The effect of oxygen partial pressure (Po2) during the channel layer deposition on bias stability of amorphous indium-gallium-zinc oxide (a-IGZO) thin film transistors (TFTs) is investigated. As Po2 increases fr...The effect of oxygen partial pressure (Po2) during the channel layer deposition on bias stability of amorphous indium-gallium-zinc oxide (a-IGZO) thin film transistors (TFTs) is investigated. As Po2 increases from 10% to 30%, it is found that the device shows enhanced bias stress stability with significantly reduced threshold voltage drift under positive gate bias stress. Based on the x-ray photoelectron spectroscopy measurement, the concentration of oxygen vacancies (Or) within the a-IGZO layer is suppressed by increasing Po2. Meanwhile, the low-frequency noise analysis indicates that the average trap density near the channel/dielectric interface continuously drops with increasing Po2. Therefore, the improved interface quality with increasing Po2 during the channel layer deposition can be attributed to the reduction of interface Ov-related defects, which agrees with the enhanced bias stress stability of the a-IGZO TFTs.展开更多
The suitability of indium gallium zinc oxide(IGZO) thin-film transistors(TFT) for implementation of active matrix display of organic light emitting diodes(AMOLED) compensation pixel circuits is addressed in this paper...The suitability of indium gallium zinc oxide(IGZO) thin-film transistors(TFT) for implementation of active matrix display of organic light emitting diodes(AMOLED) compensation pixel circuits is addressed in this paper. In particular, the impact of mobility on compensating performance for the implementation in AMOLED pixel circuits is investigated. Details of the effective mobility modeling using the power law of gate-to-source voltage are provided, and parameters are extracted according to the measured current-to-voltage data of IGZO TFT samples. The investigated AMOLED pixel circuit consists of 4 switching TFTs, 1 driving TFT, and 1 capacitor. A "source-follower" structure is used for the threshold voltage extraction of the driving transistor. A new timing diagram is proposed; thus the current error of the pixel circuit is almost independent of the effective mobility. But, to improve the precision of the threshold voltage extraction of the driving transistor, the mobility is required to be greater than5 cm^2 V^(-1) s^(-1). On the other hand, the optimized storage capacitance is reversely proportional to the effective mobility. Thus, the layout area of the pixel circuit can be decreased from 100 × 100 to 100 × 68 μm2, with the effective mobility increased from 10 to50 cm^2 V^(-1) s^(-1). Therefore, IGZO TFT is a good alternative backplane technology for AMOLED displays, and a higher effective mobility is preferred for high compensation performance and compact layout.展开更多
Based on the technology of low temperature poly silicon thin film transistors (poly-Si-TFTs), a novel p-type TFT AMOLED panel with self-scanned driving circuit is introduced in this paper. A shift register formed with...Based on the technology of low temperature poly silicon thin film transistors (poly-Si-TFTs), a novel p-type TFT AMOLED panel with self-scanned driving circuit is introduced in this paper. A shift register formed with novel p-type TFTs is pro- posed to realize the gate driver. A flip-latch cooperated with the shift register is designed to conduct the data writing. In order to verify the validity of the proposed design, the circuits are simulated with SILVACO TCAD tools, using the MODEL in which the parameters of LTPS TFTs were extracted from the LTPS TFTs made in our lab. The simulation results indicate that the circuit can fulfill the driving function.展开更多
介绍了高速视频信号低压差分信号(low voltage differential signaling,LVDS)在薄膜晶体管(thin film transistor,TFT)液晶显示屏(liquid crystal display,LCD)模组中受到的影响因素及改善方向。基于车载显示屏中的印刷电路板(printed c...介绍了高速视频信号低压差分信号(low voltage differential signaling,LVDS)在薄膜晶体管(thin film transistor,TFT)液晶显示屏(liquid crystal display,LCD)模组中受到的影响因素及改善方向。基于车载显示屏中的印刷电路板(printed circuit board,PCB)及柔性电路板(flexible printed circuit,FPC)信号传输线进行阻抗匹配,分析LVDS在PCB到FPC跨介质传输后,FPC长度对LVDS造成失真畸变,其原因为寄生电容变化导致容性反射,进而引起信号非单调性。在FPC长度较长且电磁兼容性(electro magnetic compatibility,EMC)需求较高的情况下,将LVDS从L型走线改为T型走线,可改善LVDS眼图的质量。展开更多
A p-type low-temperature poly-Si thin film transistors(LTPS TFTs) integrated gate driver using 2 nonoverlapped clocks is proposed.This gate driver features charge-sharing structure to turn off buffer TFT and suppres...A p-type low-temperature poly-Si thin film transistors(LTPS TFTs) integrated gate driver using 2 nonoverlapped clocks is proposed.This gate driver features charge-sharing structure to turn off buffer TFT and suppresses voltage feed-through effects.It is analyzed that the conventional gate driver suffers from waveform distortions due to voltage uncertainty of internal nodes for the initial period.The proposed charge-sharing structure also helps to suppress the unexpected pulses during the initialization phases.The proposed gate driver shows a simple circuit,as only 6 TFTs and 1 capacitor are used for single-stage,and the buffer TFT is used for both pulling-down and pulling-up of output electrode.Feasibility of the proposed gate driver is proven through detailed analyses.Investigations show that voltage bootrapping can be maintained once the bootrapping capacitance is larger than0.8 pF,and pulse of gate driver outputs can be reduced to 5μs.The proposed gate driver can still function properly with positive V(TH)shift within 0.4 V and negative V(TH) shift within-1.2 V and it is robust and promising for high-resolution display.展开更多
