微蚀液。[结果]较佳的微蚀基础配方和工艺条件为:浓硫酸140 g/L,双氧水110 g/L,铜离子25 g/L,温度30℃,时间1 min。可选择以四羟丙基乙二胺(EDTP)和乙二胺四乙酸二钠(EDTA-2Na)为主成分,并适当添加磷酸二氢铵(DAP)、N-甲基二乙醇胺(DMEA)、2-氨基-2-甲基-1-丙醇(AMP)、三乙醇胺(TEA)、2-甲基咪唑(2-MI)和1,6-乙二醇(HDO)中的一种或多种作为辅助成分的复配稳定剂。[结论]本研究所得铜箔微蚀工艺具有微蚀速率及铜箔表面粗糙度、形貌可控的优点,能够满足不同的生产需求。 展开更多
关键词 印制线路板 铜箔 微蚀 过氧化氢 硫酸 稳定剂
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Study on Metals Recovery from -0.074 mm Printed Circuit Boards by Enhanced Gravity Separation 被引量:9
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作者 赵跃民 温雪峰 +2 位作者 施红霞 焦红光 陶有俊 《过程工程学报》 EI CAS CSCD 北大核心 2006年第2期201-204,共4页
Nowadays study on reutilization of discarded printed circuit boards (PCBs) has great significance for achieving secondary resources recycling and preventing environmental pollution. Physical methods show great potenti... Nowadays study on reutilization of discarded printed circuit boards (PCBs) has great significance for achieving secondary resources recycling and preventing environmental pollution. Physical methods show great potential and advantages on discarded PCBs reutilization, compared with chemical and biological methods. However for the particles of 0.074 mm PCBs, little work has been done in the past because of lower separation efficiency and recovery. In this work, the conundrum of 0.074 mm PCBs reutilization was resolved successfully with the help of Falcon concentrator. Separation mechanism for fine particles with different mass densities in a Falcon centrifugal concentrator was analyzed. The main factors such as magnitude of rotation frequency (centrifugal acceleration), anti-charge water pressure and feeding concentration were studied, and interaction of different factors was analyzed using DesignExpert software. The experimental results show that metals grade of 0.074 mm PCBs and integration efficiency were obtained as 76.89% and 80.77% respectively when feeding concentration was 40 g/L with water pressure of 0.01 MPa and rotation frequency of 50 Hz. 展开更多
关键词 印刷电路板 重力分离 选矿 综合利用
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Optimization of low-temperature alkaline smelting process of crushed metal enrichment originated from waste printed circuit boards 被引量:5
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作者 郭学益 刘静欣 《Journal of Central South University》 SCIE EI CAS CSCD 2015年第5期1643-1650,共8页
A novel low-temperature alkaline smelting process is proposed to convert and separate amphoteric metals in crushed metal enrichment originated from waste printed circuit boards. The central composite design was used t... A novel low-temperature alkaline smelting process is proposed to convert and separate amphoteric metals in crushed metal enrichment originated from waste printed circuit boards. The central composite design was used to optimize the operating parameters,in which mass ratio of Na OH-to-CME, smelting temperature and smelting time were chosen as the variables, and the conversions of amphoteric metals tin, lead, aluminum and zinc were response parameters. Second-order polynomial models of high significance and3 D response surface plots were constructed to show the relationship between the responses and the variables. Optimum area of80%-85% Pb conversion and over 95% Sn conversion was obtained by the overlaid contours at mass ratio of Na OH-to-CME of4.5-5.0, smelting temperature of 653-723 K, smelting time of 90-120 min. The models were validated experimentally in the optimum area, and the results demonstrate that these models are reliable and accurate in predicting the smelting process. 展开更多
关键词 low-temperature alkaline smelting waste printed circuit board amphoteric metals central composite design conversion
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基于响应面-遗传算法的印制电路板参数识别
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作者 李晨现 高芳清 舒文浩 《四川轻化工大学学报(自然科学版)》 CAS 2024年第1期35-42,共8页
