A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module

Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint.

Vehicle-oriented ridesharing package delivery in blockchain system

Package delivery via ridesharing provides appealing benefits of lower delivery cost and efficient vehicle usage.Most existing ridesharing systems operate the matching of ridesharing in a centralized manner,which may result in the single point of failure once the controller breaks down or is under attack.To tackle such problems,our goal in this paper is to develop a blockchain-based package delivery ridesharing system,where decentralization is adopted to remove intermediaries and direct transactions between the providers and the requestors are allowed.To complete the matching process under decentralized structure,an Event-Triggered Distributed Deep Reinforcement Learning(ETDDRL)algorithm is proposed to generate/update the real-time ridesharing orders for the new coming ridesharing requests from a local view.Simulation results reveal the vast potential of the ETDDRL matching algorithm under the blockchain framework for the promotion of the ridesharing profits.Finally,we develop an application for Android-based terminals to verify the ETDDRL matching algorithm.

Multi-Component Resource Recycling from Waste Light-Emitting Diode Under Hydrothermal Condition:Plastic Package Degradation,Speciation of Nano-TiO_(2),and Environmental Impact Assessment

Light emitting diodes(LEDs)have accounted for most of the lighting market as the technology matures and costs continue to reduce.As a new type of e-waste,LED is a double-edged sword,as it contains not only precious and rare metals but also organic packaging materials.In previous studies,LED recycling focused on recovering precious and strategic metals while ignoring harmful substances such as organic packaging materials.Unlike crushing and other traditional methods,hydrothermal treatment can provide an environment-friendly process for decomposing packaging materials.This work developed a closed reaction vessel,where the degradation rate of plastic polyphthalamide(PPA)was close to 100%,with nano-TiO_(2)encapsulated in plastic PPA being efficiently recovered,while metals contained in LED were also recycled efficiently.Besides,the role of water in plastic PPA degradation that has been overlooked in current studies was explored and speculated in detail in this work.Environmental impact assessment revealed that the proposed recycling route for waste LED could significantly reduce the overall environmental impact compared to the currently published processes.Especially the developed method could reduce more than half the impact of global warming.Furthermore,this research provides a theoretical basis and a promising method for recycling other plastic-packaged e-waste devices,such as integrated circuits.

DSN-BR-Based Online Inspection Method and Application for Surface Defects of Pharmaceutical Products in Aluminum-Plastic Blister Packages

Ensuring high product quality is of paramount importance in pharmaceutical drug manufacturing,as it is subject to rigorous regulatory practices.This study presents a research focused on the development of an on-line detection method and system for identifying surface defects in pharmaceutical products packaged in aluminum-plastic blisters.Firstly,the aluminum-plastic blister packages exhibit multi-scale features and inter-class indistinction.To address this,the deep semantic network with boundary refinement(DSN-BR)model is proposed,which leverages semantic segmentation domain knowledge,to accurately segment the defects in pixel level.Additionally,a specialized image acquisition module that minimizes the impact of ambient light is established,ensuring high-quality image capture.Finally,the image acquisition module,image detection module,and data management module are designed to construct a comprehensive online surface defect detection system.To validate the effectiveness of our approach,we employ a real dataset for instance verification on the implemented system.The experimental results substantiate the outstanding performance of the DSN-BR,achieving the mean intersection over union(MIoU)of 90.5%.Furthermore,the proposed system achieves an inference speed of up to 14.12 f/s,while attaining an F1-Score of 98.25%.These results demonstrate that the system meets the actual needs of the enterprise and provides theoretical and methodological support for intelligent inspection of product surface quality.By standardizing the control process of pharmaceutical manufacturing and improving the management capability of the manufacturing process,our approach holds significant market application prospects.

Ex⁃situ Measurement of Internal Deformation in Ball Grid Array Package with Digital Volume Correlation

In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.

浅析射频SiP多物理场耦合分析关键技术

射频系统级封装(SiP)的多物理场耦合分析问题已经成为限制其可靠性提升的关键因素。当前,射频SiP的多物理场耦合分析内容主要包括模型建立和数值算法,然而,模型建立方法以及算法的适用性与选择方法是一大难点。同时随着物理场和射频SiP模型复杂度的不断提高和计算需求的不断攀升,现有部分分析方法存在计算量大、适配不佳等问题亟待优化。本文对多物理场模型的建立方法及射频SiP关键物理场单场和耦合场方程进行了总结归纳,从方法特点和适用条件两个方面对有网格与无网格四种数值算法展开阐述,同时列举了若干种多物理场耦合优化方法,从建模、求解和耦合方式的角度为实现简化建模、加速计算、优化结果等目标提供了方法和建议,可以为射频SiP的多物理场耦合分析和改进工作提供参考。

