A comprehensive review of radiation effects on solder alloys and solder joints

In the realm of military and defence applications, exposure to radiation significantly challenges the performance and reliability of solder alloys and joints in electronic systems. This comprehensive review examines radiation-induced effects on solder alloys and solder joints in terms of microstructure and mechanical properties. In this paper, we evaluate the existing literature, including experimental studies and fundamental theory, to provide a comprehensive overview of the behavior of solder materials under radiation. A review of the literature highlights key mechanisms that contribute to radiation-induced changes in the microstructure, such as the formation of intermetallic compounds, grain growth,micro-voids and micro-cracks. Radiation is explored as a factor influencing solder alloy hardness,strength, fatigue and ductility. Moreover, the review addresses the challenges and limitations inherent in studying the effects of radiation on solder materials and offers recommendations for future research. It is crucial to understand radiation-induced effects on solder performance to design robust and radiationresistant electronic systems. A review of radiation effects on solder materials and their applications in electronics serves as a valuable resource for researchers, engineers, and practitioners in that field.

A review of extreme condition effects on solder joint reliability:Understanding failure mechanisms

Solder joint,crucial component in electronic systems,face significant challenges when exposed to extreme conditions during applications.The solder joint reliability involving microstructure and mechanical properties will be affected by extreme conditions.Understanding the behaviour of solder joints under extreme conditions is vital to determine the durability and reliability of solder joint.This review paper aims to comprehensively explore the underlying failure mechanism affecting solder joint reliability under extreme conditions.This study covers an in-depth analysis of effect extreme temperature,mechanical stress,and radiation conditions towards solder joint.Impact of each condition to the microstructure including solder matrix and intermetallic compound layer,and mechanical properties such as fatigue,shear strength,creep,and hardness was thoroughly discussed.The failure mechanisms were illustrated in graphical diagrams to ensure clarity and understanding.Furthermore,the paper highlighted mitigation strategies that enhancing solder joint reliability under challenging operating conditions.The findings offer valuable guidance for researchers,engineers,and practitioners involved in electronics,engineering,and related fields,fostering advancements in solder joint reliability and performance.

Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate

Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.

Effect of Mo and ZrO_(2)nanoparticles addition on interfacial properties and shear strength of Sn58Bi/Cu solder joint

The influence of Mo and ZrO_(2)nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated.The interfacial microstructures of Sn58Bi/Cu,Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints were analysed using a scanning electron microscope(SEM)coupled with energy dispersive X-ray(EDX)and the X-ray diffraction(XRD).Intermetallic compounds(IMCs)of MoSn_(2)are detected in the Sn58Bi+Mo/Cu solder joint,while SnZr,Zr_(5)Sn_(3),ZrCu and ZrSn_(2)are detected in Sn58Bi+ZrO_(2)/Cu solder joint.IMC layers for both composite solders comprise of Cu_(6)Sn_(5) and Cu_(3)Sn.The SEM images of these layers were used to measure the IMC layer’s thickness.The average IMC layer’s thickness is 1.4431μm for Sn58Bi+Mo/Cu and 0.9112μm for Sn58Bi+ZrO_(2)/Cu solder joints.Shear strength of the solder joints was investigated via the single shear lap test method.The average maximum load and shear stress of the Sn58Bi+Mo/Cu and Sn58Bi+ZrO_(2)/Cu solder joints are increased by 33%and 69%,respectively,as compared to those of the Sn58Bi/Cu solder joint.By comparing both composite solder joints,the latter prevails better as adding smaller sized ZrO_(2)nanoparticles improves the interfacial properties granting a stronger solder joint.