As growing applications demand higher driving currents of oxide semiconductor thin-film transistors(TFTs),severe instabilities and even hard breakdown under high-current stress(HCS)become critical challenges.In this w...As growing applications demand higher driving currents of oxide semiconductor thin-film transistors(TFTs),severe instabilities and even hard breakdown under high-current stress(HCS)become critical challenges.In this work,the triggering voltage of HCS-induced self-heating(SH)degradation is defined in the output characteristics of amorphous indium-galliumzinc oxide(a-IGZO)TFTs,and used to quantitatively evaluate the thermal generation process of channel donor defects.The fluorinated a-IGZO(a-IGZO:F)was adopted to effectively retard the triggering of the self-heating(SH)effect,and was supposed to originate from the less population of initial deep-state defects and a slower rate of thermal defect transition in a-IGZO:F.The proposed scheme noticeably enhances the high-current applications of oxide TFTs.展开更多
随着人们进入信息时代,半导体技术快速发展,对薄膜晶体管(Thin film transistor,简称TFT)的性能要求逐渐提高.IGZO由于具有较高的载流子迁移率、相对良好的均匀性等优势而受到广泛关注;而传统的真空技术制备薄膜晶体管,因制备工艺复杂...随着人们进入信息时代,半导体技术快速发展,对薄膜晶体管(Thin film transistor,简称TFT)的性能要求逐渐提高.IGZO由于具有较高的载流子迁移率、相对良好的均匀性等优势而受到广泛关注;而传统的真空技术制备薄膜晶体管,因制备工艺复杂、制备成本高等问题,在快速发展的信息时代逐渐显露出局限性,本文采用制备工艺更为简单的溶液法在Si/SiO_(2)基底上制备IGZO有源层薄膜,并测试不同退火温度(450℃,550℃,650℃)条件下对薄膜性能的影响.结果表明,适当提高退火温度可以有效改善IGZO-TFT器件的电学性能,本实验测试得出:当溶液法制备薄膜在550℃退火温度下退火器件性能最优,溶液法制备的器件电流开关闭达到105,器件性能相对比较稳定.展开更多
Since the first report of amorphous In–Ga–Zn–O based thin film transistors,interest in oxide semiconductors has grown.They offer high mobility,low off-current,low process temperature,and wide flexibility for compos...Since the first report of amorphous In–Ga–Zn–O based thin film transistors,interest in oxide semiconductors has grown.They offer high mobility,low off-current,low process temperature,and wide flexibility for compositions and processes.Unfortunately,depositing oxide semiconductors using conventional processes like physical vapor deposition leads to problematic issues,especially for high-resolution displays and highly integrated memory devices.Conventional approaches have limited process flexibility and poor conformality on structured surfaces.Atomic layer deposition(ALD)is an advanced technique which can provide conformal,thickness-controlled,and high-quality thin film deposition.Accordingly,studies on ALD based oxide semiconductors have dramatically increased recently.Even so,the relationships between the film properties of ALD-oxide semiconductors and the main variables associated with deposition are still poorly understood,as are many issues related to applications.In this review,to introduce ALD-oxide semiconductors,we provide:(a)a brief summary of the history and importance of ALD-based oxide semiconductors in industry,(b)a discussion of the benefits of ALD for oxide semiconductor deposition(in-situ composition control in vertical distribution/vertical structure engineering/chemical reaction and film properties/insulator and interface engineering),and(c)an explanation of the challenging issues of scaling oxide semiconductors and ALD for industrial applications.This review provides valuable perspectives for researchers who have interest in semiconductor materials and electronic device applications,and the reasons ALD is important to applications of oxide semiconductors.展开更多
基金Supported by the National Basic Research Program of China under Grant Nos 2010CB327504,2011CB922100 and2011CB301900the National Natural Science Foundation of China under Grant Nos 11104130 and 61322112+2 种基金the Natural Science Foundation of Jiangsu Province under Grant Nos BK2011556 and BK2011050the Priority Academic Program Development of Jiangsu Higher Education Institutionsand the NUPTSF Grant Nos NY213069 and NY214028
文摘The effect of oxygen partial pressure (Po2) during the channel layer deposition on bias stability of amorphous indium-gallium-zinc oxide (a-IGZO) thin film transistors (TFTs) is investigated. As Po2 increases from 10% to 30%, it is found that the device shows enhanced bias stress stability with significantly reduced threshold voltage drift under positive gate bias stress. Based on the x-ray photoelectron spectroscopy measurement, the concentration of oxygen vacancies (Or) within the a-IGZO layer is suppressed by increasing Po2. Meanwhile, the low-frequency noise analysis indicates that the average trap density near the channel/dielectric interface continuously drops with increasing Po2. Therefore, the improved interface quality with increasing Po2 during the channel layer deposition can be attributed to the reduction of interface Ov-related defects, which agrees with the enhanced bias stress stability of the a-IGZO TFTs.
