Hollow parts of high accuracy and high strength can be produced by forming methods using liquid media. Hydroforming of tubes has reached a high standard for small parts (volume some 1000 cm3) and is further developed ...Hollow parts of high accuracy and high strength can be produced by forming methods using liquid media. Hydroforming of tubes has reached a high standard for small parts (volume some 1000 cm3) and is further developed for larger parts (volume some 10.000 cm3). Processes for hydraulic sheet metal forming are sometimes used for small parts from single sheets These pro-cesses are currently under intensive investigation, which is also true for the processing of double layered sheets Single sheets can be formed using membranes which separate the workpiece and the liquid. This results in interesting possibilities for a part and process integration in one step The forming performance of aluminum alloys can be enhanced by using a heated liquid media when forming without membranes.展开更多
We review the state of the art and our perspectives on silicon and hybrid silicon photonic devices for optical interconnects in datacenters. After a brief discussion of the key requirements for intra-datacenter optica...We review the state of the art and our perspectives on silicon and hybrid silicon photonic devices for optical interconnects in datacenters. After a brief discussion of the key requirements for intra-datacenter optical interconnects, we propose a wavelength-division-multiplexing(WDM)-based optical interconnect for intra-datacenter applications. Following our proposed interconnects configuration, the bulk of the review emphasizes recent developments concerning on-chip hybrid silicon microlasers and WDM transmitters, and silicon photonic switch fabrics for intra-datacenters. For hybrid silicon microlasers and WDM transmitters, we outline the remaining challenges and key issues toward realizing low power consumption, direct modulation, and integration of multiwavelength microlaser arrays. For silicon photonic switch fabrics, we review various topologies and configurations of high-port-count N-by-N switch fabrics using Mach–Zehnder interferometers and microring resonators as switch elements, and discuss their prospects toward practical implementations with active reconfiguration.For the microring-based switch fabrics, we review recent developments of active stabilization schemes at the subsystem level. Last, we outline several large challenges and problems for silicon and hybrid silicon photonics to meet for intra-datacenter applications and propose potential solutions.展开更多
基金The author gratefu1ly acknowledges Dipl.-Ing.R.Breede and Dipl.-Ing.T.Prange for the preparation ofthe results.
文摘Hollow parts of high accuracy and high strength can be produced by forming methods using liquid media. Hydroforming of tubes has reached a high standard for small parts (volume some 1000 cm3) and is further developed for larger parts (volume some 10.000 cm3). Processes for hydraulic sheet metal forming are sometimes used for small parts from single sheets These pro-cesses are currently under intensive investigation, which is also true for the processing of double layered sheets Single sheets can be formed using membranes which separate the workpiece and the liquid. This results in interesting possibilities for a part and process integration in one step The forming performance of aluminum alloys can be enhanced by using a heated liquid media when forming without membranes.
基金financial support from the National Science Foundation of China (NSFC)the Research Grants Council (RGC) of the Hong Kong Special Administrative Region (HKSAR) under project N_HKUST606/10+5 种基金the State Key Laboratory on Integrated Optoelectronics, ChinaOpen Fund of the State Key Laboratory on Integrated Optoelectronics under project IOSKL2013KF04the Innovation and Technology Fund (ITF) of the HKSAR under project ITS/023/14 and ITS/087/13the Proof-of-Concept Fund (PCF) of The Hong Kong University of Science and Technology (HKUST) under project no. PCF007.12/13the General Research Fund (GRF) of the HKSAR under project no. 16208114postdoctoral fellowship support from the Hong Kong Scholars Program 2013
文摘We review the state of the art and our perspectives on silicon and hybrid silicon photonic devices for optical interconnects in datacenters. After a brief discussion of the key requirements for intra-datacenter optical interconnects, we propose a wavelength-division-multiplexing(WDM)-based optical interconnect for intra-datacenter applications. Following our proposed interconnects configuration, the bulk of the review emphasizes recent developments concerning on-chip hybrid silicon microlasers and WDM transmitters, and silicon photonic switch fabrics for intra-datacenters. For hybrid silicon microlasers and WDM transmitters, we outline the remaining challenges and key issues toward realizing low power consumption, direct modulation, and integration of multiwavelength microlaser arrays. For silicon photonic switch fabrics, we review various topologies and configurations of high-port-count N-by-N switch fabrics using Mach–Zehnder interferometers and microring resonators as switch elements, and discuss their prospects toward practical implementations with active reconfiguration.For the microring-based switch fabrics, we review recent developments of active stabilization schemes at the subsystem level. Last, we outline several large challenges and problems for silicon and hybrid silicon photonics to meet for intra-datacenter applications and propose potential solutions.
