A 512-bit EEPROM IP was designed by using just logic process based devices.To limit the voltages of the devices within 5.5 V,EEPROM core circuits,control gate(CG) and tunnel gate(TG) driving circuits,DC-DC converters:...A 512-bit EEPROM IP was designed by using just logic process based devices.To limit the voltages of the devices within 5.5 V,EEPROM core circuits,control gate(CG) and tunnel gate(TG) driving circuits,DC-DC converters:positive pumping voltage(VPP=4.75 V) ,negative pumping voltage(VNN=4.75 V) ,and VNNL(=VNN/2) generation circuit were proposed.In addition,switching powers CG high voltage(CG_HV) ,CG low voltage(CG_LV) ,TG high voltage(TG_HV) ,TG low voltage(TG_LV) ,VNNL_CG and VNNL_TG switching circuit were supplied for the CG and TG driving circuit.Furthermore,a sequential pumping scheme and a new ring oscillator with a dual oscillation period were proposed.To reduce a power consumption of EEPROM in the write mode,the reference voltages VREF_VPP for VPP and VREE_VNN for VNN were used by dividing VDD(1.2 V) supply voltage supplied from the analog block in stead of removing the reference voltage generators.A voltage level detector using a capacitive divider as a low-power DC-DC converter design technique was proposed.The result shows that the power dissipation is 0.34μW in the read mode,13.76μW in the program mode,and 13.66μW in the erase mode.展开更多
With the introduction of EUV lithography,the photolithographic process in 5 nm logic process can be simplified to use mostly single exposure method.In a typical 5 nm logic process,the contact-poly pitch(CPP)is 44-50 n...With the introduction of EUV lithography,the photolithographic process in 5 nm logic process can be simplified to use mostly single exposure method.In a typical 5 nm logic process,the contact-poly pitch(CPP)is 44-50 nm,the minimum metal pitch(MPP)is around 30-32 nm.And the overlay budget is estimated to be 2.5 nm(on product overlay).Although the optical resolution of a 0.33NA exposure tool(such as ASML NXE3400)can reach below 32 nm pitch,stochastics in the EUV absorption in photoresists has limited its application to smaller pitches.For the CPP mentioned above,one can use 193 nm immersion lithography with Self-Aligned Double Patterning(SADP)technique to provide good image contrast(or CDU,LWR)as well as good overlay,as for the 10 and 7 nm generations.In the BEOL,however,the 30-32 pitch cannot be realized by a single EUV exposure with enough printing defect process window.If this pitch is to be done by 193 nm immersion lithography,more than 6-8 exposures are needed with very complicated overlay result.For EUV,this can be done through self-aligned LELE with both good CD and overlay control.We have done an optimization of the photolithographic process parameters for the typical metal with a self-developed aerial image simulator based on rigorous coupled wave analysis(RCWA)algorithm and the Abbe imaging routine with an EUV absorption model which describes stochastics.We have calibrated our model with wafer exposure data from several photoresists under collaboration with IMEC.As we have presented last year,to accommodate all pitches under a logic design rule,as well as to provide enough CDU for the logic device performance,in DUV lithography,a typical minimum exposure latitude(EL)for the poly and metal layers can be set at,respectively,18%and 13%.In EUV,due to the existence of stochastics,13%EL,which corresponds to an imaging contrast of 40%,seems not enough for the metal trenches,and to obtain an imaging contrast close to 100%,which yields an EL of 31.4%means that we need to relax minimum pitch to above 41 nm(conventional imaging limit for 0.33NA).This is the best imaging contrast a photolithographic process can provide to reduce LWR and stochastics.In EUV,due to the significantly smaller numerical apertures compared to DUV,the aberration impact can cause much more pronounced image registration error,in order to satisfy 2.5 nm total overlay,the aberration induced shift needs to be kept under 0.2 nm.We have also studied shadowing effect and mask 3D scattering effect and our results will be provided for discussion.展开更多
A single poly EEPROM cell circuit sharing the deep N-well of a cell array was designed using the logic process. The proposed cell is written by the FN tunneling scheme and the cell size is 41.26 μm2, about 37% smalle...A single poly EEPROM cell circuit sharing the deep N-well of a cell array was designed using the logic process. The proposed cell is written by the FN tunneling scheme and the cell size is 41.26 μm2, about 37% smaller than the conventional cell. Also, a small-area and low-power 512-bit EEPROM IP was designed using the proposed cells which was used for a 900 MHz passive UHF RFID tag chip. To secure the operation of the cell proposed with 3.3 V devices and the reliability of the used devices, an EEPROM core circuit and a DC-DC converter were proposed. Simulation results for the designed EEPROM IP based on the 0.18μm logic process show that the power consumptions in read mode, program mode and erase mode are 11.82, 25.15, and 24.08 ~tW, respectively, and the EEPROM size is 0.12 mm2.展开更多
How to design a multicast key management system with high performance is a hot issue now. This paper will apply the idea of hierarchical data processing to construct a common analytic model based on directed logical k...How to design a multicast key management system with high performance is a hot issue now. This paper will apply the idea of hierarchical data processing to construct a common analytic model based on directed logical key tree and supply two important metrics to this problem： re-keying cost and key storage cost. The paper gives the basic theory to the hierarchical data processing and the analyzing model to multieast key management based on logical key tree. It has been proved that the 4-ray tree has the best performance in using these metrics. The key management problem is also investigated based on user probability model, and gives two evaluating parameters to re-keying and key storage cost.展开更多
基金Project supported by the Second Stage of Brain Korea 21
文摘A 512-bit EEPROM IP was designed by using just logic process based devices.To limit the voltages of the devices within 5.5 V,EEPROM core circuits,control gate(CG) and tunnel gate(TG) driving circuits,DC-DC converters:positive pumping voltage(VPP=4.75 V) ,negative pumping voltage(VNN=4.75 V) ,and VNNL(=VNN/2) generation circuit were proposed.In addition,switching powers CG high voltage(CG_HV) ,CG low voltage(CG_LV) ,TG high voltage(TG_HV) ,TG low voltage(TG_LV) ,VNNL_CG and VNNL_TG switching circuit were supplied for the CG and TG driving circuit.Furthermore,a sequential pumping scheme and a new ring oscillator with a dual oscillation period were proposed.To reduce a power consumption of EEPROM in the write mode,the reference voltages VREF_VPP for VPP and VREE_VNN for VNN were used by dividing VDD(1.2 V) supply voltage supplied from the analog block in stead of removing the reference voltage generators.A voltage level detector using a capacitive divider as a low-power DC-DC converter design technique was proposed.The result shows that the power dissipation is 0.34μW in the read mode,13.76μW in the program mode,and 13.66μW in the erase mode.