基金supported by National Natural Science Foundation of China(60676044,61006057)Electronics Engineering of College of Heilongjiang Province(DZZD20100013)
基金supported by National Natural Science Foundation of China (No. 61404002)the Shenzhen Municipal Scientific Program (No. JCYJ20150626111117384)
文摘The suitability of indium gallium zinc oxide(IGZO) thin-film transistors(TFT) for implementation of active matrix display of organic light emitting diodes(AMOLED) compensation pixel circuits is addressed in this paper. In particular, the impact of mobility on compensating performance for the implementation in AMOLED pixel circuits is investigated. Details of the effective mobility modeling using the power law of gate-to-source voltage are provided, and parameters are extracted according to the measured current-to-voltage data of IGZO TFT samples. The investigated AMOLED pixel circuit consists of 4 switching TFTs, 1 driving TFT, and 1 capacitor. A "source-follower" structure is used for the threshold voltage extraction of the driving transistor. A new timing diagram is proposed; thus the current error of the pixel circuit is almost independent of the effective mobility. But, to improve the precision of the threshold voltage extraction of the driving transistor, the mobility is required to be greater than5 cm^2 V^(-1) s^(-1). On the other hand, the optimized storage capacitance is reversely proportional to the effective mobility. Thus, the layout area of the pixel circuit can be decreased from 100 × 100 to 100 × 68 μm2, with the effective mobility increased from 10 to50 cm^2 V^(-1) s^(-1). Therefore, IGZO TFT is a good alternative backplane technology for AMOLED displays, and a higher effective mobility is preferred for high compensation performance and compact layout.
基金supported by the National Natural ScienceFoundation of China(Grant No.60437030)
文摘Based on the technology of low temperature poly silicon thin film transistors (poly-Si-TFTs), a novel p-type TFT AMOLED panel with self-scanned driving circuit is introduced in this paper. A shift register formed with novel p-type TFTs is pro- posed to realize the gate driver. A flip-latch cooperated with the shift register is designed to conduct the data writing. In order to verify the validity of the proposed design, the circuits are simulated with SILVACO TCAD tools, using the MODEL in which the parameters of LTPS TFTs were extracted from the LTPS TFTs made in our lab. The simulation results indicate that the circuit can fulfill the driving function.
文摘介绍了高速视频信号低压差分信号(low voltage differential signaling,LVDS)在薄膜晶体管(thin film transistor,TFT)液晶显示屏(liquid crystal display,LCD)模组中受到的影响因素及改善方向。基于车载显示屏中的印刷电路板(printed circuit board,PCB)及柔性电路板(flexible printed circuit,FPC)信号传输线进行阻抗匹配,分析LVDS在PCB到FPC跨介质传输后,FPC长度对LVDS造成失真畸变,其原因为寄生电容变化导致容性反射,进而引起信号非单调性。在FPC长度较长且电磁兼容性(electro magnetic compatibility,EMC)需求较高的情况下,将LVDS从L型走线改为T型走线,可改善LVDS眼图的质量。
基金Project supported by the Science and Technology Project of Hunan Province,China(No.2015JC3401)
文摘A p-type low-temperature poly-Si thin film transistors(LTPS TFTs) integrated gate driver using 2 nonoverlapped clocks is proposed.This gate driver features charge-sharing structure to turn off buffer TFT and suppresses voltage feed-through effects.It is analyzed that the conventional gate driver suffers from waveform distortions due to voltage uncertainty of internal nodes for the initial period.The proposed charge-sharing structure also helps to suppress the unexpected pulses during the initialization phases.The proposed gate driver shows a simple circuit,as only 6 TFTs and 1 capacitor are used for single-stage,and the buffer TFT is used for both pulling-down and pulling-up of output electrode.Feasibility of the proposed gate driver is proven through detailed analyses.Investigations show that voltage bootrapping can be maintained once the bootrapping capacitance is larger than0.8 pF,and pulse of gate driver outputs can be reduced to 5μs.The proposed gate driver can still function properly with positive V(TH)shift within 0.4 V and negative V(TH) shift within-1.2 V and it is robust and promising for high-resolution display.
