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Optimal Integrated Schedule of Entire Process of Dual-blade Multi-cluster Tools From Start-up to Close-down 被引量:7
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作者 Qinghua Zhu Yan Qiao Naiqi Wu 《IEEE/CAA Journal of Automatica Sinica》 EI CSCD 2019年第2期553-565,共13页
Multi-cluster tools are widely used in majority of wafer fabrication processes in semiconductor industry. Smaller lot production, thinner circuit width in wafers, larger wafer size, and maintenance have resulted in a ... Multi-cluster tools are widely used in majority of wafer fabrication processes in semiconductor industry. Smaller lot production, thinner circuit width in wafers, larger wafer size, and maintenance have resulted in a large quantity of their start-up and close-down transient periods. Yet, most of existing efforts have been concentrated on scheduling their steady states.Different from such efforts, this work schedules their transient and steady-state periods subject to wafer residency constraints. It gives the schedulability conditions for the steady-state scheduling of dual-blade robotic multi-cluster tools and a corresponding algorithm for finding an optimal schedule. Based on the robot synchronization conditions, a linear program is proposed to figure out an optimal schedule for a start-up period, which ensures a tool to enter the desired optimal steady state. Another linear program is proposed to find an optimal schedule for a closedown period that evolves from the steady state period. Finally,industrial cases are presented to illustrate how the provided method outperforms the existing approach in terms of system throughput improvement. 展开更多
关键词 Multi-cluster tools ROBOTS scheduling transient periods semiconductor manufacturing systems
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