基于递归认证测试的SIP协议形式化分析

文章以形式化分析方法证明协议安全为研究目的,以具有灵活性、开放性、可伸缩性等特性的SIP协议为研究对象,运用基于串空间理论改进的递归认证测试形式化分析方法,分析了一种BAN逻辑证明安全的SIP身份认证协商协议,发现了该协议执行过程中协议格式不准确、易受中间人攻击的缺陷,并提出了针对该协议缺陷的改进方案。结果表明,文章所提出的递归认证测试形式化分析方法比BAN逻辑更适用、更有效,同时改进方案也增强了SIP身份认证协商协议的安全性。

基于SIP的应急通信调度台设计

针对各应急救援场景中通信网络复杂多样,普通调度台的指挥通信系统相互独立等问题,提出一款基于SIP的应急通信调度台的构建方案;详细介绍了调度台的各硬件模块构成,阐述了SIP软交换技术在方案中的应用。调度台支持接入数字和模拟通信网络以实现语音通信并通过有线和无线的多种宽带通信方式实现多媒体视频通信;基于SIP软交换技术,针对不同应急救援场景下的应急通信需求,提出了全融合通信概念,完成统一指挥调度。

微型组合导航SIP芯片的PDN电热协同仿真与优化

随着SIP芯片逐步小型化和集成化,导致芯片对PDN的直流压降、电流密度以及系统的温升控制要求越来越高.本文通过改变载流导体的面积来改善直流压降和电流密度过高的问题,同时针对芯片温升研究通过合理优化热过孔阵列的孔径、过孔数量以及镀铜厚度来减小热阻以达到控制芯片温升的目的.仿真结果表明,增加载流导体的面积能有效降低直流压降和电流密度,且还留有很大的裕量;而热过孔阵列的合理布局能有效控制芯片温升,从而提升了芯片的功能和可靠性.

基于SIPS理论模型的美食短视频传播城市形象策略研究

智能媒体时代,短视频为大众主动参与城市形象的建构与传播提供了新的视角和实践。美食因其独特魅力,成为城市独有的特殊符号和城市形象传播的重要载体。以短视频垂直细分领域下的美食短视频作为切入点,解析美食短视频在城市形象传播上的重要性,厘清其在传播城市形象过程中存在的问题,结合SIPS模式,分别从共鸣、确认、参与、共享四个阶段,提出优化美食短视频传播城市形象的策略。

Multi-Objective Prediction and Optimization of Vehicle Acoustic Package Based on ResNet Neural Network

Vehicle interior noise has emerged as a crucial assessment criterion for automotive NVH(Noise,Vibration,and Harshness).When analyzing the NVH performance of the vehicle body,the traditional SEA(Statistical Energy Analysis)simulation technology is usually limited by the accuracy of the material parameters obtained during the acoustic package modeling and the limitations of the application conditions.In order to effectively solve these shortcomings,based on the analysis of the vehicle noise transmission path,a multi-level objective decomposition architecture of the interior noise at the driver’s right ear is established.Combined with the data-driven method,the ResNet neural network model is introduced.The stacked residual blocks avoid the problem of gradient dis-appearance caused by the increasing network level of the traditional CNN network,thus establishing a higher-precision prediction model.This method alleviates the inherent limitations of traditional SEA simulation design,and enhances the prediction performance of the ResNet model by dynamically adjusting the learning rate.Finally,the proposed method is applied to a specific vehicle model and verified.The results show that the proposed meth-od has significant advantages in prediction accuracy and robustness.

Bisphenol A (BPA) Contamination in Whole Milk Marketed in Different Packages

Bisphenol A (BPA), an important endocrine disruptor, is used in the manufacturing of various materials, including food packaging. Ingestion of contaminated foodstuffs is, in fact, the most relevant form of exposure to this substance. However, scarce data on the presence of this contaminant in milk, or whether different types of food packaging influence food contamination are available in Brazil. This study, therefore, aimed to evaluate the BPA contamination of whole milk (fluid and powder) samples packaged in different types of packaging (Tetra Pak?;PET: Poly (ethylene terephthalate;Metallic can (epoxy resin);Polyethylene (PE) and poly (vinylidene chloride) (PVDC);Laminated Film - Metallized Polyester-Polyethylene and glass) and marketed metropolitan region of Rio de Janeiro, Brazil. An analytical method for the BPA determination in milk was optimized for both fluid (pasteurized and ultra-high temperature) and powdered milk samples. A modified QuEChERS method was applied, and BPA determinations were conducted by ultra-performance liquid chromatography coupled with sequential mass spectrometry (HPLC-MS/MS). The validated method was then applied to 51 milk samples, where BPA was detected in five samples (9.8%) and quantified in two (3.8%).

