High-density polyethylene/carbon black foaming conductive composites were prepared from acetylene black（ACEY） and super conductive carbon black（HG-1P） as conductive filler, low-density polyethylene（LDPE） as the ...High-density polyethylene/carbon black foaming conductive composites were prepared from acetylene black（ACEY） and super conductive carbon black（HG-1P） as conductive filler, low-density polyethylene（LDPE） as the second component, ethylene-vinyl acetate（EVA） and ethylene propylene rubber（EPR） as the third component, azobisformamide（AC） as foamer, and dicumyl peroxide（DCP） as cross-linker. The structure and resistivity-temperature behavior of high-density polyethylene（HDPE）/CB foaming conductive composites were investigated. Influences of carbon black, LDPE, EVA, EPR, AC, and DCP on the foaming performance and resistivity-temperature behavior of HDPE/CB foaming conductive composites were also studied. The results reveal that HDPE/CB foaming conductive composite exhibits better switching characteristic; ACET-filled HDPE foaming conductive composite displays better positive temperature coefficient（PYC） effect; whereas super conductive carbon black（HG-1P）-filled HDPE foaming conductive composite shows better negative temperature coefficient（NTC） effect.展开更多
A programmable high precision bandgap reference is presented, which can meet the accuracy requirements for all technology corners while a traditional bandgap reference cannot.This design uses SMIC 0.18 μm 1P4M CMOS t...A programmable high precision bandgap reference is presented, which can meet the accuracy requirements for all technology corners while a traditional bandgap reference cannot.This design uses SMIC 0.18 μm 1P4M CMOS technology.The theoretically achievable temperature coefficient is close to 0.69 ppm/°C over the whole temperature range.展开更多
文摘High-density polyethylene/carbon black foaming conductive composites were prepared from acetylene black（ACEY） and super conductive carbon black（HG-1P） as conductive filler, low-density polyethylene（LDPE） as the second component, ethylene-vinyl acetate（EVA） and ethylene propylene rubber（EPR） as the third component, azobisformamide（AC） as foamer, and dicumyl peroxide（DCP） as cross-linker. The structure and resistivity-temperature behavior of high-density polyethylene（HDPE）/CB foaming conductive composites were investigated. Influences of carbon black, LDPE, EVA, EPR, AC, and DCP on the foaming performance and resistivity-temperature behavior of HDPE/CB foaming conductive composites were also studied. The results reveal that HDPE/CB foaming conductive composite exhibits better switching characteristic; ACET-filled HDPE foaming conductive composite displays better positive temperature coefficient（PYC） effect; whereas super conductive carbon black（HG-1P）-filled HDPE foaming conductive composite shows better negative temperature coefficient（NTC） effect.
基金supported by the National Natural Science Foundation of China(No.60576025)the Keystone of Natural Science Foundation of Tianjin (No. 07JCZDJC10400)
文摘A programmable high precision bandgap reference is presented, which can meet the accuracy requirements for all technology corners while a traditional bandgap reference cannot.This design uses SMIC 0.18 μm 1P4M CMOS technology.The theoretically achievable temperature coefficient is close to 0.69 ppm/°C over the whole temperature range.
