Effect of annealing on the electrical performance of N-polarity GaN Schottky barrier diodes

A nitrogen-polarity(N-polarity)GaN-based high electron mobility transistor(HEMT)shows great potential for high-fre-quency solid-state power amplifier applications because its two-dimensional electron gas(2DEG)density and mobility are mini-mally affected by device scaling.However,the Schottky barrier height(SBH)of N-polarity GaN is low.This leads to a large gate leakage in N-polarity GaN-based HEMTs.In this work,we investigate the effect of annealing on the electrical characteristics of N-polarity GaN-based Schottky barrier diodes(SBDs)with Ni/Au electrodes.Our results show that the annealing time and tem-perature have a large influence on the electrical properties of N-polarity GaN SBDs.Compared to the N-polarity SBD without annealing,the SBH and rectification ratio at±5 V of the SBD are increased from 0.51 eV and 30 to 0.77 eV and 7700,respec-tively,and the ideal factor of the SBD is decreased from 1.66 to 1.54 after an optimized annealing process.Our analysis results suggest that the improvement of the electrical properties of SBDs after annealing is mainly due to the reduction of the inter-face state density between Schottky contact metals and N-polarity GaN and the increase of barrier height for the electron emis-sion from the trap state at low reverse bias.

Improvement of Ga_(2)O_(3)vertical Schottky barrier diode by constructing NiO/Ga_(2)O_(3)heterojunction

The high critical electric field strength of Ga_(2)O_(3)enables higher operating voltages and reduced switching losses in power electronic devices.Suitable Schottky metals and epitaxial films are essential for further enhancing device performance.In this work,the fabrication of vertical Ga_(2)O_(3)barrier diodes with three different barrier metals was carried out on an n--Ga_(2)O_(3)homogeneous epitaxial film deposited on an n+-β-Ga_(2)O_(3)substrate by metal-organic chemical vapor deposition,excluding the use of edge terminals.The ideal factor,barrier height,specific on-resistance,and breakdown voltage characteristics of all devices were investigated at room temperature.In addition,the vertical Ga_(2)O_(3)barrier diodes achieve a higher breakdown volt-age and exhibit a reverse leakage as low as 4.82×10^(-8)A/cm^(2)by constructing a NiO/Ga_(2)O_(3)heterojunction.Therefore,Ga_(2)O_(3)power detailed investigations into Schottky barrier metal and NiO/Ga_(2)O_(3)heterojunction of Ga_(2)O_(3)homogeneous epitaxial films are of great research potential in high-efficiency,high-power,and high-reliability applications.

Ti/4H-SiC Schottky Barrier Diodes with Field Plate and B^+ Implantation Edge Termination Technology

This paper describes the fabrication and electrical characteristics of Ti/4H-SiC Schottky barrier diodes （SBDs）. The ideality factor n = 1.08 and effective Schottky barrier heightφ= 1.05eV of the SBDs were measured with the method of forward current density-voltage （J-V）. A low reverse leakage current below 5.96 ×10^-3A/cm^2 at a bias voltage of - 1. 1kV was obtained. By using B^＋ implantation,an amorphous layer as the edge termination was formed. We used the PECVD SiO2 as the field plate dielectric. The SBDs have an on-state current density of 430A/cm^2 at a forward voltage drop of about 4V. The specific on-resistance Ro, was found to be 6. 77mΩ2 · cm^2 .

Schottky Barrier Characteristics of Polycrystalline and Epitaxial CoSi_2/n-Si(111) Contacts Formed by Solid State Reaction

Polycrystalline and epitaxial CoSi 2 films are formed on the n-Si (111) substrates by solid state reaction of the as-deposited Co single-layer and Co/Ti bilayer with Si,respectively at different annealing phase.The CoSi 2/Si Schottky contacts are measured with the current-voltage and capacitance-voltage (I-V/C-V) techniques within the range of temperature from 90K to room temperature.The measured I-V characteristics have been analyzed with a model based on the inhomogeneity in Schottky barrier height,i.e.,at high temperatures (≥～200K) or low temperatures but with a large bias,the I-V curves can be described by using the thermionic emission theory with a Gaussian distributed barrier height over the whole junction,while at low temperatures and with a small bias,the current is dominated by some small patches with low barrier height.It results in a plateau-like section in the low temperature I-V curves around 10 -7 A.At room temperature,the barrier height of polycrystalline CoSi 2/Si deduced from the I-V curve is about 0 57eV.For epitaxial CoSi 2,the barrier height depends on its final annealing temperature and increases from 0 54eV to 0 60eV with the annealing temperature increasing from 700℃ to 900℃.

