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Preparation and Analysis of Si_3N_4 Film
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作者 程绍玉 任兆杏 +3 位作者 梁荣庆 吕庆敖 刘卫 宁兆元 《Plasma Science and Technology》 SCIE EI CAS CSCD 2000年第2期213-218,共6页
Microwave Electron Cyclotron Resonance (ECR) Plasma assisted Chemical Vapor Deposition (CVD) technology has been used to prepare Si3N4 films, which were analyzed by using infrared (IR) transmission spectroscopy and XP... Microwave Electron Cyclotron Resonance (ECR) Plasma assisted Chemical Vapor Deposition (CVD) technology has been used to prepare Si3N4 films, which were analyzed by using infrared (IR) transmission spectroscopy and XPS. The analysis results show that with the increase of the deposition temperature, the H content decreases, and the densification of the film increases.When the temperature is up to 360℃, the stoichiometrical rate of Si:N is close to 0.75. The protective property of Si3N4 films is also examined. 展开更多
关键词 SI OC Preparation and Analysis of Si3N4 Film XPS
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