印制电路板装配件(Printed Circuit Board Assembly,PCBA)在航空航天设备中有广泛应用,分析和优化航空设备中电子设备振动可靠性的必要前提是建立准确的PCBA有限元模型。针对PCBA有限元模型物理参数难以通过实验获取的问题,本文以某机... 印制电路板装配件(Printed Circuit Board Assembly,PCBA)在航空航天设备中有广泛应用,分析和优化航空设备中电子设备振动可靠性的必要前提是建立准确的PCBA有限元模型。针对PCBA有限元模型物理参数难以通过实验获取的问题,本文以某机载电子设备PCBA为案例,首先通过最小分辨率V(Minimum Run with Resolution V,MRRV)的中心复合设计(Central Composite Design,CCD)建立多因素模型响应面函数样本点;然后根据最小二乘法确定响应面函数系数并完成响应面精度检验,构建响应值与模态试验结果误差的多目标函数;再采用快速分类的非支配排序遗传算法(Non-dominated Sorting Genetic Algorithm-Ⅱ,NSGA-Ⅱ)进行多目标参数识别,将识别后的参数代入ABAQUS有限元模型进行仿真分析,最后与模态试验和随机振动试验结果进行对比。结果表明:模态频率平均误差减少到2.70%,随机振动响应平均误差为5.83%,验证了此方法对机载振动环境下PCBA模型参数识别的有效性。 展开更多
关键词 印制电路板 数值试验设计 模型参数识别 响应面法 非支配排序遗传算法
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Study on High-power LED Heat Dissipation Based on Printed Circuit Board 被引量:2
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作者 WANG Yiwei ZHANG Jianxin +1 位作者 NIU Pingjuan LI Jingyi 《Semiconductor Photonics and Technology》 CAS 2010年第2期121-125,共5页
In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resi... In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp. 展开更多
关键词 high-power LED printed circuit board(PCB) substrate of heat dissipation thermal resistance junction temperature
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基于YOLO-PCB的印刷电路板裸板缺陷检测
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作者 王龙业 黄鋆 曾晓莉 《科学技术与工程》 北大核心 2024年第15期6338-6345,共8页
针对当前印刷电路板(printed circuit board,PCB)裸板缺陷检测算法对小目标检测准确率较低、误检率过高等问题,提出一种改进的YOLO-PCB缺陷检测算法。该算法在YOLOv5s算法的基础上引入注意力机制,增强特征图的通道特征;同时引入加权双... 针对当前印刷电路板(printed circuit board,PCB)裸板缺陷检测算法对小目标检测准确率较低、误检率过高等问题,提出一种改进的YOLO-PCB缺陷检测算法。该算法在YOLOv5s算法的基础上引入注意力机制,增强特征图的通道特征;同时引入加权双向特征金字塔网络改进特征融合层,使网络实现更高层次的特征融合;而且增加小目标检测层,提高网络对印刷电路板上小目标缺陷的检测能力。实验结果表明,相较于原YOLOv5算法,改进后的检测算法具有更强的特征提取融合能力和更高的检测精度,YOLO-PCB算法的mAP0.5提升了4.08%,mAP0.5:0.95提升了56.69%,精确度提升了1.81%,召回率提升了6.76%。 展开更多
关键词 印刷电路板 YOLOv5 小目标检测 注意力机制
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融合RCS-OSA结构的PCB缺陷检测算法
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作者 王超 梁根 《信息与电脑》 2024年第3期86-88,共3页
针对当前印制电路板(Printed Circuit Board,PCB)检测参数庞大、人工误检率高等问题,文章研究了一种改进的YOLOv5检测模型。首先使用实时控制系统(Real-Time Control Systems,RCS)模块替换三卷积跨阶段局部瓶颈模块(Cross Stage Partial... 针对当前印制电路板(Printed Circuit Board,PCB)检测参数庞大、人工误检率高等问题,文章研究了一种改进的YOLOv5检测模型。首先使用实时控制系统(Real-Time Control Systems,RCS)模块替换三卷积跨阶段局部瓶颈模块(Cross Stage Partial Bottle Neck Mudule,C3)结构,通过重参数化卷积增强网络的特征提取能力;其次添加One-Shot聚合(One-Shot Aggregation,OSA)结构,一次性聚合多个特征级联;最后堆叠RCS-OSA模块,确保特征复用并加强不同层之间的信息流通。实验结果表明,改进后的算法检测精度达到94.6%,比原模型提高了2.2个百分点。该算法能够高效检测PCB的多种缺陷类型,对PCB质量检测有实际应用价值。 展开更多
关键词 缺陷检测 YOLOv5 印制电路板(PCB) 特征级联
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直通道PCHE内S-CO_(2)与铅铋合金耦合换热特性数值分析 被引量:1
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作者 刘凯 彭军 +3 位作者 赵富龙 董显敏 田瑞峰 谭思超 《哈尔滨工程大学学报》 EI CAS CSCD 北大核心 2023年第12期2103-2111,共9页
针对超临界二氧化碳(S-CO_(2))与液态铅铋合金在印刷电路板换热器内耦合换热问题,本文建立了“1对2型”直通道印刷电路板换热器换热单元三维模型。采用数值模拟方法对S-CO_(2)与液态铅铋合金耦合换热特性进行了研究。结果表明:冷侧S-CO_... 针对超临界二氧化碳(S-CO_(2))与液态铅铋合金在印刷电路板换热器内耦合换热问题,本文建立了“1对2型”直通道印刷电路板换热器换热单元三维模型。采用数值模拟方法对S-CO_(2)与液态铅铋合金耦合换热特性进行了研究。结果表明:冷侧S-CO_(2)对流换热热阻远大于热侧液态铅铋合金热阻,即印刷电路板换热器整体换热更受制于S-CO_(2)的影响,且S-CO_(2)侧的换热强度决定了整体换热的下限。改变S-CO_(2)侧入口质量流速比改变液态铅铋合金侧入口质量流速对印刷电路板换热器换热器单元功率影响程度更大。S-CO_(2)侧入口质量流速每增加1 kg/s,换热功率增加335.77 kW。本文研究结果可为后续液态铅铋合金与S-CO_(2)耦合换热研究和印刷电路板换热器设计提供参考。 展开更多
关键词 超临界CO_(2) 铅铋合金 印刷电路板 换热器 直通道 耦合换热特性 超临界流体 数值分析
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Supergravity separation of Pb and Sn from waste printed circuit boards at different temperatures 被引量:4
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作者 Long Meng Zhe Wang +2 位作者 Yi-wei Zhong Kui-yuan Chen Zhan-cheng Guo 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2018年第2期173-180,共8页