High-Voltage Ti /6H-SiC Schottky Barrier Diodes

The fabrication and electrical characterization of Scho tt ky barrier diodes (SBD) on 6H-SiC,via thermal evaporation of Ni are reported.Th e Schottky barrier diodes are fabricated during the 6H-SiC epilayers grow n by using chemical vapor deposition on commercially available single-crystal 6 H-SiC wafers.The I-V characteristics of these diodes exhibit a sharp break down,with the breakdown voltage of 450V at room temperature.The diodes are demon strated to be of a low reverse leakage current of 5×10 -4 A·cm -2 at the bias voltage of -200V.The ideal factor and barrier height are 1 09 and 1 24-1 26eV,respectively.

High-Responsivity ZnS Schottky Barrier Photodiode Array for Ultraviolet Imaging

A different approach,using the molecular beam epitaxy (MBE)-grown ZnS-based Schottky photodiode technology,is applied to fabricate an 8×8 photodiode array.The micro-processing procedures of this photodiode array including standard photolithography,a number of metallisation,wet-chemical etching and SiO_2 deposition for insulation are developed.The detector is characterized to have a cutoff wavelength at 340 nm and the photo-responsivity measurements on the pixels result an ultraviolet (UV) response as high as 0.15 A/W,corresponding to an external quantum efficiency of 55% in the visible-blind spectral ranging from 400 down to 250nm.Imaging tests indicate that this array is able to capture the intensity profile of a given UV light source with reasonably good capability.

Study on the Characteristics of SOI DTMOS with Reverse Schottky Barriers

Silicon-on-insulator dynamic threshold voltage MOSFETs with TiSi2/pSi as reverse Schottky barriers （RSB） are presented. With this RSB scheme,DTMOS can operate beyond 0.7V, thus overcoming the drawback of DTMOS with the gate and body connected. The experimental results demonstrate that the threshold voltage in DT mode with an RSB is reduced by about 200mV at room temperature. SOI MOSFETs in DT mode with an RSB have advantages such as excellent subthreshold slope and high drivability over those under normal mode operation. The breakdown characteristics of SOI MOSFETs in the off-state are compared for the DT mode with RSB, floating body mode, normal mode.

Schottky barrier MOSFET structure with silicide source/drain on buried metal

In this paper, we propose a novel Schottky barrier MOSFET structure, in which the silicide source/drain is designed on the buried metal （SSDOM）. The source/drain region consists of two layers of silicide materials. Two Schottky barriers are formed between the silicide layers and the silicon channel. In the device design, the top barrier is lower and the bottom is higher. The lower top contact barrier is to provide higher on-state current, and the higher bottom contact barrier to reduce the off-state current. To achieve this, ErSi is proposed for the top silicide and CoSi2 for the bottom in the n-channel ease. The 50 nm n-channel SSDOM is thus simulated to analyse the performance of the SSDOM device. In the simulations, the top contact barrier is 0.2e V （for ErSi） and the bottom barrier is 0.6 eV （for CoSi2）. Compared with the corresponding conventional Schottky barrier MOSFET structures （CSB）, the high on-state current of the SSDOM is maintained, and the off-state current is efficiently reduced. Thus, the high drive ability （1.2 mA/μm at Vds = 1 V, Vgs = 2 V） and the high Ion/Imin ratio （10^6） are both achieved by applying the SSDOM structure.

Analysis and simulation of a 4H-SiC semi-superjunction Schottky barrier diode for softer reverse-recovery

In this paper, a 4H-SiC semi-superjunction （S J） Schottky barrier diode is analysed and simulated. The semi-SJ structure has an optimized design and a specific on-resistance lower than that of conventional SJ structures, which can be achieved without increasing the process difficulty. The simulation results show that the specific on-resistance and the softness factor depend on the aspect and thickness ratios, and that by using the semi-SJ structure, specific on-resistance can be reduced without decreasing the softness factor. It is observed that a trade-off exists between the specific on-resistance and the softness of the diode.

Improvements in reverse breakdown characteristics of THz GaAs Schottky barrier varactor based on metal-brim structure

The excellent reverse breakdown characteristics of Schottky barrier varactor(SBV)are crucially required for the application of high power and high efficiency multipliers.The SBV with a novel Schottky structure named metal-brim is fabricated and systemically evaluated.Compared with normal structure,the reverse breakdown voltage of the new type SBV improves from-7.31 V to-8.75 V.The simulation of the Schottky metal-brim SBV is also proposed.Three factors,namely distribution of leakage current,the electric field,and the area of space charge region are mostly concerned to explain the physical mechanism.Schottky metal-brim structure is a promising approach to improve the reverse breakdown voltage and reduce leakage current by eliminating the accumulation of charge at Schottky electrode edge.

