The prospects ofa p＋nn＋ cubic silicon carbide （3C-SiC/fl-SiC） based IMPATT diode as a potential solidstate terahertz source is studied for the first time through a modified generalized simulation scheme. The simul...The prospects ofa p＋nn＋ cubic silicon carbide （3C-SiC/fl-SiC） based IMPATT diode as a potential solidstate terahertz source is studied for the first time through a modified generalized simulation scheme. The simulation predicts that the device is capable of generating an RF power output of 63.0 W at 0.33 THz with an efficiency of 13%. The effects of parasitic series resistance on the device performance and exploitable RF power level are further simulated. The studies clearly establish the potential of 3C-SiC as a base semiconductor material for a high-power THz IMPATT device. Based on the simulation results, an attempt has been made to fabricate β-SiC based IMPATT devices in the THz region. Single crystalline, epitaxial 3C-SiC films are deposited on silicon （Si） （100） substrates by rapid thermal chemical vapour deposition （RTPCVD） at a temperature as low as 800 ℃ using a single precursor methylsilane, which contains Si and C atoms in the same molecule. No initial surface carbonization step is required in this method. A p-n junction with an n-type doping concentration of 4 × 10^24 m-3 （which is similar to the simulated design data） has been grown successfully and the characterization of the grown 3C-SiC film is reported in this paper. It is found that the inclusion of Ge improves the crystal quality and reduces the surface roughness.展开更多
文摘The prospects ofa p＋nn＋ cubic silicon carbide （3C-SiC/fl-SiC） based IMPATT diode as a potential solidstate terahertz source is studied for the first time through a modified generalized simulation scheme. The simulation predicts that the device is capable of generating an RF power output of 63.0 W at 0.33 THz with an efficiency of 13%. The effects of parasitic series resistance on the device performance and exploitable RF power level are further simulated. The studies clearly establish the potential of 3C-SiC as a base semiconductor material for a high-power THz IMPATT device. Based on the simulation results, an attempt has been made to fabricate β-SiC based IMPATT devices in the THz region. Single crystalline, epitaxial 3C-SiC films are deposited on silicon （Si） （100） substrates by rapid thermal chemical vapour deposition （RTPCVD） at a temperature as low as 800 ℃ using a single precursor methylsilane, which contains Si and C atoms in the same molecule. No initial surface carbonization step is required in this method. A p-n junction with an n-type doping concentration of 4 × 10^24 m-3 （which is similar to the simulated design data） has been grown successfully and the characterization of the grown 3C-SiC film is reported in this paper. It is found that the inclusion of Ge improves the crystal quality and reduces the surface roughness.
