Spectroscopic ellipsometry (SE), photocarrier radiometry (PCR) and photoluminescence (PL) techniques were employed to measure the ultra-shallow junction (USJ) wafers. These USJ wafers were prepared by As+ ion implanta...Spectroscopic ellipsometry (SE), photocarrier radiometry (PCR) and photoluminescence (PL) techniques were employed to measure the ultra-shallow junction (USJ) wafers. These USJ wafers were prepared by As+ ion implantation at energies of 0.5-5 keV, at a dose of 1×1015 As+ /cm 2 and spike annealing. Experimentally the damaged layer of the as-implanted wafer and the recrystallization and activation of the post-annealed wafer were evaluated by SE in the spectral range from 0.27 to 20 m. The PCR amplitude decreased monotonically with the increasing implantation energy. The experimental results also showed that the PCR amplitudes of post-annealed USJ wafers were greatly enhanced, compared to the non-implanted and non-annealed substrate wafer. The PL measurements showed the enhanced PCR signals were attributed to the band-edge emissions of silicon. For explaining the PL enhancement, the electronic transport properties of USJ wafers were extracted via multi-wavelength PCR experiment and fitting. The fitted results showed the decreasing surface recombination velocity and the decreasing diffusion coefficient of the implanted layer contributed to the PCR signal enhancement with the decreasing implantation energy. SE, PCR and PL were proven to be non-destructive metrology tools for characterizing ultra-shallow junctions.展开更多
This paper proposes an oxide filled extended trench gate super junction （SJ） MOSFET structure to meet the need of higher frequency power switches application. Compared with the conventional trench gate SJ MOSFET, ne...This paper proposes an oxide filled extended trench gate super junction （SJ） MOSFET structure to meet the need of higher frequency power switches application. Compared with the conventional trench gate SJ MOSFET, new structure has the smaller input and output capacitances, and the remarkable improvements in the breakdown voltage, on-resistance and switching speed. Furthermore, the SJ in the new structure can be realized by the existing trench etching and shallow angle implantation, which offers more freedom to SJ MOSFET device design and fabrication.展开更多
随着超大规模集成电路技术的发展,CMOS器件的制备过程需要同时引入金属栅和超浅结等新的先进工艺技术,因此各种新工艺的兼容性研究具有重要意义.本文研究了超浅结工艺中使用的锗预非晶化对镍硅(N iS i)金属栅功函数的影响.对具有不同剂...随着超大规模集成电路技术的发展,CMOS器件的制备过程需要同时引入金属栅和超浅结等新的先进工艺技术,因此各种新工艺的兼容性研究具有重要意义.本文研究了超浅结工艺中使用的锗预非晶化对镍硅(N iS i)金属栅功函数的影响.对具有不同剂量Ge注入的N iS i金属栅MOS电容样品的研究表明,锗预非晶化采用的Ge注入对N iS i金属栅的功函数影响很小(小于0.03eV),而且Ge注入也不会导致氧化层中固定电荷以及氧化层和硅衬底之间界面态的增加.这些结果表明,在自对准的先进CMOS工艺中,N iS i金属栅工艺和锗预非晶化超浅结工艺可以互相兼容.展开更多
基金supported by the National Natural Science Foundation of China(Grant Nos. 61076090 and 60676058)
文摘Spectroscopic ellipsometry (SE), photocarrier radiometry (PCR) and photoluminescence (PL) techniques were employed to measure the ultra-shallow junction (USJ) wafers. These USJ wafers were prepared by As+ ion implantation at energies of 0.5-5 keV, at a dose of 1×1015 As+ /cm 2 and spike annealing. Experimentally the damaged layer of the as-implanted wafer and the recrystallization and activation of the post-annealed wafer were evaluated by SE in the spectral range from 0.27 to 20 m. The PCR amplitude decreased monotonically with the increasing implantation energy. The experimental results also showed that the PCR amplitudes of post-annealed USJ wafers were greatly enhanced, compared to the non-implanted and non-annealed substrate wafer. The PL measurements showed the enhanced PCR signals were attributed to the band-edge emissions of silicon. For explaining the PL enhancement, the electronic transport properties of USJ wafers were extracted via multi-wavelength PCR experiment and fitting. The fitted results showed the decreasing surface recombination velocity and the decreasing diffusion coefficient of the implanted layer contributed to the PCR signal enhancement with the decreasing implantation energy. SE, PCR and PL were proven to be non-destructive metrology tools for characterizing ultra-shallow junctions.
基金supported by the Doctor Scientific Research Start-up Foundation of Xi'an University of Technology of China
文摘This paper proposes an oxide filled extended trench gate super junction （SJ） MOSFET structure to meet the need of higher frequency power switches application. Compared with the conventional trench gate SJ MOSFET, new structure has the smaller input and output capacitances, and the remarkable improvements in the breakdown voltage, on-resistance and switching speed. Furthermore, the SJ in the new structure can be realized by the existing trench etching and shallow angle implantation, which offers more freedom to SJ MOSFET device design and fabrication.
文摘随着超大规模集成电路技术的发展,CMOS器件的制备过程需要同时引入金属栅和超浅结等新的先进工艺技术,因此各种新工艺的兼容性研究具有重要意义.本文研究了超浅结工艺中使用的锗预非晶化对镍硅(N iS i)金属栅功函数的影响.对具有不同剂量Ge注入的N iS i金属栅MOS电容样品的研究表明,锗预非晶化采用的Ge注入对N iS i金属栅的功函数影响很小(小于0.03eV),而且Ge注入也不会导致氧化层中固定电荷以及氧化层和硅衬底之间界面态的增加.这些结果表明,在自对准的先进CMOS工艺中,N iS i金属栅工艺和锗预非晶化超浅结工艺可以互相兼容.