Study and optimal simulation of 4H-SiC floating junction Schottky barrier diodes' structures and electric properties

This paper stuides the structures of 4H SiC floating junction Schottky barrier diodes. Some structure parameters of devices are optimized with commercial simulator based on forward and reverse electrical characteristics. Compared with conventional power Schottky barrier diodes, the devices are featured by highly doped drift region and embedded floating junction layers, which can ensure high breakdown voltage while keeping lower specific on-state resistance, and solve the contradiction between forward voltage drop and breakdown voltage. The simulation results show that with optimized structure parameter, the breakdown voltage can reach 4.36 kV and the specific on-resistance is 5.8 mΩ.cm2 when the Baliga figure of merit value of 13.1 GW/cm2 is achieved.

A simulation study of field plate termination in Ga2O3 Schottky barrier diodes

In this work, the field plate termination is studied for Ga2O3Schottky barrier diodes(SBDs) by simulation. The influence of field plate overlap, dielectric material and thickness on the termination electric field distribution are demonstrated.It is found that the optimal thickness increases with reverse bias increasing for all the three dielectrics of SiO2, Al2O3, and HfO2. As the thickness increases, the maximum electric field intensity decreases in SiO2and Al2O3, but increases in HfO2.Furthermore, it is found that SiO2and HfO2are suitable for the 600 V rate Ga2O3SBD, and Al2O3is suitable for both600 V and 1200 V rate Ga2O3SBD. In addition, the comparison of Ga2O3SBDs between the SiC and GaN counterpart reveals that for Ga2O3, the breakdown voltage bottleneck is the dielectric. While, for SiC and GaN, the bottleneck is mainly the semiconductor itself.

Lateralβ-Ga_(2)O_(3)Schottky barrier diode fabricated on(-201)single crystal substrate and its temperature-dependent current-voltage characteristics

Lateralβ-Ga_(2)O_(3)Schottky barrier diodes(SBDs)each are fabricated on an unintentionally doped(-201)n-typeβ-Ga_(2)O_(3)single crystal substrate by designing L-shaped electrodes.By introducing sidewall electrodes on both sides of the conductive channel,the SBD demonstrates a high current density of 223 mA/mm and low specific on-resistance of4.7 mΩ·cm^(2).Temperature-dependent performance is studied and the Schottky barrier height is extracted to be in a range between 1.3 eV and 1.35 eV at temperatures ranging from 20℃to 150℃.These results suggest that the lateralβ-Ga_(2)O_(3)SBD has a tremendous potential for future power electronic applications.

Modeling of 4H-SiC multi-floating-junction Schottky barrier diode

This paper develops a new and easy to implement analytical model for the specific on-resistance and electric field distribution along the critical path for 4H-SiC multi-floating junction Schottky barrier diode. Considering the charge compensation effects by the multilayer of buried opposite doped regions, it improves the breakdown voltage a lot in comparison with conventional one with the same on-resistance. The forward resistance of the floating junction Schottky barrier diode consists of several components and the electric field can be understood with superposition concept, both are consistent with MEDICI simulation results. Moreover, device parameters are optimized and the analyses show that in comparison with one layer floating junction, multilayer of floating junction layer is an effective way to increase the device performance when specific resistance and the breakdown voltage are traded off. The results show that the specific resistance increases 3.2 mΩ.cm2 and breakdown voltage increases 422 V with an additional floating junction for the given structure.

Degradation of β-Ga_(2)O_(3) Schottky barrier diode under swift heavy ion irradiation

The electrical characteristics and microstructures ofβ-Ga_(2)O_(3) Schottky barrier diode(SBD)devices irradiated with swift heavy ions(2096 MeV Ta ions)have been studied.It was found thatβ-Ga_(2)O_(3) SBD devices showed the reliability degradation after irradiation,including turn-on voltage Von,on-resistance Ron,ideality factor n,and the reverse leakage current density Jr.In addition,the carrier concentration of the drift layer was decreased significantly and the calculated carrier removal rates were 5×10^(6)-1.3×10^(7)cm^(-1).Latent tracks induced by swift heavy ions were observed visually in the wholeβ-Ga2O3 matrix.Furthermore,crystal structure of tracks was amorphized completely.The latent tracks induced by Ta ions bombardments were found to be the reason for the decrease in carrier mobility and carrier concentration.Eventually,these defects caused the degradation of electrical characteristics of the devices.In terms of the carrier removal rates,theβ-Ga_(2)O_(3) SBD devices were more sensitive to swift heavy ions irradiation than SiC and GaN devices.