Effect of Sb content on properties of Sn-Bi solders

The effect of Sb content on the properties of Sn-Bi solders was studied. The nonequilibrium melting behaviors of a series of Sn-Bi-Sb solders were examined by differential scanning calorimetry （DSC）. The spreading test was carried out to characterize the wettability of Sn-Bi-Sb solders on Cu substrate. The mechanical properties of the solders/Cu joints were evaluated. The results show that the ternary alloy solders contain eutectic structure resulting from quasi-peritetic reaction. With the increase of Sb content, the amount of the eutectic structure increases. At a heating rate of 5 ℃/min, Sn-Bi-Sb alloys exhibit a higher melting point and a wider melting range. A small amount of Sb has an impact on the wettability of Sn-Bi solders. The reaction layers form during spreading process. Sb is detected in the reaction layer while Bi is not detected. The total thickness of reaction layer between solder and Cu increases with the increase of the Sb content. The shear strength of the Sn-Bi-Sb solders increases as the Sb content increases.

Effects of Sn element on microstructure and properties of Zn-Cu-Bi-Sn high-temperature solder

The microstructures and properties of the Zn-Cu-Bi-Sn(ZCBS) high-temperature solders with various Sn contents were studied using differential scanning calorimetry(DSC),scanning electron microscopy(SEM) and X-ray diffraction(XRD).The results indicate that the increase of Sn content can both decrease the melting temperature and melting range of ZCBS solders and it can also effectively improve the wettability on Cu substrate.The shear strength of solder joints reaches a maximum value with the Sn addition of 5%(mass fraction),which is attributed to the formation of refined β-Sn and primary ε-CuZn_5 phases in η-Zn matrix.However,when the content of Sn exceeds 5%,the shear strength decreases due to the formation of coarse β-Sn phase,which is net-shaped presented at the grain boundary.

EFFECTS OF RARE EARTH ELEMENT LANTHANUM ON MICROSTRUCTURE AND PROPERTIES OF Ag-Cu-Ti SOLDER ALLOY

The effects of rare earth Lanthanum on the microstructure, the physical property and the microhardness of Ag-Cu-Ti solder alloy are studied. Experimental results indicate that the addition of Lanthanum can evidently improve the wettability and the microhardness of Ag-Cu-Ti solder alloy. Analysis results show that the increase in microhardness is related to the refining and uniform distribution of the intermetallic compounds. Proper content of Lanthanum added in Ag-Cu-Ti alloy solder can be controlled below 0.5% in mass percent.

Interfacial characteristics and microstructural evolution of Sn-6.5Zn solder/Cu substrate joints during aging

The influence of isothermal aging at 150 °C on the microstructural characteristics and microhardness of the Sn-6.5Zn solder/Cu joint was studied. The mechanisms for the formation and evolution of intermetallic compound （IMC） at the interface of the Sn-6.5Zn/Cu joint were also analyzed. The results indicate that a continuous layer consisting of CuZn and Cu5Zn8 IMCs is formed in the interface zone. As the aging time prolongs, the thickness of the IMC layer first increases and then decreases, and the continuous and compactable layer is destroyed due to the decomposition of the Cu-Zn IMC layer. A discontinuous layer of Cu6Sn5 IMC is present within the Cu substrate near the decomposed region. The interface becomes rough and evident voids form after aging. The microhardness of the interface increases owing to the application of aging.

Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in wafer level chip scale package

To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.

Influence of rapid solidification on Sn-8Zn-3Bi alloy characteristics and microstructural evolution of solder/Cu joints during elevated temperature aging

The effects of rapid solidification on the microstructure and melting behavior of the Sn-8Zn-3Bi alloy were studied. The evolution of the microstructuraI characteristics of the solder/Cu joint after an isothermal aging at 150 ℃ was also analyzed to evaluate the interconnect reliability. Results showed that the Bi in Sn-8Zn-3Bi solder alloy completely dissolved in the Sn matrix with a dendritic structure after rapid solidification. Compared with as-solidified Sn-8Zn-3Bi solder alloy, the melting temperature of the rapid solidified alloy rose to close to that of the Sn-Zn eutectic alloy due to the extreme dissolution of Bi in Sn matrix. Meanwhile, the adverse effect on melting behavior due to Bi addition was decreased significantly. The interfacial intermetallic compound （IMC） layer of the solder/Cu joint was more compact and uniform. Rapid solidification process obviously depressed the formation and growth of the interfacial IMC during the high-temperature aging and improved the high-temperature stability of the Sn-8Zn-3Bi solder/Cu joint.