Printed circuit boards(PCBs) contain many toxic substances as well as valuable metals, e.g., lead(Pb) and tin(Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratio... Printed circuit boards(PCBs) contain many toxic substances as well as valuable metals, e.g., lead(Pb) and tin(Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratios of Pb and Sn from Pb–Sn alloys in PCBs. In a supergravity field, the liquid metal phase can permeate from solid particles. Hence, temperatures of 200, 280, and 400°C were chosen to separate Pb and Sn from PCBs. The results depicted that gravity coefficient only affected the recovery rates of Pb and Sn, whereas it had little effect on the mass ratios of Pb and Sn in the obtained alloys. With an increase in gravity coefficient, the recovery values of Pb and Sn in each step of the separation process increased. In the single-step separation process, the mass ratios of Pb and Sn in Pb–Sn alloys were 0.55, 0.40, and 0.64 at 200, 280, and 400°C, respectively. In the two-step separation process, the mass ratios were 0.12 and 0.55 at 280 and 400°C, respectively. Further, the mass ratio was observed to be 0.76 at 400°C in the three-step separation process. This process provides an innovative approach to the recycling mechanism of Pb and Sn from PCBs. 展开更多
关键词 printed circuit boards supergravity separation recovery Pb–Sn alloy gravity coefficient
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10 Gb/s Optical Interconnection on Flexible Optical Waveguide in Electronic Printed Circuit Board 被引量:2
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作者 Shih-Hsiang Hsu Chih-Yuan Tsou +1 位作者 Chih-Ming Wang Sheng-Chieh Tseng 《Optics and Photonics Journal》 2013年第2期252-255,共4页
In this paper, we proposed 10 Gb/s transmission using 4-channel polymer waveguides on the optical electronic printed circuit board. It was simulated by the ray tracing method for tolerance study of optical interconnec... In this paper, we proposed 10 Gb/s transmission using 4-channel polymer waveguides on the optical electronic printed circuit board. It was simulated by the ray tracing method for tolerance study of optical interconnection and fabrication. In order for easy fabrication and high position accuracy, the polymer waveguides were forming silver coated 45° reflective mirrors by dicing method and e-beam deposition for 90° light beam turning. The coupling loss was demonstrated in different polishing grit sizes. The optical interconnection in board-embed 4-channel flexible waveguides was demonstrated with a low propagation loss of 0.1 dB/cm and a clear eye diagram at 2.5 Gb/s data rate per channel. 展开更多
关键词 FLEXIBLE WAVEGUIDE Optical ELECTRONIC printED Circuit board
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An Experimental Study of the Printed-Circuit Elliptic Dipole Antenna with 1.5-16 GHz Bandwidth 被引量:1
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作者 Chun-Chi LEE Hsin-Sheng HUANG +1 位作者 Cheng-Da YANG Chia-Wei WANG 《International Journal of Communications, Network and System Sciences》 2008年第4期295-300,共6页
Printed-circuit board (PCB) elliptic antennas with useful bandwidth exceeding 10:1 ratio are suitable for wideband radar, wireless ultra wideband (UWB) and other wireless communication applications. We present wideban... Printed-circuit board (PCB) elliptic antennas with useful bandwidth exceeding 10:1 ratio are suitable for wideband radar, wireless ultra wideband (UWB) and other wireless communication applications. We present wideband PCB elliptic dipole antennas which are capable of achieving the bandwidth requirements for all the applications. A set of elliptic dipole antennas with varying eccentricities have been fabricated for demonstration. We find one specific size (specific eccentricity) dipole that can yield an impressive 1.5-16 bandwidth exceeding the currently available. A couple of elliptic dipole antennas suitable for UWB application have been presented. We have measured swept frequency response, impedance and radiation patterns of all dipoles. An empirical formula is given for calculating the starting resonant frequency within the operating band. The calculated values are found in good agreement with measured results. 展开更多
