期刊文献+
共找到2篇文章
< 1 >
每页显示 20 50 100
A 12-Channel,30Gb/s,0.18μm CMOS Front-End Amplifier for Parallel Optic-Fiber Receivers
1
作者 李智群 薛兆丰 +1 位作者 王志功 冯军 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2006年第1期47-53,共7页
This paper presents a 12-channel,30Gb/s front-end amplifier realized in standard 0.18μm CMOS technology for parallel optlc-fiber receivers. In order to overcome the problem of inadequate bandwidth caused by the large... This paper presents a 12-channel,30Gb/s front-end amplifier realized in standard 0.18μm CMOS technology for parallel optlc-fiber receivers. In order to overcome the problem of inadequate bandwidth caused by the large parasitical capacitor of CMOS photo-detectors,a regulated-cascode structure and noise optimization are used in the design of the transimpedance amplifier. The experimental results indicate that, with a parasitical capacitance of 2pF,a single channel is able to work at bite rates of up to 2.5Gb/s,and a clear eye diagram is obtained with a 0. 8mVpp input. Furthermore, an isolation structure combined with a p^+ guard.ring (PGR), an n^+ guard-ring (NGR),and a deep-n-well (DNW) for parallel amplifier is also presented. Taking this combined structure, the crosstalk and the substrate noise coupling have been effectively reduced. Compared with the isolation of PGR or PGR + NGR,the measured results show that the isolation degree of this structure is improved by 29.2 and 8. ldB at 1GHz,and by 8. 1 and 2. 5dB at 2GHz,respectively. With a 1.8V supply,each channel of the front-end amplifier consumes a DC power of 85mW,and the total power consumption of 12 channels is about 1W. 展开更多
关键词 parallel optic-fiber receiver front-end amplifier regulated-cascode substrate noise coupling ISOLATION
下载PDF
Some Tools to Model Ground or Supply Bounces Induced in and out of Heterogeneous Integrated Circuits
2
作者 Christian Gontrand Olivier Valorge +4 位作者 Rabah Dahmanil Fengyuan Sun Francis Calmon Jacques Verdier Paul Dautriche 《Computer Technology and Application》 2011年第10期788-800,共13页
Electrical ground looks simple on a schematic; unfortunately, the actual performance of a circuit is dictated by its layout (and by its printed-circuit-board). When the ground node moves, system performance suffers ... Electrical ground looks simple on a schematic; unfortunately, the actual performance of a circuit is dictated by its layout (and by its printed-circuit-board). When the ground node moves, system performance suffers and the system radiates electromagnetic interferences. But the understanding of the physics of ground noise can provide an intuitive sense for reducing the problem. Ground bounce can produce transients with amplitudes of volts; most often changing magnetic flux is the cause; in this work, the authors use a Finite-Difference Time-Domain to begin to understand such phenomena. Additionally, predicting substrate cross-talks in mixed-signal circuits has become a critical issue to preserve signal integrity in future integrated systems. Phenomena that involve parasitic signal propagation into the substrate are discussed. A simple methodology to predict the substrate cross-talk and some associated tools are presented. Finally, the authors indicate a stochastic method which could grasp both outer or inner RF (Radio-Frequency) radiations and substrate parasites. 展开更多
关键词 Electromagnetism 3D (three-dimensional) integration noise TSV (through silicon vias) ground or supply bounce mixed analog-digital integrated circuits substrate noise stochastic methodology.
下载PDF
上一页 1 下一页 到第
使用帮助 返回顶部