Hillock Sn whiskers in Sn0.3Ag0.7Cu solder are investigated in 20 seconds in corrosive climate(95% methanol and 5% nitric acid),and the growth mechanism of hillock Sn whiskers is studied.The results indicate that hill...Hillock Sn whiskers in Sn0.3Ag0.7Cu solder are investigated in 20 seconds in corrosive climate(95% methanol and 5% nitric acid),and the growth mechanism of hillock Sn whiskers is studied.The results indicate that hillock Sn whiskers are formed near the interface of Sn0.3Ag0.7Cu/Cu solder joints,and small corrosion pits provide conceive sites for Sn whiskers. Moreover,compressive stress induced by IMC reaction and oxidation for the whisker growth may be suggested as the driving force.展开更多
In this paper,the phenomena of Mg_(2)Sn-induced Sn whisker growth were explored on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints after aging treatment.The in-situ observation and thermal analysis confi...In this paper,the phenomena of Mg_(2)Sn-induced Sn whisker growth were explored on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints after aging treatment.The in-situ observation and thermal analysis confirmed that the formation and the corrosion of Mg_(2)Sn nanoparticles were the dominant reason of Sn whisker growth.The Mg_(2)Sn accumulation at the grain boundaries would pin the dislocation slip and affect the continuity of whisker growth,and the boundary angle would thus play a decisive role in the growth shape of Sn whiskers due to the pining effect of Mg_(2)Sn.This study might be conducive to elucidating the growth behavior of Sn whiskers and provide the exploration strategy to further improve the bonding strength of Mg/Sn/Mg ultrasonic-assisted soldering joints.展开更多
The character of Sn-Bi plating chips,such as the effect of whisker preventing, solder ability,temperature cycle(T/C) test and thermal humidity bias(THB) test result was introduced.The research result shows that the Sn...The character of Sn-Bi plating chips,such as the effect of whisker preventing, solder ability,temperature cycle(T/C) test and thermal humidity bias(THB) test result was introduced.The research result shows that the Sn-Bi plating chips have good effect of prevent whisker from growing,these chips can pass the T/C test and THB test.展开更多
基金Supported by the National Natural Science Foundation of China(No.51475220)the State Foundation of Laboratory of Advanced Brazing Filler Metals & Technology(Zhengzhou Research Institute of Mechanical Engineering)(No.SKLABFMT-2015-03)High Level Talent Plan of Jiangsu Normal University(No.YQ2015002)
文摘Hillock Sn whiskers in Sn0.3Ag0.7Cu solder are investigated in 20 seconds in corrosive climate(95% methanol and 5% nitric acid),and the growth mechanism of hillock Sn whiskers is studied.The results indicate that hillock Sn whiskers are formed near the interface of Sn0.3Ag0.7Cu/Cu solder joints,and small corrosion pits provide conceive sites for Sn whiskers. Moreover,compressive stress induced by IMC reaction and oxidation for the whisker growth may be suggested as the driving force.
基金supported by Science and Technology Planning Project of Shenzhen (Grant No. JCYJ201908 09161213154)Xiamen Youth Innovation Fund Project (Grant No. 3502Z20206026)Academy-level Project of Xiamen City University (Grant No.KYKJ2019-4)。
文摘In this paper,the phenomena of Mg_(2)Sn-induced Sn whisker growth were explored on the surfaces of Mg/Sn/Mg ultrasonic-assisted soldering joints after aging treatment.The in-situ observation and thermal analysis confirmed that the formation and the corrosion of Mg_(2)Sn nanoparticles were the dominant reason of Sn whisker growth.The Mg_(2)Sn accumulation at the grain boundaries would pin the dislocation slip and affect the continuity of whisker growth,and the boundary angle would thus play a decisive role in the growth shape of Sn whiskers due to the pining effect of Mg_(2)Sn.This study might be conducive to elucidating the growth behavior of Sn whiskers and provide the exploration strategy to further improve the bonding strength of Mg/Sn/Mg ultrasonic-assisted soldering joints.
文摘The character of Sn-Bi plating chips,such as the effect of whisker preventing, solder ability,temperature cycle(T/C) test and thermal humidity bias(THB) test result was introduced.The research result shows that the Sn-Bi plating chips have good effect of prevent whisker from growing,these chips can pass the T/C test and THB test.
