Density of Liquid Ni-Mo Alloys Measured by a Modified Sessile Drop Method

The density of liquid binary Ni-Mo alloys with molybdenum concentration from 0 to 20% (mass fraction) wasmeasured by a modified sessile drop method. It has been found that the density of the liquid Ni-Mo alloys decreaseswith increasing temperature, but increases with the increase of molybdenum concentration in the alloys. The molarvolume of liquid Ni-Mo binary alloys increases with the increase of temperature and molybdenum concentration. Thepartial molar volume of molybdenum in Ni-Mo binary alloy has been approximately calculated as [13.18-2.65×10^(-3)T+(-47.94+3.10×10^(-2)T)×10^(-2)X_(Mo)]×10^(-6)m^3·mol^(-1). The molar volume of Ni-Mo alloy determined inthe present work shows a negative deviation from the ideal linear mixing molar volume.

Density Measurement of Liquid Ni-Ta Alloys by a Modified Sessile Drop Method

The density of liquid Ni-Ta alloys was measured by using a modified sessile drop method. It is found that the density of the liquid Ni-Ta alloys decreases with the increasing temperature, but increases with the increase of tantalum concentration in the alloys. The molar volume of liquid Ni-Ta binary alloys increases with the increase of temperature and tantalum concentration.

Density of Liquid Ni-Cr Alloy

The density of liquid Ni-Cr alloy was measured by a modified sessile drop method. The density of liquid Ni-Cr alloywas found to decrease with increasing temperature and Cr concentration in the alloy. The molar volume of liquidNi-Cr alloy increases with increasing the Cr concentration in the alloy. The molar volume of Ni-Cr alloy determinedin the present work shows a positive deviation from the linear molar volume.

Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate

The reactive spreading processes of Sn–17Bi–0.5Cu melt alloy on Cu substrate were studied by sessile drop method in the temperature range of 523–673 K.Dynamic contact angles between the solder and Cu substrate at different times were recorded with high-resolution CCD digital video.The smallest contact angle was observed at623 and 673 K.Ultimate spreading radius does not increase monotonously with the temperature increasing.These can be attributed to the strong dissolution of Cu substrate into the liquid solder,which hinders the solder from spreading.Triple line area configuration of the Sn–17Bi–0.5Cu/Cu system was discussed by the description of the equilibrium state.The calculated results based on experiments of the tension balances along each of the three interfaces show good agreement with theoretical analysis.Intermetallic compounds at the Sn–17Bi–0.5Cu/Cu interface are identified as Cu6Sn5adjacent to the solder and Cu3Sn adjacent to the Cu substrate,respectively.These results are of practical interest for composite lead-free solders’preparations and joining of Sn–17Bi–0.5Cu to Cu substrate.

Density of Liquid Steel over Temperature Range of 1803-1873K

The density of three kinds of liquid steel was measured by a modified sessile drop method over the temperature range of 1803-1 873 K.It is found that the density of liquid steels decreases with increasing temperature and carbon content in steel.Both of the density and its absolute temperature coefficient of studied steels are smaller than the literature values of pure iron.The molar volume of the steels increases with increasing temperature.

Wetting of Au and Ag particles on monocrystalline graphite substrates

The wetting behavior of Au and Ag particles on a monocrystalline graphite substrate was investigated using the microscopic sessile drop method under a purified Ar atmosphere at 1300 K. The measured contact angles of the liquid Au and Ag on monocrystalline graphite substrates of （0001） face were 129° and 124°, respectively. It is believed that the interaction at the interface is dominated by the physical bonding （van der Waal＇s interaction）.

Surface Tension of Molten Ni and Ni-Co Alloys

Surface tension of molten Ni and Ni-Co (5 and 10 mass fraction) alloys was measured at the temperature range of 1773-1873 K using an improved sessile drop method with an alumina substrate in an Ar+3%H2 atmosphere. The error of the data obtained was analyzed. The surface tension of molten Ni and Ni-Co (5 and 10 mass fraction) alloys decreases with increasing temperature. The influence of Co on the surface tension of Ni-Co alloys is little in the studied Co concentration range.

Density of Ni-Cr Alloy in the Mushy State

The density of Ni-Cr alloy in the mushy state has been measured using the modified sessile drop method. The density of Ni-Cr alloy in the mushy state was found to decrease with increasing temperature and Cr concentration in alloy. The molar volume of Ni-Cr alloy in the mushy state therefore increases with increasing the Cr concentration in alloy. The ratio of the difference of density divided by the temperature difference between liquidus and solidus temperatures decreases with increasing Cr concentration. The density of the alloy increased with the precipitation of a solid phase in alloy during the solidification process. The temperature dependence of the density of alloy in the mushy state was not linear but biquadratic.

INTERFACIAL TENSION BETWEEN SLAG AND COPPER MATTE

The interfacial tension between FeO-CaO-SiO_2-MgO system slag and Cu-Fe-S system matte was determinated by the X-ray radiograph sessile drop method.The effects of FeO/SiO_2 ratio in the slag,contents of CaO,FeO,ZnO and CaF_2 in the slag on interracial tension and the relation of inter facial tension with the grade of matte and temperature have been studied.The floatation coefficient and film coefficient of slag-matte system has been calculated and the mechanism of the transition of iron and oxygen from slag to matte has also been discussed.