基金supported by National Key Research and Development Program under Grant No.2022YFB3607100Shenzhen Research Programs under Grant Nos.JCYJ20200109140601691,JCYJ20190808154803565,SGDX20201103095607022,SGDX20211123145404006,and GXWD20201231165807007-20200807025846001。
文摘As growing applications demand higher driving currents of oxide semiconductor thin-film transistors(TFTs),severe instabilities and even hard breakdown under high-current stress(HCS)become critical challenges.In this work,the triggering voltage of HCS-induced self-heating(SH)degradation is defined in the output characteristics of amorphous indium-galliumzinc oxide(a-IGZO)TFTs,and used to quantitatively evaluate the thermal generation process of channel donor defects.The fluorinated a-IGZO(a-IGZO:F)was adopted to effectively retard the triggering of the self-heating(SH)effect,and was supposed to originate from the less population of initial deep-state defects and a slower rate of thermal defect transition in a-IGZO:F.The proposed scheme noticeably enhances the high-current applications of oxide TFTs.
文摘随着人们进入信息时代,半导体技术快速发展,对薄膜晶体管(Thin film transistor,简称TFT)的性能要求逐渐提高.IGZO由于具有较高的载流子迁移率、相对良好的均匀性等优势而受到广泛关注;而传统的真空技术制备薄膜晶体管,因制备工艺复杂、制备成本高等问题,在快速发展的信息时代逐渐显露出局限性,本文采用制备工艺更为简单的溶液法在Si/SiO_(2)基底上制备IGZO有源层薄膜,并测试不同退火温度(450℃,550℃,650℃)条件下对薄膜性能的影响.结果表明,适当提高退火温度可以有效改善IGZO-TFT器件的电学性能,本实验测试得出:当溶液法制备薄膜在550℃退火温度下退火器件性能最优,溶液法制备的器件电流开关闭达到105,器件性能相对比较稳定.
基金supported by the National Research Foundation of Korea (NRF) funded by the Ministry of Science and ICT (NRF-2020M3H4A3081867)the industry technology R&D program (20006400) funded by the Ministry of Trade,Industry and Energy (MOTIE, Korea)+2 种基金the project number 20010402 funded by the Ministry of Trade,Industry and Energy (MOTIE, Korea)the Industry Technology R&D program (#20010371) funded by the Ministry of Trade,Industry and Energy (MOTIE, Republic of Korea)the Technology Innovation Program (20017382) funded By the Ministryof Trade,Industry and Energy (MOTIE, Korea)
文摘Since the first report of amorphous In–Ga–Zn–O based thin film transistors,interest in oxide semiconductors has grown.They offer high mobility,low off-current,low process temperature,and wide flexibility for compositions and processes.Unfortunately,depositing oxide semiconductors using conventional processes like physical vapor deposition leads to problematic issues,especially for high-resolution displays and highly integrated memory devices.Conventional approaches have limited process flexibility and poor conformality on structured surfaces.Atomic layer deposition(ALD)is an advanced technique which can provide conformal,thickness-controlled,and high-quality thin film deposition.Accordingly,studies on ALD based oxide semiconductors have dramatically increased recently.Even so,the relationships between the film properties of ALD-oxide semiconductors and the main variables associated with deposition are still poorly understood,as are many issues related to applications.In this review,to introduce ALD-oxide semiconductors,we provide:(a)a brief summary of the history and importance of ALD-based oxide semiconductors in industry,(b)a discussion of the benefits of ALD for oxide semiconductor deposition(in-situ composition control in vertical distribution/vertical structure engineering/chemical reaction and film properties/insulator and interface engineering),and(c)an explanation of the challenging issues of scaling oxide semiconductors and ALD for industrial applications.This review provides valuable perspectives for researchers who have interest in semiconductor materials and electronic device applications,and the reasons ALD is important to applications of oxide semiconductors.