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Application of Fuzzy Control to Improve Flow Balance of Multi-Cavity Hot Runner System 被引量:2
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作者 Chung-Ching Huang Shin-Min Hung +5 位作者 Wen-Wang Wu Yi-Jen Yang His-Jung Chang Jui-Wen Chang Chih-Husiung Chung Shen-Houng Chen 《Journal of Mechanics Engineering and Automation》 2012年第12期726-741,共16页
In this study, we propose a new temperature compensation control strategy for a multi-cavity hot runner injection molding system, At first, the melt filling time of each cavity can be measured by installing temperatur... In this study, we propose a new temperature compensation control strategy for a multi-cavity hot runner injection molding system, At first, the melt filling time of each cavity can be measured by installing temperature sensors on the position around end filling area, and filling time difference between the various cavities can be calculated. Then the melt temperature of each hot nozzle can be adjusted automatically by a control strategy established based on the Fuzzy Theory and a program compiled with LABVIEW software. Temperature changes the melt mobility, so the adjustment of temperature can equalize the filling time of the melt in each cavity, which can reduced the mass deviation between each cavity and make product properties of each cavity consistent. The conclusion of the experiment is as follows: For this contact lens box of a four-cavity Hot Runner mold, by applying hot runner temperature compensation control system, time difference can be reduced from 0.05 s to 0.01 s at each cavity, and the mass Standard deviation of the four cavity can be improved from 0.006 to 0.002. The ratio of imbalance can be reduced from 20% to 4%. Hence, the hot runner temperature compensation control system has significant feasibility and high potential in improving melt flow balance of multi-cavity molding application. 展开更多
关键词 Fuzzy control MULTI-CAVITY flow balance hot runner molding technology temperature compensation.
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Temperature characteristics research of SOI pressure sensor based on asymmetric base region transistor 被引量:5
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作者 Xiaofeng Zhao Dandan Li +1 位作者 Yang Yu Dianzhong Wen 《Journal of Semiconductors》 EI CAS CSCD 2017年第7期89-92,共4页
Based on the asymmetric base region transistor, a pressure sensor with temperature compensation circuit is proposed in this paper. The pressure sensitive structure of the proposed sensor is constructed by a C-type sil... Based on the asymmetric base region transistor, a pressure sensor with temperature compensation circuit is proposed in this paper. The pressure sensitive structure of the proposed sensor is constructed by a C-type silicon cup and a Wheatstone bridge with four piezoresistors(R_1, R_2, R_3 and R_4/locating on the edge of a square silicon membrane. The chip was designed and fabricated on a silicon on insulator(SOI) wafer by micro electromechanical system(MEMS) technology and bipolar transistor process. When the supply voltage is 5.0 V, the corresponding temperature coefficient of the sensitivity(TCS) for the sensor before and after temperature compensation are -1862 and -1067 ppm/℃, respectively. Through varying the ratio of the base region resistances r_1 and r_2, the TCS for the sensor with the compensation circuit is -127 ppm/℃. It is possible to use this compensation circuit to improve the temperature characteristics of the pressure sensor. 展开更多
关键词 SOI pressure sensor asymmetric base region transistor temperature compensation temperature coefficient of the sensitivity MEMS technology
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