关键词 ELLIPTIC DIPOLE ANTENNA WIDEBAND Radar ANTENNA printed-Circuit board (PCB) Ultra WIDEBAND (UWB)
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Numerical Analysis of Printed Circuit Board with Thermal Vias: Heat Transfer Characteristics under Nonisothermal Boundary Conditions 被引量:1
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作者 Yasushi Koito Yoshihiro Kubo Toshio Tomimura 《Journal of Electronics Cooling and Thermal Control》 2013年第4期136-143,共8页
A thermal via has been used to enhance the heat transfer through the printed circuit board (PCB). Because the thermal conductivity of a dielectric material is very low, the array of metal vias is placed to make therma... A thermal via has been used to enhance the heat transfer through the printed circuit board (PCB). Because the thermal conductivity of a dielectric material is very low, the array of metal vias is placed to make thermal paths in the PCB. This paper describes the numerical analysis of the PCB having metal vias and focuses on the heat transfer characteristics under the nonisothermal boundary conditions. The mathematical model of the PCB has the metal vias between two metal sheets. Under 2nd and 3rd kinds of boundary conditions, the temperature distribution is obtained numerically by changing the design parameters. The discussion is also made on the effective thermal conductivity of the PCB. In industry, the use of effective thermal conductivity is convenient for thermal engineers because it simplifies the calculation process, that is, the composite board can be modeled as a homogeneous medium. From the numerical results, it is confirmed that the placement of metal sheets and the population of metal vias are important factors to dominate the heat transfer characteristics of the PCB. It is also shown that although the nonisothermal boundary conditions are applied at the boundary surface, the temperature difference between the heated and the cooled section is almost uniform when the metal vias are populated densely with the metal sheets. In this case, the effective thermal conductivity of the PCB is found to be the same irrespective of the boundary conditions, that is, whether the isothermal or the nonisothermal boundary conditions are applied. 展开更多
关键词 THERMAL Management printED Circuit board THERMAL Via Effective THERMAL CONDUCTIVITY NONISOTHERMAL Boundary Condition
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基于GENI-SD的定制化印制电路板工序重要性评估
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作者 劳景春 金鸿 +1 位作者 吕盛坪 李文强 《计算机应用研究》 CSCD 北大核心 2023年第5期1441-1446,共6页
精准评估影响定制化印制电路板质量的关键工序,可更好地指导企业精益管理产品品质,但企业常用方法难以利用工序关联实体间的深层语义。为解决上述问题,构建工序关联实体知识图谱并提出GENI-SD模型评估工序重要性。首先,使用知识图谱表... 精准评估影响定制化印制电路板质量的关键工序,可更好地指导企业精益管理产品品质,但企业常用方法难以利用工序关联实体间的深层语义。为解决上述问题,构建工序关联实体知识图谱并提出GENI-SD模型评估工序重要性。首先,使用知识图谱表征工序关联实体间的关系,并采用图神经网络模型GENI对工序节点进行重要性评估;然后,引入基于改进谓词感知注意力机制的采样模块和考虑邻边方向的分数聚合,改进GENI容易聚合到噪声邻节点且未考虑邻边方向的不足,建立工序重要性评估新模型GENI-SD。最后,以PCB车间真实数据开展实验验证,结果显示GENI-SD优于其他对比模型,且得到的Spearman和NDCG@10指标值较GENI所得结果分别提高6.78%和0.71%。该研究为工序重要性评估提供了新的有效方法。 展开更多
关键词 印制电路板 知识图谱 图神经网络 采样 分数聚合
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Recycling process assessment of mechanical recycling of printed circuit board
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作者 潘君齐 刘志峰 +2 位作者 刘光复 王淑旺 黄海鸿 《Journal of Central South University》 SCIE EI CAS 2005年第S2期157-161,共5页
A comprehensive assessment index system was established. The mechanical recycling process of printed circuit board was evaluated according to the comprehensive evaluation index system using the fuzzy analytic hierarch... A comprehensive assessment index system was established. The mechanical recycling process of printed circuit board was evaluated according to the comprehensive evaluation index system using the fuzzy analytic hierarchy process. A process assessment software system of mechanical recycling was established to evaluate different recycling technologies. And the software system was developed in the environment of VB6.0 and Access2000. 展开更多
