The synergistic effect of total ionizing dose(TID) and single event gate rupture(SEGR) in SiC power metal–oxide–semiconductor field effect transistors(MOSFETs) is investigated via simulation. The device is found to ...The synergistic effect of total ionizing dose(TID) and single event gate rupture(SEGR) in SiC power metal–oxide–semiconductor field effect transistors(MOSFETs) is investigated via simulation. The device is found to be more sensitive to SEGR with TID increasing, especially at higher temperature. The microscopic mechanism is revealed to be the increased trapped charges induced by TID and subsequent enhancement of electric field intensity inside the oxide layer.展开更多
The dynamics of the excess carriers generated by incident heavy ions are considered in both SiO2 and Si substrate. Influences of the initial radius of the charge track, surface potential decrease, external electric fi...The dynamics of the excess carriers generated by incident heavy ions are considered in both SiO2 and Si substrate. Influences of the initial radius of the charge track, surface potential decrease, external electric field, and the LET value of the incident ion on internal electric field buildup are analyzed separately. Considering the mechanisms of recombination, impact ionization, and bandgap tunneling, models are verified by using published experimental data. Moreover, the scaling effects of single-event gate rupture in thin gate oxides are studied, with the feature size of the MOS device down to 90 nm. The walue of the total electric field decreases rapidly along with the decrease of oxide thickness in the first period （1 2 nm to 3.3 nm）, and then increases a little when the gate oxide becomes thinner and thinner （3.3 nm to 1.8 nm）.展开更多
As integrated circuits scale down in size, a single high-energy ion strike often affects multiple adjacent logic nodes.The so-called single-event transient（SET） pulse quenching induced by single-event charge sharing...As integrated circuits scale down in size, a single high-energy ion strike often affects multiple adjacent logic nodes.The so-called single-event transient（SET） pulse quenching induced by single-event charge sharing collection has been widely studied. In this paper, SET pulse quenching enhancement is found in dummy gate isolated adjacent logic nodes compared with that isolated by the common shallow trench isolation（STI）. The physical mechanism is studied in depth and this isolation technique is explored for SET mitigation in combinational standard cells. Three-dimensional（3D） technology computer-aided design simulation（TCAD） results show that this technique can achieve efficient SET mitigation.展开更多
针对空间应用,开展SiC MOSFET单粒子效应试验研究。在加速器上用重离子辐照1200 V SiC MOSFET,离子线性能量传输(LET)在0.26~118 MeV·cm^(2)/mg之间,辐照中被试器件加50~600 V静态漏源偏置电压、栅源短接,实时测量电特性,进行辐照...针对空间应用,开展SiC MOSFET单粒子效应试验研究。在加速器上用重离子辐照1200 V SiC MOSFET,离子线性能量传输(LET)在0.26~118 MeV·cm^(2)/mg之间,辐照中被试器件加50~600 V静态漏源偏置电压、栅源短接,实时测量电特性,进行辐照后栅应力(PIGS)测试。试验结果发现,50~100 V偏置电压下,离子引起瞬态电流,PIGS测试栅失效。分析认为离子引起栅氧化物潜在损伤,PIGS测试过程中,潜在损伤进一步退化导致栅失效。氧化物潜在损伤不仅与辐照偏置电压有关,还与入射离子LET和注量有关。PIGS测试需要的栅应力时间与潜在损伤程度有关,可超过300 s。并给出了电荷累积损伤模型。模型进行SiC MOSFET单粒子效应评估时,应考虑离子引起栅氧化物潜在损伤的影响,需根据轨道和任务周期确定试验离子注量,根据应用情况确定辐照偏置电压,并评估确定PIGS测试栅应力时间。展开更多
Experiments and simulation studies on 283 MeV I ion induced single event effects of silicon carbide(SiC) metal–oxide–semiconductor field-effect transistors(MOSFETs) were carried out. When the cumulative irradiation ...Experiments and simulation studies on 283 MeV I ion induced single event effects of silicon carbide(SiC) metal–oxide–semiconductor field-effect transistors(MOSFETs) were carried out. When the cumulative irradiation fluence of the SiC MOSFET reached 5×10^(6)ion·cm^(-2), the drain–gate channel current increased under 200 V drain voltage, the drain–gate channel current and the drain–source channel current increased under 350 V drain voltage. The device occurred single event burnout under 800 V drain voltage, resulting in a complete loss of breakdown voltage. Combined with emission microscope, scanning electron microscope and focused ion beam analysis, the device with increased drain–gate channel current and drain–source channel current was found to have drain–gate channel current leakage point and local source metal melt, and the device with single event burnout was found to have local melting of its gate, source, epitaxial layer and substrate. Combining with Monte Carlo simulation and TCAD electrothermal simulation, it was found that the initial area of single event burnout might occur at the source–gate corner or the substrate–epitaxial interface, electric field and current density both affected the lattice temperature peak. The excessive lattice temperature during the irradiation process appeared at the local source contact, which led to the drain–source channel damage. And the excessive electric field appeared in the gate oxide layer, resulting in drain–gate channel damage.展开更多
基金Project supported by the National Natural Science Foundation of China(Grant No.12004329)Open Project of State Key Laboratory of Intense Pulsed Radiation Simulation and Effect(Grant No.SKLIPR2115)+1 种基金Postgraduate Research and Practice Innovation Program of Jiangsu Province(Grant No.SJCX22_1704)Innovative Science and Technology Platform Project of Cooperation between Yangzhou City and Yangzhou University,China(Grant Nos.YZ202026301 and YZ202026306)。
文摘The synergistic effect of total ionizing dose(TID) and single event gate rupture(SEGR) in SiC power metal–oxide–semiconductor field effect transistors(MOSFETs) is investigated via simulation. The device is found to be more sensitive to SEGR with TID increasing, especially at higher temperature. The microscopic mechanism is revealed to be the increased trapped charges induced by TID and subsequent enhancement of electric field intensity inside the oxide layer.
