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Effect of oxygen concentration on resistive switching behavior in silicon oxynitride film
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作者 Da Chen Shihua Huang Lü He 《Journal of Semiconductors》 EI CAS CSCD 2017年第4期23-26,共4页
SiOxNy films with different oxygen concentrations were fabricated by reactive magnetron sputtering,and the resistive switching characteristics and conduction mechanism of Cu/SiOxNy/ITO devices were investigated.The Cu... SiOxNy films with different oxygen concentrations were fabricated by reactive magnetron sputtering,and the resistive switching characteristics and conduction mechanism of Cu/SiOxNy/ITO devices were investigated.The Cu/SiOxNy/ITO device with SiOxNy deposited in 0.8-sccm O2 flow shows a reliable resistive switching behavior,including good endurance and retention properties.As the conductivity of SiOxNy increases with the increase of the oxygen content dynamical electron trapping and detrapping is suggested to be the conduction mechanism.The temperature dependent I-V measurement indicates that the carrier transport can be ascribed to the hopping conduction rather than the metallic conductive filament. 展开更多
关键词 silicon oxynitride resistive random access memory oxygen concentration
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Removal of Ni(ll) ions from wastewater by micellar enhanced ultrafiltration using mixed surfactants 被引量:1
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作者 Amar D. Vibhandik Kumudini V. Marathe 《Frontiers of Chemical Science and Engineering》 SCIE EI CAS CSCD 2014年第1期79-86,共8页
Ni(II) ions were removed from aqueous waste using micellar enhanced ultrafiltration (MEUF) with a mixture of surfactants. The surfactant mixture was the nonionic surfactant Tween 80 (TW80) mixed with the anionic... Ni(II) ions were removed from aqueous waste using micellar enhanced ultrafiltration (MEUF) with a mixture of surfactants. The surfactant mixture was the nonionic surfactant Tween 80 (TW80) mixed with the anionic surfactant sodium dodecyl sulfate (SDS) in different molar ratios ranging from 0.1-1.5. The opera- tional variables of the MEUF process such as pH, applied pressure, surfactant to metal ion ratio and nonionic to ionic surfactant molar ratio (α) were evaluated. Rejection of Ni and TW80 was 99% and 98% respectively whereas that for SDS was 65%. The flux and all resistances (fouling resistance, resistance due to concentration polarization) were measured and calculated for entire range of α respectively. A calculated flux was found to be declined with time, which was mainly attributed to concentration polarization rather than resistance from membrane fouling. 展开更多
关键词 MEUF Ni (II) ions membrane resistance concentration polarization mixed surfactants
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