4H-SiC trench MOSFET with an integrated Schottky barrier diode and L-shaped P^+shielding region

A novel 4H-SiC trench MOSFET is presented and investigated by simulation in this paper.The device features an integrated Schottky barrier diode and an L-shaped P^+shielding region beneath the gate trench and aside one wall of the gate trench(S-TMOS).The integrated Schottky barrier diode works as a free-wheeling diode in reverse recovery and reverse conduction,which significantly reduces reverse recovery charge(Q_(rr))and reverse turn-on voltage(VF).The L-shaped P^+region effectively shields the coupling of gate and drain,resulting in a lower gate–drain capacitance(C_(gd))and date–drain charge(Q_(gd)).Compared with that of conventional SiC trench MOSFET(C-TMOS),the V_F and Q_(rr)of S-TMOS has reduced by 44%and 75%,respectively,with almost the same forward output current and reverse breakdown voltage.Moreover,the S-TMOS reduces Q_(gd)and C_(gd)by 32%and 22%,respectively,in comparison with C-TMOS.

Role of Ga vacancies in enhancing the leakage current of GaN Schottky barrier ultraviolet photodetectors

The leakage current of GaN Schottky barrier ultraviolet photodetectors is investigated. It is found that the photodetectors adopting undoped GaN instead of lightly Si-doped GaN as an active layer show a much lower leakage current even when they have a higher dislocation density. It is also found that the density of Ca vacancies in undoped GaN is much lower than in Si-doped GaN. The Ga vacancies may enhance tunneling and reduce effective Schottky barrier height, leading to an increase of leakage current. It suggests that when undoped GaN is used as the active layer, it is necessary to reduce the leakage current of GaN Schottky barrier ultraviolet photodetector.

High energy electron radiation effect on Ni and Ti/4H-SiC Schottky barrier diodes at room temperature

This paper reports that Ni and Ti/4H-SiC Schottky barrier diodes （SBDs） were fabricated and irradiated with 1 MeV electrons up to a dose of 3.43 × 10^14 e/cm2. After radiation, the Schottky barrier height φB of the Ni/4H-SiC SBD increased from 1.20 eV to 1.21 eV, but decreased from 0.95 eV to 0.94 eV for the Ti/4H-SiC SBD. The degradation of φB could be explained by interface states of changed Schottky contacts. The on-state resistance Rs of both diodes increased with the dose, which can be ascribed to the radiation defects. The reverse current of the Ni/4H-SiC SBD slightly increased, but for the Ti/4H-SiC SBD it basically remained the same. At room temperature, φB of the diodes recovered completely after one week, and the RS partly recovered.

Modulation of WN_x/Ge Schottky barrier height by varying N composition of tungsten nitride

Modulation of the Schottky barrier heights was successfully demonstrated for WNx/p-Ge and WNx/n-Ge contacts by increasing the nitrogen component in the WNx films. The WN0.38/p-Ge contact exhibits rectifying characteristic and an apparent Schottky barrier of 0.49 eV while the WN0.38/n-Ge Schottky contact exhibits quasi-Ohmic current–voltage characteristics. Dipoles formed at the contact interface by the difference of the Pauling electronegativities of Ge and N are confirmed to alleviate the Fermi-level pinning effect.

Design of vertical diamond Schottky barrier diode with junction terminal extension structure by using the n-Ga_(2)O_(3)/p-diamond heterojunction

A novel junction terminal extension structure is proposed for vertical diamond Schottky barrier diodes(SBDs) by using an n-Ga_(2)O_(3)/p-diamond heterojunction. The depletion region of the heterojunction suppresses part of the forward current conduction path, which slightly increases the on-resistance. On the other hand, the reverse breakdown voltage is enhanced obviously because of attenuated electric field crowding. By optimizing the doping concentration, length, and depth of n-Ga_(2)O_(3), the trade-off between on-resistance and breakdown voltage with a high Baliga figure of merit(FOM)value is realized through Silvaco technology computer-aided design simulation. In addition, the effect of the work functions of the Schottky electrodes is evaluated. The results are beneficial to realizing a high-performance vertical diamond SBD.