文摘The dynamics of the excess carriers generated by incident heavy ions are considered in both SiO2 and Si substrate. Influences of the initial radius of the charge track, surface potential decrease, external electric field, and the LET value of the incident ion on internal electric field buildup are analyzed separately. Considering the mechanisms of recombination, impact ionization, and bandgap tunneling, models are verified by using published experimental data. Moreover, the scaling effects of single-event gate rupture in thin gate oxides are studied, with the feature size of the MOS device down to 90 nm. The walue of the total electric field decreases rapidly along with the decrease of oxide thickness in the first period （1 2 nm to 3.3 nm）, and then increases a little when the gate oxide becomes thinner and thinner （3.3 nm to 1.8 nm）.
基金Project supported by the National Natural Science Foundation of China(Grant No.61376109)the Opening Project of National Key Laboratory of Science and Technology on Reliability Physics and Application Technology of Electrical Component,China(Grant No.ZHD201202)
文摘As integrated circuits scale down in size, a single high-energy ion strike often affects multiple adjacent logic nodes.The so-called single-event transient（SET） pulse quenching induced by single-event charge sharing collection has been widely studied. In this paper, SET pulse quenching enhancement is found in dummy gate isolated adjacent logic nodes compared with that isolated by the common shallow trench isolation（STI）. The physical mechanism is studied in depth and this isolation technique is explored for SET mitigation in combinational standard cells. Three-dimensional（3D） technology computer-aided design simulation（TCAD） results show that this technique can achieve efficient SET mitigation.
文摘针对空间应用,开展SiC MOSFET单粒子效应试验研究。在加速器上用重离子辐照1200 V SiC MOSFET,离子线性能量传输(LET)在0.26~118 MeV·cm^(2)/mg之间,辐照中被试器件加50~600 V静态漏源偏置电压、栅源短接,实时测量电特性,进行辐照后栅应力(PIGS)测试。试验结果发现,50~100 V偏置电压下,离子引起瞬态电流,PIGS测试栅失效。分析认为离子引起栅氧化物潜在损伤,PIGS测试过程中,潜在损伤进一步退化导致栅失效。氧化物潜在损伤不仅与辐照偏置电压有关,还与入射离子LET和注量有关。PIGS测试需要的栅应力时间与潜在损伤程度有关,可超过300 s。并给出了电荷累积损伤模型。模型进行SiC MOSFET单粒子效应评估时,应考虑离子引起栅氧化物潜在损伤的影响,需根据轨道和任务周期确定试验离子注量,根据应用情况确定辐照偏置电压,并评估确定PIGS测试栅应力时间。
基金supported by the National Natural Science Foundation of China (Grant No. 12075065)。
文摘Experiments and simulation studies on 283 MeV I ion induced single event effects of silicon carbide(SiC) metal–oxide–semiconductor field-effect transistors(MOSFETs) were carried out. When the cumulative irradiation fluence of the SiC MOSFET reached 5×10^(6)ion·cm^(-2), the drain–gate channel current increased under 200 V drain voltage, the drain–gate channel current and the drain–source channel current increased under 350 V drain voltage. The device occurred single event burnout under 800 V drain voltage, resulting in a complete loss of breakdown voltage. Combined with emission microscope, scanning electron microscope and focused ion beam analysis, the device with increased drain–gate channel current and drain–source channel current was found to have drain–gate channel current leakage point and local source metal melt, and the device with single event burnout was found to have local melting of its gate, source, epitaxial layer and substrate. Combining with Monte Carlo simulation and TCAD electrothermal simulation, it was found that the initial area of single event burnout might occur at the source–gate corner or the substrate–epitaxial interface, electric field and current density both affected the lattice temperature peak. The excessive lattice temperature during the irradiation process appeared at the local source contact, which led to the drain–source channel damage. And the excessive electric field appeared in the gate oxide layer, resulting in drain–gate channel damage.
文摘随着现场可编程门阵列(Field Programmable Gate Array,FPGA)在现代航天领域的广泛应用,FPGA的单粒子效应(Single Event Effect,SEE)逐渐成为人们的研究热点。选择Microsemi公司Flash型FPGA分布范围最广的可编程逻辑资源VersaTile和对单粒子效应敏感的嵌入式RAM单元RAM Block作为单粒子效应的主要测试对象,提出了两种不同的单粒子效应测试方法;然后,使用仿真工具ModelSim对提出的两种电路的可行性进行了仿真验证;最后,基于自主研发的实验测试平台,在兰州重离子加速器(Heavy Ion Research Facility in Lanzhou,HIRFL)上使用86Kr束进行了束流辐照实验,实验结果表明,测试方法合理有效。