Cu-Ni/Solder/Ni-Cu互连结构的电迁移

采用Cu-Ni/Solder/Ni-Cu互连结构,在加载的电流密度为0.4×104A/cm2的条件下,得到了界面阴极处金属原子的电迁移.数值模拟揭示了其原因是由于凸点互连结构的特殊性,电子流在流经凸点时会发生流向改变进而形成电流聚集,此处的电流密度超过电迁移的门槛值,从而诱发电迁移.运用高对流系数的热传导方法降低了互连焊点的实际温度,在电迁移的扩展阶段显著减小了高温引起的原子热迁移对电迁移的干扰;因此电迁移力是原子迁移的主要驱动力.在电迁移的快速失效阶段,原子的迁移是热迁移和电迁移共同作用的结果:电迁移力驱动阴极处原子的迁移,造成局部区域的快速温升,从而加剧此处原子的热迁移.

Solder Charge连接器连锡故障解决方案

Solder charge连接器(SBGA)为高速多引脚互联器件,应用于多种通讯产品的子母板间高速互联。在SMT生产过程中,其故障率一直高于同类焊球型封装BGA器件,主要故障表现为相邻两排引脚短路,且故障率表现与来料批次强相关,通过多种工艺方案不能完全解决连锡问题。通过分析Solder charge连接器结构和材料,找到器件连锡的根因,提出了此类器件的设计和焊接改善方案,并进行了实际生产验证,为业界Solder charge连接器(SBGA)类器件焊接提供了可行的解决方案。

Effects of Zn addition on mechanical properties of eutectic Sn-58Bi solder during liquid-state aging

Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermetallic compounds(IMCs) in Sn-58Bi-0.7Zn solder sample were both effectively suppressed. With the addition of 0.7% Zn, ultimate tensile strengths(UTSs) of the Sn-58 Bi solder slabs were respectively increased by 6.05% and 5.50% after reflow soldering and liquid-state aging, and those of the Cu/Sn-58Bi/Cu solder joints were also increased by 21.51% and 29.27%, respectively. The increase in strengthening effect of Cu/Sn-58Bi-x Zn/Cu solder joints could be attributed to the fracture surface which was changed from the Cu/IMC interface to the IMC/solder interface due to the finer Bi grain. Nanoindentation results revealed that the creep behavior of Sn-58Bi-0.7Zn solder was significantly improved compared with that of the eutectic Sn-58 Bi solder after reflow soldering and liquid-state aging.

Microstructure evolution and mechanical properties of ultrasonic-assisted soldering joints of 2024 aluminum alloys

Ultrasonic-assisted soldering of 2024 aluminum alloys using a filler metal of Zn-5Al alloy was investigated at the temperature of 400 ℃,which is lower than the solution strengthening temperature of Al-Cu alloys.The ultrasonic vibration with power of 200 W and vibration amplitude of 15 μm at the frequency of 21 kHz was applied on the top samples.The ultrasonic vibration promoted the dissolution of Al elements in the base metal.The reduction of volume fraction of the eutectic phases in the bonds was investigated by increasing ultrasonic vibration time.As the ultrasonic vibration time increased from 3 s to 30 s,the volume fraction of the eutectic phase in the bonds decreased from 12.9% to 0.9%,and the shear strength of the joints was up to 149-153 MPa,increased by 20%.The improvement of the mechanical properties of joints was discussed based on the modulus and hardness of the phases in the bonds and the fracture of the joints.

Electrochemical corrosion of Sn-0.75Cu solder joints in NaCl solution

The corrosion behaviors of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl（mass fraction） solution were studied by potentiodynamic polarization test and leaching measurement.The polarization curves indicated that the corrosion rate of Sn-0.75Cu solder was lower than that of Sn-0.75Cu/Cu joint.The morphology observation and phase composition analysis on the corroded product at each interesting potential suggested that Sn3O（OH）2Cl2 formed on the surface of Sn-0.75Cu solder at active dissolution stage.As the potential increased from active/passive transition stage,all the surface of Sn-0.75Cu solder was covered by the Sn3O（OH）2Cl2 and some pits appeared after the polarization test.Compared to the Sn-0.75Cu solder alloy,much more Sn3O（OH）2Cl2 formed at active dissolution stage and the pits with bigger size were observed after polarization test for the Sn-0.75Cu/Cu solder joints.The leaching test confirmed that the faster electrochemical corrosion rate resulted in the larger amount of Sn released from the Sn-0.75Cu/Cu solder joints.

Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics

Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem. On the basis of CALPHAD (Calculation of Phase Diagrams) method we can easily calculate properties such as the liquidus projection, isothermal and vertical sectional diagrams and phase fraction in multi-component system including Ag, Bi, Cu, In, Sb, Sn, Zn and Pb elements. In addition, other related information such as the surface tension, viscosity of the liquid phase and solidification simulation can also be obtained. DICTRA (Diffusion Controlled Transformation) software was used to simulate the interfacial reactions between substrate and Pb-free solders, which can easily give the information on the growth of intermetallic compounds and moving speed of interface between substrate and solders etc.

基于Protel的Solder Masks与Paste Masks辨析

在不同的Protel 99 SE教材中,对于Solder Masks和Paste Masks的理解存在两种截然相反的意见,而且大多数教材对于Masks层没有给出详尽的解释,这些弊端都给初学者带来较大的困惑。通过对印制电路板掩膜层制造工艺的详细描述、单层显示演示以及Protel 99 SE帮助文件的诠注全面而充分地论证了Solder Masks和Paste Masks的实质含意。认为两者的实质是"阻焊膜与防锡膏膜",没有"互补关系"。

Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad

Soldering experiments with Sn-3.5Ag-0.5Cu lead-free solder on Au/Ni/Cu pad were carried out by means of diode-laser and IR reflow soldering methods respectively.The influence of different heating methods as well as output power of diode-laser on shear force of micro-joints was studied and the relationship between the shear force and microstructures of micro-joints was analyzed.The results indicate that the formation of intermetallic compound Ag3Sn is the key factor to affect the shear force and the fine eutectic network structures of micro-joints as well as the dispersion morphology of fine compound Ag3Sn,in which eutectic network band is responsible for the improvement of the shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder.With the increases of output power of diode-laser,the shear force and the microstructures change obviously.The eutectic network structures of micro-joints soldered with diode-laser soldering method are more homogeneous and the grains of Ag3Sn compounds are finer in the range of near optimal output power than those soldered with IR reflow soldering method,so the shear force is also higher than that using IR reflow soldering method.When the output power value of diode-laser is about 41.0 W,the shear force exhibits the highest value that is 70% higher than that using IR reflow soldering method.

Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloy

This article explores tile effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn- 9Zn-xP solder alloys were determined by means of weight gaining, and secondary ion mass spectrometry was used to analyze the oxygen content. The role and mechanism of P in the solder alloys were also discussed. It is found that the addition of P can significantly improve the wettability of the solder alloys. Incorporating P into Sn-9Zn solder alloy obviously decreases the oxygen content and enhances the oxidation and corrosion resistance. Microstructure observations show that an appropriate amount of P can greatly refine coarse rod-like Zn-rich phases in Sn-gZn solder alloy.

Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints

Composite solders were prepared by mechanically dispersing different volumes of nano-sized Ag particles into the Sn-0.7Cu eutectic solder. The effects of Ag particle addition on the microstructure of Sn-0.7Cu solder joints were investigated. Besides, the effects of isothermal aging on the microstructural evolution in the interfacial intermetallic compound （IMC） layer of the Sn-0.7Cu solder and the composite solder reinforced with 1vol% Ag particles were analyzed, respectively. Experimental results indicate that the growth rate of the interfacial IMC layer in the Ag particles reinforced composite solder joint is much lower than that in the Sn-0.7Cu solder joint during isothermal aging. The Ag particles reinforced composite solder joint exhibits much lower layer-growth coefficient for the growth of the IMC layer than the corresponding solder joint.