文摘With the introduction of EUV lithography,the photolithographic process in 5 nm logic process can be simplified to use mostly single exposure method.In a typical 5 nm logic process,the contact-poly pitch(CPP)is 44-50 nm,the minimum metal pitch(MPP)is around 30-32 nm.And the overlay budget is estimated to be 2.5 nm(on product overlay).Although the optical resolution of a 0.33NA exposure tool(such as ASML NXE3400)can reach below 32 nm pitch,stochastics in the EUV absorption in photoresists has limited its application to smaller pitches.For the CPP mentioned above,one can use 193 nm immersion lithography with Self-Aligned Double Patterning(SADP)technique to provide good image contrast(or CDU,LWR)as well as good overlay,as for the 10 and 7 nm generations.In the BEOL,however,the 30-32 pitch cannot be realized by a single EUV exposure with enough printing defect process window.If this pitch is to be done by 193 nm immersion lithography,more than 6-8 exposures are needed with very complicated overlay result.For EUV,this can be done through self-aligned LELE with both good CD and overlay control.We have done an optimization of the photolithographic process parameters for the typical metal with a self-developed aerial image simulator based on rigorous coupled wave analysis(RCWA)algorithm and the Abbe imaging routine with an EUV absorption model which describes stochastics.We have calibrated our model with wafer exposure data from several photoresists under collaboration with IMEC.As we have presented last year,to accommodate all pitches under a logic design rule,as well as to provide enough CDU for the logic device performance,in DUV lithography,a typical minimum exposure latitude(EL)for the poly and metal layers can be set at,respectively,18%and 13%.In EUV,due to the existence of stochastics,13%EL,which corresponds to an imaging contrast of 40%,seems not enough for the metal trenches,and to obtain an imaging contrast close to 100%,which yields an EL of 31.4%means that we need to relax minimum pitch to above 41 nm(conventional imaging limit for 0.33NA).This is the best imaging contrast a photolithographic process can provide to reduce LWR and stochastics.In EUV,due to the significantly smaller numerical apertures compared to DUV,the aberration impact can cause much more pronounced image registration error,in order to satisfy 2.5 nm total overlay,the aberration induced shift needs to be kept under 0.2 nm.We have also studied shadowing effect and mask 3D scattering effect and our results will be provided for discussion.
基金Project(10039239) supported by the Industrial Strategic Technology Development Program Funded by the Ministry of Knowledge Economy, Korea
文摘A single poly EEPROM cell circuit sharing the deep N-well of a cell array was designed using the logic process. The proposed cell is written by the FN tunneling scheme and the cell size is 41.26 μm2, about 37% smaller than the conventional cell. Also, a small-area and low-power 512-bit EEPROM IP was designed using the proposed cells which was used for a 900 MHz passive UHF RFID tag chip. To secure the operation of the cell proposed with 3.3 V devices and the reliability of the used devices, an EEPROM core circuit and a DC-DC converter were proposed. Simulation results for the designed EEPROM IP based on the 0.18μm logic process show that the power consumptions in read mode, program mode and erase mode are 11.82, 25.15, and 24.08 ~tW, respectively, and the EEPROM size is 0.12 mm2.
基金Supported by the National High-Technology Re-search and Development Programof China(2001AA115300) the Na-tional Natural Science Foundation of China (69874038) ,the Nat-ural Science Foundation of Liaoning Province(20031018)
文摘How to design a multicast key management system with high performance is a hot issue now. This paper will apply the idea of hierarchical data processing to construct a common analytic model based on directed logical key tree and supply two important metrics to this problem： re-keying cost and key storage cost. The paper gives the basic theory to the hierarchical data processing and the analyzing model to multieast key management based on logical key tree. It has been proved that the 4-ray tree has the best performance in using these metrics. The key management problem is also investigated based on user probability model, and gives two evaluating parameters to re-keying and key storage cost.
