Tensile Mechanical Behavior and Failure Mechanism of a Plain-Woven SiCf/SiC Composites at Room and Elevated Temperatures

Ceramic matrix composites (CMCs) are the preferred materials for solving advanced aerospace high-temperature structural components;it has the comprehensive advantages of higher temperature (~1500˚C) and low density. In service environments, CMCs exhibit complex damage mechanisms and failure modes, which are affected by constituent materials, meso-architecture and inhere defects. In this paper, the in-plane tensile mechanical behavior of a plain-woven SiCf/SiC composite at room and elevated temperatures was investigated, and the factors affecting the tensile strength of the material were discussed in depth. The results show that the tensile modulus and strength of SiCf/SiC composites at high temperature are lower, but the fracture strain increases and the toughness of the composites is enhanced;the stitching holes significantly weaken the tensile strength of the material, resulting in the material is easy to break at the cross-section with stitching holes.

Electromagnetic wave absorption and mechanical properties of SiC nanowire/low-melting-point glass composites sintered at 580°C in air

Si C nanowires are excellent high-temperature electromagnetic wave (EMW) absorbing materials. However, their polymer matrix composites are difficult to work at temperatures above 300℃, while their ceramic matrix composites must be prepared above 1000℃ in an inert atmosphere. Thus, for addressing the abovementioned problems, SiC/low-melting-point glass composites were well designed and prepared at 580℃ in an air atmosphere. Based on the X-ray diffraction results, SiC nanowires were not oxidized during air atmosphere sintering because of the low sintering temperature. Additionally, SiC nanowires were uniformly distributed in the glass matrix material. The composites exhibited good mechanical and EMW absorption properties. As the filling ratio of SiC nanowires increased from 5wt%to 20wt%, the Vickers hardness and flexural strength of the composite reached HV 564 and 213 MPa, which were improved by 27.7%and 72.8%, respectively, compared with the low-melting-point glass. Meanwhile, the dielectric loss and EMW absorption ability of SiC nanowires at 8.2–12.4 GHz were also gradually improved. The dielectric loss ability of low-melting-point glass was close to 0. However, when the filling ratio of SiC nanowires was 20wt%, the composite showed a minimum reflection loss (RL) of-20.2 dB and an effective absorption (RL≤-10 dB) bandwidth of2.3 GHz at an absorber layer thickness of 2.3 mm. The synergistic effect of polarization loss and conductivity loss in SiC nanowires was responsible for this improvement.

Significant strengthening of copper-based composites using boron nitride nanotubes

Nanotubes, such as boron nitride nanotubes (BNNTs) and carbon nanotubes (CNTs), exhibit excellent mechanical properties. In this work, high-quality BNNTs were synthesized by ball milling and annealing. Subsequently, well-dispersed 3vol%BNNTs/Cu and 3vol%CNTs/Cu composites were successfully prepared using ball milling, spark plasma sintering, and followed by hot-rolling. Moreover, the mechanical properties and strengthening mechanisms of BNNTs/Cu and CNTs/Cu composites were compared and discussed in details. At 293 K,both BNNTs/Cu and CNTs/Cu composites exhibited similar ultimate tensile strength (UTS) of~404 MPa, which is approximately 170%higher than pure Cu. However, at 873 K, the UTS and yield strength of BNNTs/Cu are 27%and 29%higher than those of CNTs/Cu, respectively.This difference can be attributed to the stronger inter-walls shear resistance, higher thermomechanical stability of BNNTs, and stronger bonding at the BNNTs/Cu interface as compared to the CNTs/Cu interface. These findings provide valuable insights into the potential of BNNTs as an excellent reinforcement for metal matrix composites, particularly at high temperature.

Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy:preparation, performance, and mechanisms

Copper matrix composites doped with ceramic particles are known to effectively enhance the mechanical properties,thermal expansion behavior and high-temperature stability of copper while maintaining high thermal and electrical conductivity.This greatly expands the applications of copper as a functional material in thermal and conductive components,including electronic packaging materials and heat sinks,brushes,integrated circuit lead frames.So far,endeavors have been focusing on how to choose suitable ceramic components and fully exert strengthening effect of ceramic particles in the copper matrix.This article reviews and analyzes the effects of preparation techniques and the characteristics of ceramic particles,including ceramic particle content,size,morphology and interfacial bonding,on the diathermancy,electrical conductivity and mechanical behavior of copper matrix composites.The corresponding models and influencing mechanisms are also elaborated in depth.This review contributes to a deep understanding of the strengthening mechanisms and microstructural regulation of ceramic particle reinforced copper matrix composites.By more precise design and manipulation of composite microstructure,the comprehensive properties could be further improved to meet the growing demands of copper matrix composites in a wide range of application fields.

