SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between co...SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of Si Cp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the Si Cp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. Si Cp/Cu composites with a maximum thermal conductivity of 274.056 W/（m·K） and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these Si Cp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices.展开更多
The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface...The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.展开更多
Through the vacuum diffusion welding SiCp/ZL 101 aluminum with Cu interlayer,the effect of welding parameter and the thickness of Cu on the welded joint property wasinvestigated, and the optimal welding parameters wer...Through the vacuum diffusion welding SiCp/ZL 101 aluminum with Cu interlayer,the effect of welding parameter and the thickness of Cu on the welded joint property wasinvestigated, and the optimal welding parameters were put forward at the same time. Themicrostructure of joint was analyzed by means of optical-microscope, scanning electron microscope inorder to study the relationship between the macro-properties of joint and the microstructure. Theresults show that diffusion welding with Cu interlayer could be used for welding aluminum matrixcomposites SiCp/ZL 101 successfully.展开更多
基金Funded by the China Aerospace Science&Industry Corp
文摘SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of Si Cp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the Si Cp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. Si Cp/Cu composites with a maximum thermal conductivity of 274.056 W/（m·K） and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these Si Cp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices.
基金The work was financially supported by the National Natural Science Foundation of China under grant Nos. 50275076 and 50075039.
文摘The compact oxide on the surface of SiCp/Al metal matrix composite （SiCp/Al MMC） greatly depends on the property of the joint. Inlaid sputtering target was applied to etch the oxide completely on the bonding surface of SiCp/Al MMC by plasma erosion. Cu/Ni/Cu film of 5μm in thickness was prepared by magnetron sputtering method on the clean bonding surface in the same vacuum chamber, which was acted as an interlayer in transient liquid phase （TLP） bonding process. Compared with the same thickness of single Cu foil and Ni foil interlayer, the shear strength of 200 MPa was obtained using Cu/Ni/Cu film interlayer during TLP bonding, which was 89.7% that of base metal. In addition, homogenization of the bonding region and no particle segregation in interfacial region were found by analysis of the joint microstructure. Scanning electron microscopy （SEM） was used to observe the micrograph of the joint interface. The result shows that a homogenous microstructure of joint was achieved, which is similar with that of based metal.
基金This work is financially supported by the National Natural Science Foundation of China(No.50171025)
文摘Through the vacuum diffusion welding SiCp/ZL 101 aluminum with Cu interlayer,the effect of welding parameter and the thickness of Cu on the welded joint property wasinvestigated, and the optimal welding parameters were put forward at the same time. Themicrostructure of joint was analyzed by means of optical-microscope, scanning electron microscope inorder to study the relationship between the macro-properties of joint and the microstructure. Theresults show that diffusion welding with Cu interlayer could be used for welding aluminum matrixcomposites SiCp/ZL 101 successfully.