关键词 printED circuit board mechanical RECYCLING PROCESS ASSESSMENT fuzzy ANALYTIC HIERARCHY PROCESS
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A corrected method of distorted printed circuit board image
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作者 乔闹生 叶玉堂 黄永林 《Chinese Physics B》 SCIE EI CAS CSCD 2011年第1期366-370,共5页
This paper proposes a corrected method of distorted image based on adaptive control. First, the adaptive control relationship of pixel point positions between distorted image and its corrected image is given by using ... This paper proposes a corrected method of distorted image based on adaptive control. First, the adaptive control relationship of pixel point positions between distorted image and its corrected image is given by using polynomial fitting, thus control point pairs between the distorted image and its corrected image are found. Secondly, the value of both image distortion centre and polynomial coefficient is obtained with least square method, thus the relationship of each control point pairs is deduced. In the course of distortion image processing, the gray value of the corrected image is changed into integer with bilinear interpolation. Finally, the experiments are performed to correct two distorted printed circuit board images. The results are perfect and the mean square errors of residual error are tiny. 展开更多
关键词 distortion correction adaptive control printed circuit board image mean square errorof residual error
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基于改进YOLOX-s算法的印刷电路板缺陷检测 被引量:2
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作者 房娟艳 孟金葆 +1 位作者 魏长城 徐铸 《皖西学院学报》 2023年第2期46-54,共9页
印刷电路板(Printed Circuit Board,PCB)行业中的缺陷检测是质量监测的关键环节。传统的PCB缺陷检测方法在处理微小且分布复杂的缺陷时可能存在局限性,无法达到理想的检测效果。提出了一种改进的基于YOLOX神经网络的PCB缺陷检测方法,以... 印刷电路板(Printed Circuit Board,PCB)行业中的缺陷检测是质量监测的关键环节。传统的PCB缺陷检测方法在处理微小且分布复杂的缺陷时可能存在局限性,无法达到理想的检测效果。提出了一种改进的基于YOLOX神经网络的PCB缺陷检测方法,以提高缺陷识别率。改进的方法包括加入CBAM注意力机制以加强特征提取网络,从而聚焦于目标区域,改善检测效果,并解决复杂情况下微小缺陷经常被错误识别和忽视的问题。同时,选择广义重叠联合(GIOU)定位损失函数来关注目标框架之间的重叠区域和中心点距离,以提高模型的定位精度;通过使用VariFocalLoss替换二元交叉熵损失来改善置信度预测损失,从而减小对目标缺陷的漏检率。经过一系列实验,改进后的算法表现更好,平均精度(mAP)达到了96.18%,相较于原算法提高了2.12%。本文提出的方法为PCB缺陷检测提供了更准确和可靠的解决方案。 展开更多
关键词 PCB缺陷检测 印刷电路板 YOLOX VariFocalLoss GIOU损失函数
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Review: Current Status of Recycling of Waste Printed Circuit Boards in India
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作者 Rashmi Kumar Dahyalal. J. Shah 《Journal of Environmental Protection》 2014年第1期9-16,共8页
Printed Circuit Boards (PCBs) are an integral part of any electronic equipment. The growth of e-waste as end-of-life electronic equipments at an exponential rate is producing large quantities of discarded PCBs. In Ind... Printed Circuit Boards (PCBs) are an integral part of any electronic equipment. The growth of e-waste as end-of-life electronic equipments at an exponential rate is producing large quantities of discarded PCBs. In India, current recycling and processing of PCBs is managed almost entirely by the informal sector or the unskilled labor (95%). The crude recycling activities cause irreversible health and environmental hazards and the loss of valuable materials due to the poor recovery of base and precious metals. With the disclosures of the recycling being done by unskilled labor, alternative recycling strategies are being sought with the aim of higher recovery of materials in an environment friendly manner. There is an urgent need to establish effective and efficient methods for recycling the metals presented in the waste PCBs. In this study, the existing methods practiced for recycling of waste PCBs in India and the management strategies for handling them are assessed. 展开更多
关键词 printED Circuit boardS INDIA E-WASTE INFORMAL RECYCLING
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