Damping performance of SiC nanoparticles reinforced magnesium matrix composites processed by cyclic extrusion and compression

This work dealt with the damping performance and its underlying mechanism in SiC nanoparticles reinforced AZ91D composite(SiC_(np)/AZ91D)processed by cyclic extrusion and compression(CEC).It was found that the CEC process significantly affects the damping performance of the composite due to alterations in the density of dislocations and grain boundaries in the matrix alloy.Although there would be dynamic precipitation of the Mg17Al12 phase during processing which increases the phase interface and limits the mobility of dislocations and grain boundaries.The results also showed that the damping capacity of 1%SiC_(np)/AZ91D composite continuously decreases with adding CEC pass number and it consistently increases with rising the applied temperature.Considering the first derivative of the tanδ-T curve,the dominant damping mechanism based on test temperature can be divided into three regions.These three regions are as follows(i)dislocation vibration of the weak pinning points(≤T_(cr)),(ii)dislocation vibration of the strong pinning points(T_(cr)∼T_(V)),and(iii)grain boundary/interface sliding(≥T_(V))

Microstructure and properties of copper matrix composites reinforced by nano-SiC and nano-Al_2O_3 particles

Copper/silicon carbide composites （Cu/SiC） and copper/alumina composites （Cu/Al2O3） were fabricated by the powder metallurgy method. The influence of reinforcement particles contents on the relevant properties of the composites and the microstructure of Cu/SiC and Cu/Al2O3 composites were studied. The reinforcement effects of nano-SiC and nano-Al2O3 particles were compared. The experimental results show that with the increase of the amount of nano-SiC and nano-Al2O3 particles, the density of the both composites decreases, the resistivity increases, whereas the hardness increases firstly and then drops. The softening temperatures of the composites are above 700℃ which is far higher than that of the pure copper, leading to the improvement of the thermal stability of the composites at high temperatures. Considering all factors, the reinforcement effects of nano-SiC are better than those of nano-Al2O3 when their contents are the same in the copper matrix.

Thermo-physical Properties of Continuous Carbon Fiber Reinforced Copper Matrix Composites

Continuous carbon fiber reinforced copper matrix composites with 70%(volume fraction) of carbon fibers prepared by squeeze casting technique have been used for investigation of the coefficient of thermal expansion(CTE) and thermal conductivity.Thermo-physical properties have been measured in both,longitudinal and transversal directions to the fiber orientation.The results showed that Cf/Cu composites may be a suitable candidate for heat sinks because of its good thermo-physical properties e.g.the low CTE(4.18×10-6/K) in longitudinal orientation and(14.98×10-6/K) in transversal orientation at the range of 20-50℃,a good thermal conductivity(87.2 W/m·K) in longitudinal orientation and(58.2 W/m·K) in transversal orientation.Measured CTE and thermal conductivity values are compared with those predicted by several well-known models.Eshelby model gave better results for prediction of the CTE and thermal conductivity of the unidirectional composites.

SiC/SiC复合材料层板低速冲击及其剩余强度试验研究

高速飞行器中的陶瓷基复合材料结构在服役过程中不可避免地会遇到低速冲击问题,低速冲击后的损伤形式以及剩余承载能力是影响飞行器结构安全的关键问题。本研究以二维编织SiC/SiC复合材料板件为研究对象,在不同能量下开展了低速冲击试验,分析了低速冲击载荷下试验件的表面损伤状态,通过计算机断层扫描技术观察了试验件内部的损伤形貌,结合冲击过程中的冲击响应曲线以及应变历史曲线,分析了SiC/SiC复合材料低速冲击过程的损伤机理。针对含勉强目视可见损伤的试验件开展了冲击后剩余强度试验,研究了勉强目视可见损伤对SiC/SiC复合材料剩余承载性能的影响。结果表明,在低速冲击载荷的作用下,试验件的表面损伤主要包括无表面损伤、勉强目视可见损伤、半穿透损伤以及穿透损伤,试验件的内部损伤主要有锥形体裂纹、纱线断裂以及分层损伤。低速冲击损伤会严重影响SiC/SiC复合材料的剩余性能,虽然试验件损伤勉强目视可见,但其剩余压缩强度为无损件81%,剩余拉伸强度仅为无损件的68%。