基于硅基堆叠SIP技术的超宽带T/R组件

传统的超宽带T/R组件采用的是两维砖块式结构,体积和重量已不适应目前小型化、低剖面、易共形的相控阵天线要求。文中提出的基于硅基堆叠系统级封装(SIP)技术,将四通道的射频芯片高度集成在硅基介质基板上,将多层介质基板厚金压合,实现多层堆叠的三维封装。通过采用芯片多功能集成技术和超宽带射频信号的垂直互连技术,设计出三维堆叠的四通道超宽带T/R组件。T/R组件带宽为6 GHz~18 GHz,单通道的发射功率优于23 dBm,接收增益优于20 dB,可实现6位数控衰减及6位数控移相,尺寸仅有13.0 mm×13.0 mm×3.4 mm。该技术可以实现多通道超宽带T/R组件的SIP封装,有利于工程应用。

基于SIP技术的固态硬盘电路设计

存储系统小型化、高性能需求与日俱增,为此设计了一款基于SiP技术的固态硬盘电路,用于验证存储系统SiP电路的可行性。该SiP电路内部以SSD控制模块为核心处理单元,集成了用于数据存储的NAND颗粒、用于固件存储的SPI Flash以及电源管理等元器件。在搭建的软硬件平台上进行底层ATA指令验证以及与传统分离式存储系统的对比性能测试,证明了应用SiP技术的存储系统具备高性能、小型化、低功耗等诸多优势,为后续SiP存储系统的设计和验证奠定了一定的技术基础。

基于SIPS模型的短视频二次传播策略研究

伴随着新媒体的崛起,信息的传播方式变得更加多元化。信息接收者与信息传递者之间的界限变得更为模糊,由共享与转发行为形成的二次传播也在信息传递中占据了重要地位。本文对二次传播形成的影响因素进行研究,在内容上首先对研究背景、相关概念、二次传播对国内短视频发展的影响做了简要叙述,其次通过将SIPS模型带入广告视频的传播中,合理运用SIPS模型的传播特征、兴趣和共鸣的内在规律、双向沟通和及时性响应理论,为短视频的二次传播提供新的思路。

X波段三维异构片式收发SiP模块设计

采用硅基三维异构集成技术,在极小的体积内,将多个微波单片集成电路(MMIC)和无源功分网络一体化集成,实现了一种X波段4通道片式收发系统级封装(SiP)。该SiP由2个体硅堆叠封装(PoP)而成,不同封装通过球栅阵列(BGA)方式互连,单层封装的内部腔体上下面均贴装芯片,封装内部采用硅通孔技术(TSV)实现垂直互连,SiP尺寸为14 mm×14 mm×3.2 mm。测试结果表明,在8~12 GHz内,SIP 4个通道的发射饱和输出功率≥30.5 dBm,接收增益≥24.5 dB,噪声系数≤3 dB,接收输入P-1≥-26 dBm,同时具备6位数控移相和6位数控衰减功能,重量约1 g,可广泛用于微波收发系统。

基于ATE的可编程SiP器件测试

分析了SiP器件内部数字芯片FPGA和模拟芯片ADC/DAC的主要电气参数及性能参数,明确了SiP器件的测试内容和方法。使用Altium Designer软件设计SiP6117M信号处理器专用测试板,结合测试需求、测试流程以及芯片具体参数提出设计目标,完成原理图设计、PCB设计、制板和调试工作。基于Ultra Flex测试机台和设计完成的测试板搭建SiP6117M模块的测试平台,运用Verilog语言编写FPGA配置程序及测试程序,并通过JTAG接口对FPGA进行配置。开发Ultra Flex测试程序对测试过程进行控制,实现了对SiP器件主要功能和性能参数的测试。

基于SIPS模型的读者参与图书馆文献资源建设策略优化研究

为优化图书馆荐购服务,提升图书馆服务质量,满足读者多元化需求,实现图书馆的高质量发展,分析读者参与图书馆资源建设的现状与问题,利用在图书馆领域已有实践应用的用户消费模型SIPS模型为研究工具,提出了激发读者共鸣、确认荐购品质、推动读者参与、读者口碑分享的读者参与图书馆文献资源建设的优化策略。

基于SIPS模型的服装品牌短视频营销体系构建

为探究服装品牌短视频营销中缺乏系统的矩阵规划问题,提出了基于SIPS模型的营销策略。针对服装品牌短视频营销所呈现的不足,将其营销策略划分为内容、形式、引流、传播四个维度。对每个维度进行了分析,归纳总结了服装品牌短视频营销在四个维度中适用的方法,并结合SIPS模型调整四个维度的逻辑关系与布局,得到一个完整的营销闭环。解决了服装品牌在短视频营销布局中矩阵混乱的问题,实现了清晰、高效的营销体系构建。

基于SIPS模型的景德镇手工制瓷非遗技艺营销传播策略研究

近年来,为推动传统文化的复兴与繁荣,国家不断加大对非遗的宣传力度。在此背景下,景德镇借由兴趣电商平台,实现了陶瓷销售的场景创新,从用户的视角出发,开始注重引导大众触摸景德镇手工制瓷非遗技艺的历史传统和文化内涵。对此,本文旨在打造可提升景德镇手工制瓷非遗技艺的差异化与分众化程度的营销策略,基于SIPS模型和景德镇手工制瓷非遗技艺的特点,从共鸣、确认、参与、共享和扩散四个维度探索景德镇手工制瓷非遗技艺营销传播策略,不仅可以促进景德镇陶瓷制作工艺的宣传和普及,还对推动陶瓷工艺的传承和发展具有重要现实意义。