Ti预处理的SiC_(f)/SiC与镍基高温合金复合铸件的界面组织与强度

由SiC_(f)/SiC复合材料与K403镍基高温合金熔体制备的一体化铸件,冷却到室温时会出现自行断裂。通过采用Ti粉埋覆包渗工艺在1100℃下对SiC_(f)/SiC表面进行预处理,并在适当工艺下与K403镍基高温合金熔体进行陶瓷型精密铸造,成功实现SiC_(f)/SiC与K403镍基高温合金的一体化成形和界面的牢固结合。结果表明:Ti预处理层平均厚度为17μm左右,Ti向SiC_(f)/SiC渗透、扩散和反应,形成含TiC,Ti3SiC2,Ti5Si3Cx,SiC相的显微组织;经过与高温镍基金属液复合铸造后,预处理层演变成厚约120μm的界面反应层,其典型界面组织为Ni2Si+C+Al4C3+MC(M主要含Ti及少量的Cr,Mo,W)。预处理层的存在减轻Ni与SiC的有害石墨化反应,缓解高温金属液对SiC_(f)/SiC的热冲击,形成的界面反应层降低热膨胀系数失配造成的热应力,使得SiC_(f)/SiC与K403一体化铸件结合界面的室温剪切强度达到63.5 MPa。

Template synthesis of copper azide primary explosive through Cu2O@HKUST-1 core-shell composite prepared by “bottle around ship” method

Copper azide(CA), as a primary explosive with high energy density, has not been practically used so far because of its high electrostatic sensitivity. The Cu2O@HKUST-1 core-shell structure hybrid material was synthesized by the “bottle around ship” methodology in this research by regulating the dissolution rate of Cu2O and the generation rate of metal-organic framework(MOF) materials. Cu2O@HKUST-1 was carbonized to form a Cu O@porous carbon(CuO@PC) composite material. CuO@PC was synthesized into a copper azide(CA) @PC composite energetic material through a gas-solid phase in-situ azidation reaction.CA is encapsulated in PC framework, which acts as a nanoscale Faraday cage, and its excellent electrical conductivity prevents electrostatic charges from accumulating on the energetic material’s surface. The CA@PC composite energetic material has a CA content of 89.6%, and its electrostatic safety is nearly 30times that of pure CA(1.47 mJ compared to 0.05 mJ). CA@PC delivers an outstanding balance of safety and energy density compared to similar materials.

Particle Removal Mechanism of High Volume Fraction SiCp/Al Composites by Single Diamond Grit Tool

Particle removal mechanism was presented during machining particle SiC/Al composites with diamond grinding tool. The relevant removal modes and their mechanisms were discussed considering the impact and squeezing effect of diamond grit on the SiC particle. The experimental results show that the aluminum matrix has larger plastic deformation, so the aluminum mixed with the surplus SiC particles is cut from the surface. The SiC particles can be removed in multiple ways, such as broken/fractured, micro cracks, shearing and pulled out, etc. More particles removed by shearing, and less particles removed by fractured during material removal progress can produce a better machined surface.

环境温度对二维编织SiC/SiC复合材料拉伸性能的影响研究

为了研究环境温度对陶瓷基复合材料拉伸性能的影响,在室温和800℃,1000℃,1200℃惰性气体保护环境下开展了二维编织SiC/SiC复合材料的拉伸试验。采用数字图像相关技术采集了高温环境下试件的变形数据。通过光学显微镜和扫描电子显微镜拍摄了试件的断口形貌。结果表明:800~1200℃内,二维编织SiC/SiC复合材料的拉伸应力-应变响应同样具有明显的双线性特征,初始线性段的弹性模量与室温测试结果相近,高温环境下第二线性段弹性模量低于室温环境;800~1200℃惰性气体环境下材料拉伸强度较室温环境低20%左右;温度主要影响材料中纤维与基体的结合状态和SiC纤维的强度。一方面,温度越高断口纤维拔出情况越严重;另一方面,温度越高SiC纤维强度越低,二维编织SiC/SiC复合材料强度也有所下降。

Fabrication and thermal conductivity of copper matrix composites reinforced by tungsten-coated carbon nanotubes

Carbon nanotubes （CNTs） were coated by tungsten using metal organic chemical vapor deposition. Magnetic stirring was employed to disperse the W-coated CNTs （W-CNTs） in a Cu matrix, and then, the mixed powders were consolidated by spark plasma sintering. The W-CNTs obtained a uniform dispersion within the Cu matrix when the W-CNT content was less than 5.0vo1%, but high content of W-CNTs （10vol%） resulted in the presence of clusters. The W-CNT/Cu composites containing low content of W-CNTs （〈5.0vol%） exhibited a higher thermal conductivity than the sintered pure Cu, while the CNT/Cu composites exhibited no increase in thermal conductivity after the incorporation of uncoated CNTs. The W-CNT content was found to play a crucial role in determining the thermal conductivity of the W-CNT/Cu composites. The thermal conductivity of the W-CNT/Cu composites increased first and then decreased with the W-CNT content increasing. When the W-CNT content was 2.5vo1%, the W-CNT/Cu composite obtained the maximum value of thermal conductivity. The thermal resistance of the （W-CNT）-Cu interface was predicted in terms of Maxwell-Gamett effective medium approximation, and its calculated value was about 3.0× 10-9 m2.K.W-l.

Copper-Ti_3SiC_2 composite powder prepared by electroless plating under ultrasonic environment

In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature （62-65℃） with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2 The optimum procedure before plating aimed to add activated sites and the adjustment of the traditional composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 gm/h. X-ray diffraction （XRD） indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.

C/Ti/Cu interfacial reaction in SiCf/Cu composites

Continuous SiC fiber reinforced copper matrix （SiC~/Cu） composites were prepared by fiber coating method, and Ti6A14V interlayer was introduced as an interfacial modification coating to improve the interfacial bonding strength. The interfacial reaction characteristics were investigated by transmission electron microscopy （TEM）. The results show that nearly all the titanium atoms reacted with the carbon coating of SiC fibers to form two layers of TiC. Also, a thin copper layer that is sandwiched between these two layers was detected. No Ti-Cu interfacial reaction product was observed. The formation process of the interfacial reaction along with its mechanism was discussed.

FORMING PROCESS OF HOT-EXTRUDED SiCw/6061Al COMPOSITES(Ⅰ)

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SiC nanoparticles reinforced magnesium matrix composites fabricated by ultrasonic method

SiC nanoparticles reinforced magnesium matrix composites were fabricated by ultrasonic method.The AZ91 alloy and SiC nanoparticles with the average diameter of 50 nm were used as the matrix alloy and the reinforcement,respectively.The addition of nanoparticles was 0.1%,0.3%,and 0.5%(mass fraction) of the composites.The results of microstructural evaluation and mechanical properties indicate that the nanoparticles can be dispersed into magnesium alloys efficiently and uniformly with the aid of ultrasonic vibration.As compared with the matrix alloys,the grains of composites were refined and the mechanical properties of composites were improved significantly.The SEM and DSC analyses show that the SiC nanoparticles can act as the heterogeneous nucleation of α-Mg.Also,the strengthening mechanism responsible for the composites reinforced with SiC nanoparticles was discussed.

Research on the Characters of the Cutting Force in Vibration Cutting Particle Reinforced Metal Matrix Composites SiC_p/Al

In this paper, turning experiments of machining particle reinforced metal matri x composites(PRMMCs) SiC p/Al with PCD tools have been carried out. The cutting force characteristics in ultrasonic vibration turning compared with that in com mon turning were studied. Through the single factor experiments and multiple fac tor orthogonal experiments, the influences of three kinds of cutting conditions such as cutting velocity, amount of feed and cutting depth on cutting force were analyzed in detail. Meanwhile, according to the experimental data, the empirica l formula of main cutting force in ultrasonic vibration turning was conclude d. According to the test results, the cutting force is direct proportion to cutt ing depth basically according to the relation between cutting force and other fa ctors, which is similar to that of common cutting, so is the feed rate, but the influence is not so big. The influence of cutting speed is larger than that of f eed rate on cutting force because the efficient cutting time increases in vibrat ion cycle with the increase of cutting speed, which causes cutting force to incr ease. The research results indicate: (1) Ultrasonic vibration turning possesses much lower main cutting force than that in common turning when adopting smaller cutting parameters. If using larger cutting parameters, the difference will inco nspicuous. (2) There are remarkable differences of cutting force-cutting veloci ty characteristics in ultrasonic vibration turning from that in common turning m ainly because built-up edge does not emerge in ultrasonic turning unlike common turning in corresponding velocity range. (3) In ultrasonic vibration cutting, t he influence of cutting velocity on cutting force is most obvious among thre e cutting parameters and the influence of feed is smallest. So adopting lower cu tting velocity and larger cutting depth not only can reduce cutting force effect ively but also can ensure cutting efficiency. (4) The conclusions are useful in precision and super precision manufacturing thin-wall pieces.

Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 pm-size diamonds. The permeability of the preforms with different coarse-to-fine volume ratios of diamonds was investigated. The thermal conductivity of the diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical model developed by Chu. It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their surface roughness could be improved by applying bimodal diamond particle sizes.